IN2015DN01249A - - Google Patents
Info
- Publication number
- IN2015DN01249A IN2015DN01249A IN1249DEN2015A IN2015DN01249A IN 2015DN01249 A IN2015DN01249 A IN 2015DN01249A IN 1249DEN2015 A IN1249DEN2015 A IN 1249DEN2015A IN 2015DN01249 A IN2015DN01249 A IN 2015DN01249A
- Authority
- IN
- India
- Prior art keywords
- fluorine containing
- percent
- sensitive adhesive
- pressure sensitive
- weight
- Prior art date
Links
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 4
- 229910052731 fluorine Inorganic materials 0.000 abstract 4
- 239000011737 fluorine Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract 2
- 229920001971 elastomer Polymers 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229920002725 thermoplastic elastomer Polymers 0.000 abstract 2
- 239000012466 permeate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09J127/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/16—Homopolymers or copolymers or vinylidene fluoride
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Adhesive Tapes (AREA)
- Electroluminescent Light Sources (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012215136 | 2012-08-24 | ||
| DE102012219877.6A DE102012219877A1 (de) | 2012-08-24 | 2012-10-30 | Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung |
| PCT/EP2013/064145 WO2014029545A1 (de) | 2012-08-24 | 2013-07-04 | Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2015DN01249A true IN2015DN01249A (ko) | 2015-06-26 |
Family
ID=50069636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN1249DEN2015 IN2015DN01249A (ko) | 2012-08-24 | 2015-02-16 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9631127B2 (ko) |
| EP (1) | EP2888330B1 (ko) |
| JP (1) | JP6307079B2 (ko) |
| KR (1) | KR102123407B1 (ko) |
| CN (1) | CN104736654B (ko) |
| BR (1) | BR112015003675A2 (ko) |
| DE (1) | DE102012219877A1 (ko) |
| IN (1) | IN2015DN01249A (ko) |
| PL (1) | PL2888330T3 (ko) |
| TW (1) | TWI582188B (ko) |
| WO (1) | WO2014029545A1 (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110750449A (zh) * | 2019-09-19 | 2020-02-04 | 中山大学 | 一种测试驱动的网页构件功能抽取方法 |
| CN111858367A (zh) * | 2020-07-24 | 2020-10-30 | 北京达佳互联信息技术有限公司 | 代码覆盖率测试方法、系统、装置、电子设备及存储介质 |
| CN117171057A (zh) * | 2023-11-02 | 2023-12-05 | 沐曦集成电路(上海)有限公司 | 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013215149A1 (de) * | 2013-08-01 | 2015-02-19 | Conti Temic Microelectronic Gmbh | Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät |
| JP5667282B1 (ja) * | 2013-12-27 | 2015-02-12 | 古河電気工業株式会社 | 有機電界発光素子用充填材料及び有機電界発光素子の封止方法 |
| CN107148458A (zh) * | 2014-10-29 | 2017-09-08 | 德莎欧洲公司 | 包含可活化的吸气剂材料的胶粘剂混合物 |
| JP6720473B2 (ja) * | 2015-04-09 | 2020-07-08 | Dic株式会社 | 発光装置、照明器具及び情報表示装置ならびに発光装置の製造方法 |
| JP2017073379A (ja) * | 2015-10-09 | 2017-04-13 | 荒川化学工業株式会社 | 非水系二次電池電極用バインダー、非水系二次電池電極形成用スラリー、非水系二次電池電極、非水系二次電池、リチウムイオン二次電池 |
| CN105759511A (zh) * | 2016-04-15 | 2016-07-13 | 京东方科技集团股份有限公司 | 显示面板及其制造方法和显示装置及其制造方法 |
