IN2014DE00839A - - Google Patents
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- Publication number
- IN2014DE00839A IN2014DE00839A IN839DE2014A IN2014DE00839A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A IN 839DE2014 A IN839DE2014 A IN 839DE2014A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A
- Authority
- IN
- India
- Prior art keywords
- forming
- fastener hole
- cavity
- circuit board
- resin material
- Prior art date
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013068411A JP6032096B2 (ja) | 2013-03-28 | 2013-03-28 | 電子制御ユニット及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DE00839A true IN2014DE00839A (ja) | 2015-06-19 |
Family
ID=51601283
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN839DE2014 IN2014DE00839A (ja) | 2013-03-28 | 2014-03-24 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6032096B2 (ja) |
CN (1) | CN104080306B (ja) |
IN (1) | IN2014DE00839A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6323303B2 (ja) * | 2014-11-10 | 2018-05-16 | 株式会社デンソー | 電子部品ユニット |
JP6668973B2 (ja) * | 2016-06-28 | 2020-03-18 | 株式会社デンソー | 電子装置、及び、電子装置の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5433665A (en) * | 1977-08-22 | 1979-03-12 | Hitachi Ltd | Manufacture for resin sealed type semiconductor device and resin sealed metal mold |
JP3193194B2 (ja) * | 1993-07-09 | 2001-07-30 | 三菱電線工業株式会社 | 基板に実装されたledチップにレンズ被覆層をモールドする方法およびそのモールド用基板構造 |
JP3461073B2 (ja) * | 1995-12-08 | 2003-10-27 | 株式会社デンソー | ベアチップ封止方法 |
JP4540884B2 (ja) * | 2001-06-19 | 2010-09-08 | 三菱電機株式会社 | 半導体装置 |
JP2003100957A (ja) * | 2001-09-26 | 2003-04-04 | Nec Corp | 半導体パッケージ |
JP2003179093A (ja) * | 2001-12-12 | 2003-06-27 | Nissan Motor Co Ltd | 半導体モジュールの製造方法および半導体モジュール |
JP2003283144A (ja) * | 2002-03-27 | 2003-10-03 | Minolta Co Ltd | 回路基板の放熱構造 |
US7166906B2 (en) * | 2004-05-21 | 2007-01-23 | Samsung Electronics Co., Ltd. | Package with barrier wall and method for manufacturing the same |
JP4741324B2 (ja) * | 2005-09-06 | 2011-08-03 | ユニチカ株式会社 | プリント基板 |
JP2009200416A (ja) * | 2008-02-25 | 2009-09-03 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
JP5187065B2 (ja) * | 2008-08-18 | 2013-04-24 | 株式会社デンソー | 電子制御装置の製造方法及び電子制御装置 |
JP5208099B2 (ja) * | 2009-12-11 | 2013-06-12 | 日立オートモティブシステムズ株式会社 | 流量センサとその製造方法、及び流量センサモジュール |
WO2012049742A1 (ja) * | 2010-10-13 | 2012-04-19 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法 |
US8387457B2 (en) * | 2011-01-11 | 2013-03-05 | Delphi Technologies, Inc. | Collision sensor housing and module |
-
2013
- 2013-03-28 JP JP2013068411A patent/JP6032096B2/ja not_active Expired - Fee Related
-
2014
- 2014-03-24 IN IN839DE2014 patent/IN2014DE00839A/en unknown
- 2014-03-28 CN CN201410123264.6A patent/CN104080306B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN104080306A (zh) | 2014-10-01 |
JP2014192447A (ja) | 2014-10-06 |
JP6032096B2 (ja) | 2016-11-24 |
CN104080306B (zh) | 2018-10-12 |
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