IN2014CN04680A - - Google Patents

Info

Publication number
IN2014CN04680A
IN2014CN04680A IN4680CHN2014A IN2014CN04680A IN 2014CN04680 A IN2014CN04680 A IN 2014CN04680A IN 4680CHN2014 A IN4680CHN2014 A IN 4680CHN2014A IN 2014CN04680 A IN2014CN04680 A IN 2014CN04680A
Authority
IN
India
Prior art keywords
die
heat spreader
microelectronic
parallel
encapsulation material
Prior art date
Application number
Other languages
English (en)
Inventor
Weng Hong Teh
Deepak Kulkarni
Chia Pin Chiu
Tannaz Harirchian
John S Guzek
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of IN2014CN04680A publication Critical patent/IN2014CN04680A/en

Links

Classifications

    • H10W40/00—
    • H10W40/10—
    • H10W40/22—
    • H10W40/228—
    • H10W40/778—
    • H10W70/09—
    • H10W70/614—
    • H10W70/685—
    • H10W74/01—
    • H10W90/00—
    • H10W70/60—
    • H10W72/856—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/944—
    • H10W90/722—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
IN4680CHN2014 2012-09-28 2013-06-04 IN2014CN04680A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/631,205 US8912670B2 (en) 2012-09-28 2012-09-28 Bumpless build-up layer package including an integrated heat spreader
PCT/US2013/044001 WO2014051714A1 (en) 2012-09-28 2013-06-04 Bumpless build-up layer package including an integrated heat spreader

Publications (1)

Publication Number Publication Date
IN2014CN04680A true IN2014CN04680A (enExample) 2015-09-18

Family

ID=50384394

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4680CHN2014 IN2014CN04680A (enExample) 2012-09-28 2013-06-04

Country Status (5)

Country Link
US (3) US8912670B2 (enExample)
CN (1) CN104025289B (enExample)
DE (1) DE112013000494B4 (enExample)
IN (1) IN2014CN04680A (enExample)
WO (1) WO2014051714A1 (enExample)

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US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11728273B2 (en) 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
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Also Published As

Publication number Publication date
WO2014051714A1 (en) 2014-04-03
US9520376B2 (en) 2016-12-13
US20160027757A1 (en) 2016-01-28
DE112013000494B4 (de) 2018-07-19
DE112013000494T5 (de) 2014-10-02
US20150104907A1 (en) 2015-04-16
US20140091445A1 (en) 2014-04-03
CN104025289A (zh) 2014-09-03
US8912670B2 (en) 2014-12-16
US9153552B2 (en) 2015-10-06
CN104025289B (zh) 2017-06-20

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