IN2014CN03370A - - Google Patents

Info

Publication number
IN2014CN03370A
IN2014CN03370A IN3370CHN2014A IN2014CN03370A IN 2014CN03370 A IN2014CN03370 A IN 2014CN03370A IN 3370CHN2014 A IN3370CHN2014 A IN 3370CHN2014A IN 2014CN03370 A IN2014CN03370 A IN 2014CN03370A
Authority
IN
India
Prior art keywords
substrate
adjacent
die
heat spreader
package
Prior art date
Application number
Other languages
English (en)
Inventor
Debendra Mallik
Srindhar Narasimhan
Mathew J Manusharow
Thomas A Boyd
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of IN2014CN03370A publication Critical patent/IN2014CN03370A/en

Links

Classifications

    • H10W72/00—
    • H10W40/00—
    • H10W40/10—
    • H10W40/22—
    • H10W40/70—
    • H10W90/401—
    • H10W95/00—
    • H10W72/877—
    • H10W90/00—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
IN3370CHN2014 2011-12-16 2011-12-16 IN2014CN03370A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/065512 WO2013089780A1 (en) 2011-12-16 2011-12-16 Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Publications (1)

Publication Number Publication Date
IN2014CN03370A true IN2014CN03370A (enExample) 2015-07-03

Family

ID=48613051

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3370CHN2014 IN2014CN03370A (enExample) 2011-12-16 2011-12-16

Country Status (5)

Country Link
US (1) US9478476B2 (enExample)
KR (1) KR101584471B1 (enExample)
CN (1) CN103999215B (enExample)
IN (1) IN2014CN03370A (enExample)
WO (1) WO2013089780A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8728872B2 (en) * 2011-08-18 2014-05-20 DY 4 Systems, Inc. Manufacturing process and heat dissipating device for forming interface for electronic component
WO2013089780A1 (en) 2011-12-16 2013-06-20 Intel Corporation Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package
KR101983142B1 (ko) * 2013-06-28 2019-08-28 삼성전기주식회사 반도체 패키지
FR3012670A1 (fr) * 2013-10-30 2015-05-01 St Microelectronics Grenoble 2 Systeme electronique comprenant des dispositifs electroniques empiles munis de puces de circuits integres
KR20150072846A (ko) * 2013-12-20 2015-06-30 삼성전기주식회사 반도체 패키지 모듈
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
KR101753181B1 (ko) * 2014-12-20 2017-07-03 인텔 코포레이션 소켓 어셈블리용 땜납 콘택트
JP2016225413A (ja) * 2015-05-28 2016-12-28 株式会社ジェイテクト 半導体モジュール
WO2018125254A1 (en) * 2016-12-31 2018-07-05 Intel Corporation Electronic device package
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10424527B2 (en) * 2017-11-14 2019-09-24 International Business Machines Corporation Electronic package with tapered pedestal
US11282762B2 (en) 2019-02-08 2022-03-22 Marvell Asia Pte, Ltd. Heat sink design for flip chip ball grid array
US11195779B2 (en) * 2019-08-09 2021-12-07 Raytheon Company Electronic module for motherboard
US11948855B1 (en) 2019-09-27 2024-04-02 Rockwell Collins, Inc. Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
US11158596B2 (en) 2020-03-20 2021-10-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package comprising power module and passive elements
JP7528557B2 (ja) * 2020-06-19 2024-08-06 日本電気株式会社 量子デバイス及びその製造方法
US12183650B2 (en) * 2020-12-22 2024-12-31 Intel Corporation Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver
US12061371B2 (en) * 2020-12-22 2024-08-13 Intel Corporation Patch on interposer architecture for low cost optical co-packaging
US20220291462A1 (en) * 2021-03-11 2022-09-15 Intel Corporation Method to couple light using integrated heat spreader
US12500134B2 (en) * 2021-07-09 2025-12-16 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having a step region and method of making the same
US12362245B2 (en) * 2021-07-15 2025-07-15 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having an inner foot and methods of making the same
CN114823549B (zh) * 2022-06-27 2022-11-11 北京升宇科技有限公司 一种纵向场效应晶体管vdmos芯片的封装结构及封装方法
CN118335763B (zh) * 2024-06-12 2024-10-25 甬矽电子(宁波)股份有限公司 传感器封装结构和传感器封装制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6229216B1 (en) * 1999-01-11 2001-05-08 Intel Corporation Silicon interposer and multi-chip-module (MCM) with through substrate vias
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6882535B2 (en) * 2003-03-31 2005-04-19 Intel Corporation Integrated heat spreader with downset edge, and method of making same
US7462506B2 (en) * 2006-06-15 2008-12-09 International Business Machines Corporation Carbon dioxide gettering method for a chip module assembly
US7429792B2 (en) 2006-06-29 2008-09-30 Hynix Semiconductor Inc. Stack package with vertically formed heat sink
US7781883B2 (en) * 2008-08-19 2010-08-24 International Business Machines Corporation Electronic package with a thermal interposer and method of manufacturing the same
WO2013089780A1 (en) 2011-12-16 2013-06-20 Intel Corporation Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Also Published As

Publication number Publication date
WO2013089780A1 (en) 2013-06-20
CN103999215A (zh) 2014-08-20
CN103999215B (zh) 2017-06-13
US9478476B2 (en) 2016-10-25
KR20140094612A (ko) 2014-07-30
KR101584471B1 (ko) 2016-01-22
US20130270691A1 (en) 2013-10-17

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