| KR20190020032A (ko) * | 2016-06-15 | 2019-02-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 막 전극 조립체 구성요소 및 조립체의 제조 방법 |
| WO2018031604A1 (en) | 2016-08-10 | 2018-02-15 | 3M Innovative Properties Company | A fluorinated pressure sensitive adhesives and articles thereof |
| WO2018181766A1 (ja) * | 2017-03-31 | 2018-10-04 | リンテック株式会社 | 半導体装置の製造方法及び両面粘着シート |
| US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
| US20210135109A1 (en) * | 2017-07-31 | 2021-05-06 | Corning Incorporated | Accelerated thermal crosslinking of pvdf-hfp via addition of organic bases, and the usage of crosslinked pvdf-hfp as gate dielectric material for otft devices |
| DE102017221270B4 (de) * | 2017-11-28 | 2021-08-12 | Tesa Se | Verfahren zur Herstellung eines Siegelklebebandes und Verwendung |
| TWI678404B (zh) * | 2017-11-29 | 2019-12-01 | 住華科技股份有限公司 | 感壓性黏著組成物、電極複合膜及其製造方法 |
| US11591501B2 (en) | 2017-12-06 | 2023-02-28 | 3M Innovative Properties Company | Barrier adhesive compositions and articles |
| CN109335253A (zh) * | 2018-08-30 | 2019-02-15 | 浙江时进包装有限公司 | 一种新型可重复封合自粘包装袋 |
| JP7445211B2 (ja) * | 2019-09-25 | 2024-03-07 | 大日本印刷株式会社 | 光学シート及びその製造方法 |
| CN112996235B (zh) * | 2021-02-10 | 2022-09-27 | 武汉天马微电子有限公司 | 一种柔性电路板、显示面板及绝缘膜 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4051195A (en) | 1975-12-15 | 1977-09-27 | Celanese Polymer Specialties Company | Polyepoxide-polyacrylate ester compositions |
| JPS584728B2 (ja) | 1976-06-30 | 1983-01-27 | ダイキン工業株式会社 | 含フツ素系多元セグメント化ポリマ−の製法 |
| GB1552046A (en) | 1977-02-02 | 1979-09-05 | Ciba Geigy Ag | Film adhesives |
| JPS5386786A (en) | 1977-09-30 | 1978-07-31 | Daikin Ind Ltd | Polymer having fluoring-containing segment and production |
| JPS5657811A (en) | 1979-10-17 | 1981-05-20 | Daikin Ind Ltd | Preparation of liquid fluorine-containing polymer |
| JPS5759972A (en) | 1980-09-26 | 1982-04-10 | Daikin Ind Ltd | Pressure-sensitive adhesive composition |
| EP0107793A1 (en) * | 1982-09-29 | 1984-05-09 | Daikin Kogyo Co., Ltd. | Carbon fiber-containing fluoroelastomer composition |
| JPS6028444A (ja) | 1983-07-27 | 1985-02-13 | Daikin Ind Ltd | 加工容易な含フツ素熱可塑性ゴム組成物 |
| JPS6057811A (ja) | 1983-09-09 | 1985-04-03 | Nippon Telegr & Teleph Corp <Ntt> | プラステイツク光フアイバコ−ドの製造方法 |
| US4647157A (en) * | 1984-12-04 | 1987-03-03 | Polaroid Corporation | Fluoroelastomeric sealants for liquid crystal cells |
| EP0489004B1 (en) | 1988-12-21 | 1995-10-25 | Raychem Corporation | Thermoplastic fluoropolymer adhesive composition |
| JP2611498B2 (ja) * | 1989-05-26 | 1997-05-21 | ダイキン工業株式会社 | 含フッ素ゴム組成物 |
| JP2001503811A (ja) | 1996-11-12 | 2001-03-21 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 熱硬化可能な感圧接着剤 |
| DE10048059A1 (de) | 2000-09-28 | 2002-04-18 | Henkel Kgaa | Klebstoff mit Barriereeigenschaften |
| WO2003011939A1 (en) | 2001-08-03 | 2003-02-13 | Dsm N.V. | Curable compositions for display devices |
