IN2014DE00802A - - Google Patents
Info
- Publication number
- IN2014DE00802A IN2014DE00802A IN802DE2014A IN2014DE00802A IN 2014DE00802 A IN2014DE00802 A IN 2014DE00802A IN 802DE2014 A IN802DE2014 A IN 802DE2014A IN 2014DE00802 A IN2014DE00802 A IN 2014DE00802A
- Authority
- IN
- India
- Prior art keywords
- alloy
- less
- layer
- based surface
- alloy layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013062324 | 2013-03-25 | ||
JP2013248189A JP6221695B2 (ja) | 2013-03-25 | 2013-11-29 | 挿抜性に優れた錫めっき銅合金端子材 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DE00802A true IN2014DE00802A (ko) | 2015-06-19 |
Family
ID=50287991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN802DE2014 IN2014DE00802A (ko) | 2013-03-25 | 2014-03-19 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140287262A1 (ko) |
EP (1) | EP2784190A1 (ko) |
JP (1) | JP6221695B2 (ko) |
KR (1) | KR20140117274A (ko) |
CN (1) | CN104078782A (ko) |
IN (1) | IN2014DE00802A (ko) |
TW (1) | TW201447053A (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
JP5984981B2 (ja) * | 2015-02-24 | 2016-09-06 | Jx金属株式会社 | 電子部品用Snめっき材 |
JP5984980B2 (ja) | 2015-02-24 | 2016-09-06 | Jx金属株式会社 | 電子部品用Snめっき材 |
DE102015210458A1 (de) * | 2015-06-08 | 2016-12-08 | Te Connectivity Germany Gmbh | Verfahren zum Verbinden eines ein unedles Metall aufweisenden Leiters mit einem Kupfer aufweisenden Anschlusselement mittels Verschweißen sowie eine dadurch hergestellte Anschlussanordnung |
MY185288A (en) * | 2015-11-27 | 2021-04-30 | Mitsubishi Materials Corp | Tin-plated copper terminal material, terminal, and wire terminal part structure |
US11152729B2 (en) | 2016-11-14 | 2021-10-19 | TE Connectivity Services Gmbh | Electrical connector and electrical connector assembly having a mating array of signal and ground contacts |
US9859640B1 (en) | 2016-11-14 | 2018-01-02 | Te Connectivity Corporation | Electrical connector with plated signal contacts |
CN110036142B (zh) * | 2016-12-06 | 2021-04-20 | 同和金属技术有限公司 | Sn镀覆材料及其制造方法 |
WO2018105388A1 (ja) * | 2016-12-06 | 2018-06-14 | Dowaメタルテック株式会社 | Snめっき材およびその製造方法 |
US10858750B2 (en) * | 2017-07-28 | 2020-12-08 | Mitsubishi Materials Corporation | Tin-plated copper terminal material, terminal and electric wire terminal-end structure |
JP7040224B2 (ja) * | 2018-03-30 | 2022-03-23 | 三菱マテリアル株式会社 | 錫めっき付銅端子材及びその製造方法 |
JP2021147673A (ja) * | 2020-03-19 | 2021-09-27 | 三菱マテリアル株式会社 | Cu−Ni−Si系銅合金板、めっき皮膜付Cu−Ni−Si系銅合金板及びこれらの製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10025106A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
JP2004006065A (ja) * | 2002-03-25 | 2004-01-08 | Mitsubishi Shindoh Co Ltd | 電気接続用嵌合型接続端子 |
JP3926355B2 (ja) * | 2004-09-10 | 2007-06-06 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
JP4024244B2 (ja) | 2004-12-27 | 2007-12-19 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
JP2007063624A (ja) * | 2005-08-31 | 2007-03-15 | Nikko Kinzoku Kk | 挿抜性及び耐熱性に優れる銅合金すずめっき条 |
JP4771970B2 (ja) * | 2006-02-27 | 2011-09-14 | 株式会社神戸製鋼所 | 接続部品用導電材料 |
JP4986499B2 (ja) * | 2006-04-26 | 2012-07-25 | Jx日鉱日石金属株式会社 | Cu−Ni−Si合金すずめっき条の製造方法 |
JP5319101B2 (ja) * | 2007-10-31 | 2013-10-16 | Jx日鉱日石金属株式会社 | 電子部品用Snめっき材 |
CN101981234B (zh) * | 2008-03-31 | 2013-06-12 | Jx日矿日石金属株式会社 | 耐磨损性、插入性及耐热性优异的铜合金镀锡条 |
JP5498710B2 (ja) * | 2009-02-23 | 2014-05-21 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
WO2010119489A1 (ja) * | 2009-04-14 | 2010-10-21 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
JP4372835B1 (ja) * | 2009-04-14 | 2009-11-25 | 三菱伸銅株式会社 | 導電部材及びその製造方法 |
US8956735B2 (en) * | 2010-03-26 | 2015-02-17 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same |
JP5394963B2 (ja) * | 2010-03-26 | 2014-01-22 | 株式会社神戸製鋼所 | 接続用部品用銅合金及び導電材料 |
TW201311944A (zh) * | 2011-08-12 | 2013-03-16 | Mitsubishi Materials Corp | 插拔性優異的鍍錫銅合金端子材及其製造方法 |
JP5640922B2 (ja) * | 2011-08-31 | 2014-12-17 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
JP2015063750A (ja) * | 2013-08-26 | 2015-04-09 | 三菱マテリアル株式会社 | 挿抜性に優れた錫めっき銅合金端子材 |
-
2013
- 2013-11-29 JP JP2013248189A patent/JP6221695B2/ja active Active
-
2014
- 2014-03-13 KR KR1020140029378A patent/KR20140117274A/ko not_active Application Discontinuation
- 2014-03-14 US US14/212,014 patent/US20140287262A1/en not_active Abandoned
- 2014-03-17 CN CN201410097970.8A patent/CN104078782A/zh active Pending
- 2014-03-19 EP EP14160700.2A patent/EP2784190A1/en not_active Withdrawn
- 2014-03-19 IN IN802DE2014 patent/IN2014DE00802A/en unknown
- 2014-03-20 TW TW103110474A patent/TW201447053A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20140117274A (ko) | 2014-10-07 |
CN104078782A (zh) | 2014-10-01 |
TW201447053A (zh) | 2014-12-16 |
EP2784190A1 (en) | 2014-10-01 |
US20140287262A1 (en) | 2014-09-25 |
JP6221695B2 (ja) | 2017-11-01 |
JP2014208878A (ja) | 2014-11-06 |
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