HK87679A - A process for attaching a lead member to a semi-conductor device and product thereof - Google Patents

A process for attaching a lead member to a semi-conductor device and product thereof

Info

Publication number
HK87679A
HK87679A HK876/79A HK87679A HK87679A HK 87679 A HK87679 A HK 87679A HK 876/79 A HK876/79 A HK 876/79A HK 87679 A HK87679 A HK 87679A HK 87679 A HK87679 A HK 87679A
Authority
HK
Hong Kong
Prior art keywords
lead member
attaching
semi
product
contact member
Prior art date
Application number
HK876/79A
Other languages
English (en)
Inventor
M B Goldberg
W B Voorhis
Original Assignee
Gen Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23840939&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK87679(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp
Publication of HK87679A publication Critical patent/HK87679A/xx

Links

Classifications

    • H10W72/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • H10W70/24—
    • H10W72/20—
    • H10W72/30—
    • H10W74/131—
    • H10W74/137—
    • H10W76/138—
    • H10W72/073—
    • H10W72/07336—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Wire Bonding (AREA)
HK876/79A 1974-04-24 1979-12-27 A process for attaching a lead member to a semi-conductor device and product thereof HK87679A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/463,678 US3930306A (en) 1974-04-24 1974-04-24 Process for attaching a lead member to a semiconductor device

Publications (1)

Publication Number Publication Date
HK87679A true HK87679A (en) 1980-01-04

Family

ID=23840939

Family Applications (1)

Application Number Title Priority Date Filing Date
HK876/79A HK87679A (en) 1974-04-24 1979-12-27 A process for attaching a lead member to a semi-conductor device and product thereof

Country Status (8)

Country Link
US (1) US3930306A (enExample)
JP (1) JPS50147285A (enExample)
CA (1) CA1008566A (enExample)
DE (1) DE2518305C2 (enExample)
FR (1) FR2321193A1 (enExample)
GB (1) GB1465010A (enExample)
HK (1) HK87679A (enExample)
IT (1) IT1029419B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
US4059837A (en) * 1975-04-07 1977-11-22 Hitachi, Ltd. Glass-moulded type semiconductor device
JPS54107455A (en) * 1978-02-10 1979-08-23 Hitachi Ltd Self-melting brazing material
FR2549292B1 (fr) * 1983-07-12 1986-10-10 Silicium Semiconducteur Ssc Procede de montage de diode
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US6642078B2 (en) * 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
US7216796B2 (en) * 2004-05-10 2007-05-15 General Electric, Company Crevice corrosion-resistant liquid-cooled armature bar clip-to-strand connection and related method
US7414226B2 (en) * 2004-11-19 2008-08-19 General Electric Company Movable heating method and system having fixed heating source for brazing stator bars
US7219827B2 (en) * 2004-11-19 2007-05-22 General Electric Company Braze end isolation layer for generator armature winding bar and method for applying the isolation layer
CN105149813A (zh) * 2015-09-30 2015-12-16 杭州华光焊接新材料股份有限公司 一种含微量铟的低银铜磷钎料
CN107170727A (zh) * 2017-06-02 2017-09-15 朝阳无线电元件有限责任公司 一种i类冶金键合二极管设计与制造技术
CN108581269A (zh) * 2018-05-02 2018-09-28 重庆金荣金属有限公司 一种铜基中温复合焊料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3321828A (en) * 1962-01-02 1967-05-30 Gen Electric Aluminum brazing
DE1207769B (de) * 1962-02-13 1965-12-23 Telefunken Patent Ternaeres Hartlot auf Silber-Kupfer-Basis
DE1439160A1 (de) * 1962-07-26 1969-10-23 Siemens Ag Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor
DE1614653C3 (de) * 1967-11-15 1979-06-21 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiteranordnung hoher Strombelastbarkeit
US3844029A (en) * 1972-02-02 1974-10-29 Trw Inc High power double-slug diode package

Also Published As

Publication number Publication date
GB1465010A (en) 1977-02-16
JPS50147285A (enExample) 1975-11-26
IT1029419B (it) 1979-03-10
DE2518305A1 (de) 1975-11-06
FR2321193A1 (fr) 1977-03-11
CA1008566A (en) 1977-04-12
US3930306A (en) 1976-01-06
FR2321193B1 (enExample) 1980-05-09
AU7968175A (en) 1976-10-07
DE2518305C2 (de) 1984-10-18

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