| KR20100080632A (ko) | 2002-06-17 | 2010-07-09 | 세키스이가가쿠 고교가부시키가이샤 | 유기 전계 발광 소자의 밀봉 방법 |
| US7098270B2 (en) | 2002-09-10 | 2006-08-29 | Freudenberg-Nok General Partnership | Fluoroelastomer composition |
| JP4123002B2 (ja) * | 2003-02-19 | 2008-07-23 | Ｎｏｋ株式会社 | フッ素ゴム組成物 |
| JP2006001363A (ja) * | 2004-06-16 | 2006-01-05 | Mazda Motor Corp | 車両のタイヤ空気圧監視装置 |
| US20070135552A1 (en) | 2005-12-09 | 2007-06-14 | General Atomics | Gas barrier |
| JP2009088115A (ja) * | 2007-09-28 | 2009-04-23 | Shin Etsu Chem Co Ltd | 車載用電気電子部品 |
| EP2264100B1 (en) * | 2008-03-27 | 2017-01-04 | Daikin Industries, Ltd. | Peroxide cross-linked fluorine-containing elastomer composition |
| DE102008047964A1 (de) * | 2008-09-18 | 2010-03-25 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102008060113A1 (de) * | 2008-12-03 | 2010-07-29 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| FR2943349B1 (fr) | 2009-03-23 | 2012-10-26 | Arkema France | Procede de preparation d'un materiau composite elastomerique a haute teneur en nanotubes |
| JP5667412B2 (ja) * | 2010-10-20 | 2015-02-12 | 日本メクトロン株式会社 | シール構造体 |
-
2012
- 2012-10-30 DE DE102012219877.6A patent/DE102012219877A1/de not_active Withdrawn
-
2013
- 2013-07-04 JP JP2015527819A patent/JP6307079B2/ja not_active Expired - Fee Related
- 2013-07-04 BR BR112015003675A patent/BR112015003675A2/pt not_active Application Discontinuation
- 2013-07-04 US US14/422,203 patent/US9631127B2/en active Active
- 2013-07-04 KR KR1020157007489A patent/KR102123407B1/ko active IP Right Grant
- 2013-07-04 CN CN201380052807.3A patent/CN104736654B/zh active Active
- 2013-07-04 WO PCT/EP2013/064145 patent/WO2014029545A1/de active Application Filing
- 2013-07-04 EP EP13735003.9A patent/EP2888330B1/de active Active
- 2013-07-04 PL PL13735003T patent/PL2888330T3/pl unknown
- 2013-08-09 TW TW102128657A patent/TWI582188B/zh not_active IP Right Cessation
-
2015
- 2015-02-16 IN IN1249DEN2015 patent/IN2015DN01249A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110750449A (zh) * | 2019-09-19 | 2020-02-04 | 中山大学 | 一种测试驱动的网页构件功能抽取方法 |
| CN111858367A (zh) * | 2020-07-24 | 2020-10-30 | 北京达佳互联信息技术有限公司 | 代码覆盖率测试方法、系统、装置、电子设备及存储介质 |
| CN117171057A (zh) * | 2023-11-02 | 2023-12-05 | 沐曦集成电路(上海)有限公司 | 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI582188B (zh) | 2017-05-11 |
| EP2888330A1 (de) | 2015-07-01 |
| KR102123407B1 (ko) | 2020-06-16 |
| EP2888330B1 (de) | 2017-06-21 |
| US20150240134A1 (en) | 2015-08-27 |
| US9631127B2 (en) | 2017-04-25 |
| BR112015003675A2 (pt) | 2017-07-04 |
| KR20150050571A (ko) | 2015-05-08 |
| TW201418392A (zh) | 2014-05-16 |
| PL2888330T3 (pl) | 2017-09-29 |
| DE102012219877A1 (de) | 2014-02-27 |
| CN104736654A (zh) | 2015-06-24 |
| JP2015531807A (ja) | 2015-11-05 |
| WO2014029545A1 (de) | 2014-02-27 |
| JP6307079B2 (ja) | 2018-04-04 |
| CN104736654B (zh) | 2017-10-20 |
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