IN2014CN03275A - - Google Patents

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Publication number
IN2014CN03275A
IN2014CN03275A IN3275CHN2014A IN2014CN03275A IN 2014CN03275 A IN2014CN03275 A IN 2014CN03275A IN 3275CHN2014 A IN3275CHN2014 A IN 3275CHN2014A IN 2014CN03275 A IN2014CN03275 A IN 2014CN03275A
Authority
IN
India
Prior art keywords
semiconductor regions
potential
biased
junction
drain
Prior art date
Application number
Other languages
English (en)
Inventor
Yutaka Hayashi
Toshitaka Ota
Yasushi Nagamune
Hirofumi Watanabe
Takaaki Negoro
Kazunari Kimino
Original Assignee
Nat Inst Of Advanced Ind Scien
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Inst Of Advanced Ind Scien, Ricoh Co Ltd filed Critical Nat Inst Of Advanced Ind Scien
Publication of IN2014CN03275A publication Critical patent/IN2014CN03275A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14681—Bipolar transistor imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/1443—Devices controlled by radiation with at least one potential jump or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14654—Blooming suppression
    • H01L27/14656—Overflow drain structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
IN3275CHN2014 2011-10-06 2012-10-05 IN2014CN03275A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011222020A JP5907500B2 (ja) 2011-10-06 2011-10-06 光電変換装置、光電変換アレイおよび撮像装置
PCT/JP2012/076557 WO2013051734A1 (en) 2011-10-06 2012-10-05 Photoelectric converter, photoelectric converter array and imaging device

Publications (1)

Publication Number Publication Date
IN2014CN03275A true IN2014CN03275A (ja) 2015-07-03

Family

ID=48043886

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3275CHN2014 IN2014CN03275A (ja) 2011-10-06 2012-10-05

Country Status (8)

Country Link
US (1) US9337234B2 (ja)
EP (1) EP2764687A4 (ja)
JP (1) JP5907500B2 (ja)
KR (1) KR101609960B1 (ja)
CN (1) CN103975581B (ja)
BR (1) BR112014008399A2 (ja)
IN (1) IN2014CN03275A (ja)
WO (1) WO2013051734A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6387743B2 (ja) 2013-12-16 2018-09-12 株式会社リコー 半導体装置および半導体装置の製造方法
JP6281297B2 (ja) 2014-01-27 2018-02-21 株式会社リコー フォトトランジスタ、及び半導体装置
JP6354221B2 (ja) 2014-03-12 2018-07-11 株式会社リコー 撮像装置及び電子機器
JP2016025261A (ja) 2014-07-23 2016-02-08 株式会社リコー 撮像装置、撮像装置の制御方法、画素構造
JP6057477B2 (ja) * 2014-10-15 2017-01-11 学校法人加計学園 岡山理科大学 非接触給電装置
JP2016092178A (ja) 2014-11-04 2016-05-23 株式会社リコー 固体撮像素子
JP2016092348A (ja) 2014-11-11 2016-05-23 株式会社リコー 半導体デバイス及びその製造方法、撮像装置
US10497818B2 (en) 2016-07-29 2019-12-03 Canon Kabushiki Kaisha Photodetection device and photodetection system
US9915561B1 (en) 2016-08-24 2018-03-13 International Business Machines Corporation Self-clocked low noise photoreceiver (SCLNP)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6014231A (ja) 1983-07-06 1985-01-24 Ricoh Co Ltd 原稿像読取装置
JPS60259917A (ja) * 1984-06-06 1985-12-23 Fujitsu Ten Ltd 受光回路
JP2501208B2 (ja) * 1987-01-16 1996-05-29 キヤノン株式会社 光電変換装置
US4866293A (en) 1986-12-09 1989-09-12 Canon Kabushiki Kaisha Photoelectric converting apparatus to prevent the outflow of excess carriers
JPH01288181A (ja) 1988-05-16 1989-11-20 Seiko Instr Inc 半導体イメージセンサ装置
TW421962B (en) * 1997-09-29 2001-02-11 Canon Kk Image sensing device using mos type image sensing elements
JP3590723B2 (ja) * 1998-07-17 2004-11-17 シャープ株式会社 フォトトランジスタチップ
US6856351B1 (en) * 1999-09-16 2005-02-15 Xerox Corporation Device and method for reducing lag and blooming in amorphous silicon sensor arrays
US6940551B2 (en) * 2000-09-25 2005-09-06 Foveon, Inc. Active pixel sensor with noise cancellation
JP5584982B2 (ja) * 2009-02-09 2014-09-10 ソニー株式会社 固体撮像素子およびカメラシステム
JP2009141419A (ja) * 2007-12-03 2009-06-25 Panasonic Corp 固体撮像素子
JP5363237B2 (ja) * 2009-08-10 2013-12-11 ローム株式会社 光電変換回路及びそれに用いる光電変換素子
JP5721994B2 (ja) * 2009-11-27 2015-05-20 株式会社ジャパンディスプレイ 放射線撮像装置
JP5403369B2 (ja) 2010-03-31 2014-01-29 ソニー株式会社 固体撮像素子および駆動方法、並びに電子機器

Also Published As

Publication number Publication date
JP5907500B2 (ja) 2016-04-26
EP2764687A1 (en) 2014-08-13
EP2764687A4 (en) 2015-10-21
US20140239158A1 (en) 2014-08-28
KR101609960B1 (ko) 2016-04-06
BR112014008399A2 (pt) 2017-09-19
CN103975581B (zh) 2017-09-08
WO2013051734A1 (en) 2013-04-11
JP2013085030A (ja) 2013-05-09
CN103975581A (zh) 2014-08-06
KR20140070652A (ko) 2014-06-10
US9337234B2 (en) 2016-05-10

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