IN2014DN05780A - - Google Patents

Info

Publication number
IN2014DN05780A
IN2014DN05780A IN5780DEN2014A IN2014DN05780A IN 2014DN05780 A IN2014DN05780 A IN 2014DN05780A IN 5780DEN2014 A IN5780DEN2014 A IN 5780DEN2014A IN 2014DN05780 A IN2014DN05780 A IN 2014DN05780A
Authority
IN
India
Prior art keywords
insulation film
membrane
wiring
sensitive element
heat sensitive
Prior art date
Application number
Other languages
English (en)
Inventor
Kazuyoshi Tari
Mototaka Ishikawa
Keiji Shirata
Kenzo Nakamura
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DN05780A publication Critical patent/IN2014DN05780A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2098—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using light, e.g. UV photohardening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J2005/103—Absorbing heated plate or film and temperature detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J2005/206—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices on foils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
    • G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
    • G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
    • G03G15/2039—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat with means for controlling the fixing temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/00362—Apparatus for electrophotographic processes relating to the copy medium handling
    • G03G2215/00535—Stable handling of copy medium
    • G03G2215/00717—Detection of physical properties
    • G03G2215/00772—Detection of physical properties of temperature influencing copy sheet handling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
IN5780DEN2014 2012-02-01 2013-01-29 IN2014DN05780A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012019431A JP5892368B2 (ja) 2012-02-01 2012-02-01 赤外線センサ
PCT/JP2013/000467 WO2013114861A1 (ja) 2012-02-01 2013-01-29 赤外線センサ

Publications (1)

Publication Number Publication Date
IN2014DN05780A true IN2014DN05780A (zh) 2015-04-10

Family

ID=48904908

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5780DEN2014 IN2014DN05780A (zh) 2012-02-01 2013-01-29

Country Status (8)

Country Link
US (1) US9568371B2 (zh)
EP (1) EP2811271B1 (zh)
JP (1) JP5892368B2 (zh)
KR (1) KR101972196B1 (zh)
CN (1) CN104011519B (zh)
IN (1) IN2014DN05780A (zh)
TW (1) TWI568997B (zh)
WO (1) WO2013114861A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5488751B1 (ja) * 2013-08-30 2014-05-14 富士ゼロックス株式会社 温度センサ、定着装置、および画像形成装置
JP6860812B2 (ja) * 2017-01-05 2021-04-21 三菱マテリアル株式会社 赤外線センサ
JP6677925B2 (ja) * 2016-01-29 2020-04-08 三菱マテリアル株式会社 赤外線センサ
WO2017131151A1 (ja) * 2016-01-29 2017-08-03 三菱マテリアル株式会社 赤外線センサ
CN106525270A (zh) * 2016-11-22 2017-03-22 合肥舒实工贸有限公司 温度传感器
CN106556470A (zh) * 2016-11-22 2017-04-05 合肥舒实工贸有限公司 温度传感器
JP6743737B2 (ja) * 2017-03-24 2020-08-19 三菱マテリアル株式会社 赤外線センサ
JP6743741B2 (ja) * 2017-03-29 2020-08-19 三菱マテリアル株式会社 赤外線センサ
JP7030420B2 (ja) * 2017-04-10 2022-03-07 日本特殊陶業株式会社 保持装置
WO2019131642A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 光検出器
JP6726771B2 (ja) * 2018-02-08 2020-07-22 株式会社芝浦電子 赤外線温度センサ
US11243118B2 (en) 2018-03-07 2022-02-08 Tdk Corporation Electromagnetic wave sensor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763585A (ja) * 1993-08-26 1995-03-10 Hokuriku Electric Ind Co Ltd 環境センサ
JP3327668B2 (ja) * 1994-03-24 2002-09-24 石塚電子株式会社 赤外線検出器
JP3494747B2 (ja) * 1995-03-31 2004-02-09 石塚電子株式会社 薄膜温度センサ及びその製造方法
JPH08278192A (ja) * 1995-04-07 1996-10-22 Ishizuka Denshi Kk 赤外線検出器
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
JP2002071451A (ja) 2000-08-29 2002-03-08 Sharp Corp 熱型赤外線検出素子及びそれを用いた赤外線撮像素子
JP4628540B2 (ja) 2000-11-20 2011-02-09 石塚電子株式会社 赤外線温度センサ
JP2003194630A (ja) * 2001-12-27 2003-07-09 Ishizuka Electronics Corp 非接触温度センサおよび非接触温度センサ用検出回路
JP5079211B2 (ja) * 2004-10-13 2012-11-21 浜松ホトニクス株式会社 赤外線検出装置及びその製造方法
JP4483521B2 (ja) 2004-10-21 2010-06-16 Ｔｄｋ株式会社 非接触温度センサ
JP2009180682A (ja) 2008-01-31 2009-08-13 Ritsumeikan 赤外線センサ
JP2011013213A (ja) * 2009-06-02 2011-01-20 Mitsubishi Materials Corp 赤外線センサ
JP5640529B2 (ja) 2009-10-17 2014-12-17 三菱マテリアル株式会社 赤外線センサ及びこれを備えた回路基板
JP5832007B2 (ja) * 2009-12-25 2015-12-16 三菱マテリアル株式会社 赤外線センサ及びその製造方法
JP2011220939A (ja) * 2010-04-13 2011-11-04 Panasonic Electric Works Co Ltd 赤外線センサの製造方法

Also Published As

Publication number Publication date
TWI568997B (zh) 2017-02-01
WO2013114861A1 (ja) 2013-08-08
EP2811271A4 (en) 2015-09-30
EP2811271B1 (en) 2019-04-24
TW201344166A (zh) 2013-11-01
CN104011519B (zh) 2016-03-23
JP2013156235A (ja) 2013-08-15
JP5892368B2 (ja) 2016-03-23
CN104011519A (zh) 2014-08-27
KR20140128973A (ko) 2014-11-06
EP2811271A1 (en) 2014-12-10
US20140374596A1 (en) 2014-12-25
KR101972196B1 (ko) 2019-04-24
US9568371B2 (en) 2017-02-14

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