CN103999215B - 用于微电子管芯、含有微电子管芯的微电子组件、微电子系统的封装，以及降低微电子封装中的管芯应力的方法 - Google Patents

用于微电子管芯、含有微电子管芯的微电子组件、微电子系统的封装，以及降低微电子封装中的管芯应力的方法 Download PDF

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Publication number
CN103999215B
CN103999215B CN201180075511.4A CN201180075511A CN103999215B CN 103999215 B CN103999215 B CN 103999215B CN 201180075511 A CN201180075511 A CN 201180075511A CN 103999215 B CN103999215 B CN 103999215B
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China
Prior art keywords
substrate
contact
heat sink
die
contact area
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CN201180075511.4A
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Chinese (zh)
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CN103999215A (zh
Inventor
D·马利克
S·纳拉辛汉
M·J·曼努沙洛
T·A·博伊德
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Intel Corp
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Intel Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
CN201180075511.4A 2011-12-16 2011-12-16 用于微电子管芯、含有微电子管芯的微电子组件、微电子系统的封装，以及降低微电子封装中的管芯应力的方法 Active CN103999215B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/065512 WO2013089780A1 (en) 2011-12-16 2011-12-16 Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

Publications (2)

Publication Number Publication Date
CN103999215A CN103999215A (zh) 2014-08-20
CN103999215B true CN103999215B (zh) 2017-06-13

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CN201180075511.4A Active CN103999215B (zh) 2011-12-16 2011-12-16 用于微电子管芯、含有微电子管芯的微电子组件、微电子系统的封装，以及降低微电子封装中的管芯应力的方法

Country Status (5)

Country Link
US (1) US9478476B2 (enExample)
KR (1) KR101584471B1 (enExample)
CN (1) CN103999215B (enExample)
IN (1) IN2014CN03370A (enExample)
WO (1) WO2013089780A1 (enExample)

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US8728872B2 (en) * 2011-08-18 2014-05-20 DY 4 Systems, Inc. Manufacturing process and heat dissipating device for forming interface for electronic component
KR101584471B1 (ko) 2011-12-16 2016-01-22 인텔 코포레이션 마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법
KR101983142B1 (ko) * 2013-06-28 2019-08-28 삼성전기주식회사 반도체 패키지
FR3012670A1 (fr) * 2013-10-30 2015-05-01 St Microelectronics Grenoble 2 Systeme electronique comprenant des dispositifs electroniques empiles munis de puces de circuits integres
KR20150072846A (ko) * 2013-12-20 2015-06-30 삼성전기주식회사 반도체 패키지 모듈
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
DE112014002746B4 (de) 2014-12-20 2023-11-30 Intel Corporation Lötkontakte für buchsenbaugruppen und verfahren zur herstellung derselben
JP2016225413A (ja) * 2015-05-28 2016-12-28 株式会社ジェイテクト 半導体モジュール
CN110050332A (zh) 2016-12-31 2019-07-23 英特尔公司 电子器件封装
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10424527B2 (en) * 2017-11-14 2019-09-24 International Business Machines Corporation Electronic package with tapered pedestal
US11282762B2 (en) 2019-02-08 2022-03-22 Marvell Asia Pte, Ltd. Heat sink design for flip chip ball grid array
US11195779B2 (en) * 2019-08-09 2021-12-07 Raytheon Company Electronic module for motherboard
US11948855B1 (en) 2019-09-27 2024-04-02 Rockwell Collins, Inc. Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
US11158596B2 (en) 2020-03-20 2021-10-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package comprising power module and passive elements
JP7528557B2 (ja) * 2020-06-19 2024-08-06 日本電気株式会社 量子デバイス及びその製造方法
US12183650B2 (en) 2020-12-22 2024-12-31 Intel Corporation Heat extraction path from a laser die using a highly conductive thermal interface material in an optical transceiver
US12061371B2 (en) * 2020-12-22 2024-08-13 Intel Corporation Patch on interposer architecture for low cost optical co-packaging
US20220291462A1 (en) * 2021-03-11 2022-09-15 Intel Corporation Method to couple light using integrated heat spreader
US12500134B2 (en) * 2021-07-09 2025-12-16 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having a step region and method of making the same
US12362245B2 (en) * 2021-07-15 2025-07-15 Taiwan Semiconductor Manufacturing Company Limited Package assembly including a package lid having an inner foot and methods of making the same
CN114823549B (zh) * 2022-06-27 2022-11-11 北京升宇科技有限公司 一种纵向场效应晶体管vdmos芯片的封装结构及封装方法
US20250096071A1 (en) * 2023-09-15 2025-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit cooling systems and methods
CN118335763B (zh) * 2024-06-12 2024-10-25 甬矽电子(宁波)股份有限公司 传感器封装结构和传感器封装制作方法

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US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface

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US6882535B2 (en) 2003-03-31 2005-04-19 Intel Corporation Integrated heat spreader with downset edge, and method of making same
US7462506B2 (en) * 2006-06-15 2008-12-09 International Business Machines Corporation Carbon dioxide gettering method for a chip module assembly
US7429792B2 (en) * 2006-06-29 2008-09-30 Hynix Semiconductor Inc. Stack package with vertically formed heat sink
US7781883B2 (en) * 2008-08-19 2010-08-24 International Business Machines Corporation Electronic package with a thermal interposer and method of manufacturing the same
KR101584471B1 (ko) 2011-12-16 2016-01-22 인텔 코포레이션 마이크로일렉트로닉 다이용 패키지, 패키지를 구비한 마이크로일렉트로닉 조립체, 마이크로일렉트로닉 시스템, 및 마이크로일렉트로닉 패키지의 다이 응력 감소 방법

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US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface

Also Published As

Publication number Publication date
IN2014CN03370A (enExample) 2015-07-03
WO2013089780A1 (en) 2013-06-20
KR101584471B1 (ko) 2016-01-22
KR20140094612A (ko) 2014-07-30
CN103999215A (zh) 2014-08-20
US9478476B2 (en) 2016-10-25
US20130270691A1 (en) 2013-10-17

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