IN2014CH02039A - - Google Patents

Download PDF

Info

Publication number
IN2014CH02039A
IN2014CH02039A IN2039CH2014A IN2014CH02039A IN 2014CH02039 A IN2014CH02039 A IN 2014CH02039A IN 2039CH2014 A IN2039CH2014 A IN 2039CH2014A IN 2014CH02039 A IN2014CH02039 A IN 2014CH02039A
Authority
IN
India
Prior art keywords
semiconductor laser
walled section
pair
holding member
thin
Prior art date
Application number
Other languages
English (en)
Inventor
Hidenori Matsuo
Takashi Sasamuro
Hideki Kondo
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of IN2014CH02039A publication Critical patent/IN2014CH02039A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • G03B21/2006—Lamp housings characterised by the light source
    • G03B21/2033—LED or laser light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Lasers (AREA)
IN2039CH2014 2013-04-22 2014-04-21 IN2014CH02039A (enExample)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013089501 2013-04-22
JP2013150836 2013-07-19
JP2014082560A JP6311424B2 (ja) 2013-04-22 2014-04-14 光源装置

Publications (1)

Publication Number Publication Date
IN2014CH02039A true IN2014CH02039A (enExample) 2015-07-03

Family

ID=50542854

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2039CH2014 IN2014CH02039A (enExample) 2013-04-22 2014-04-21

Country Status (5)

Country Link
US (1) US9726329B2 (enExample)
EP (2) EP2797184B1 (enExample)
JP (1) JP6311424B2 (enExample)
CN (1) CN104112982B (enExample)
IN (1) IN2014CH02039A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017026663A (ja) 2015-07-16 2017-02-02 セイコーエプソン株式会社 光源装置、照明装置、およびプロジェクター
JP6725118B2 (ja) 2016-07-28 2020-07-15 Ｎｅｃディスプレイソリューションズ株式会社 光源装置および投写型表示装置、半導体発光素子の冷却方法
CN113422280B (zh) 2016-09-12 2023-03-31 广埸(厦门)科技有限公司 具有激光阵列照明的系统和装置
US10571788B2 (en) 2017-07-25 2020-02-25 Seiko Epson Corporation Light source device, illumination device, and projector
CN107425411A (zh) * 2017-08-16 2017-12-01 青岛海信电器股份有限公司 激光器组件、激光显示投影仪及激光器组件制作方法
JP7039909B2 (ja) 2017-09-27 2022-03-23 セイコーエプソン株式会社 照明装置およびプロジェクター
US10422514B2 (en) 2017-12-19 2019-09-24 Sharp Kabushiki Kaisha Light source module
CN111123238A (zh) * 2018-10-31 2020-05-08 三赢科技（深圳）有限公司 镜头模组及应用其的电子设备
WO2020135497A1 (en) 2018-12-26 2020-07-02 Xiamen Chaoxuan Photoelectric Technology Co., Ltd. System and device with laser array illumination
JP7633535B2 (ja) * 2020-02-13 2025-02-20 日亜化学工業株式会社 発光モジュール
CN113097858B (zh) * 2021-06-10 2021-08-24 深圳市星汉激光科技股份有限公司 一种底板局部减薄的半导体激光器

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500768A (en) * 1993-04-16 1996-03-19 Bruce McCaul Laser diode/lens assembly
JPH08107252A (ja) * 1994-10-06 1996-04-23 Mitsubishi Electric Corp 半導体レーザ装置，及び半導体レーザアレイ装置
JP3616698B2 (ja) 1996-10-11 2005-02-02 新光電気工業株式会社 ヒートシンク付きステムの製造方法
US20020110328A1 (en) * 2001-02-14 2002-08-15 Bischel William K. Multi-channel laser pump source for optical amplifiers
KR100965946B1 (ko) * 2002-03-25 2010-06-24 산요덴키가부시키가이샤 반도체 레이저 장치
JP2004325929A (ja) * 2003-04-25 2004-11-18 Kyocera Mita Corp 光学走査装置
JP2005167189A (ja) 2003-11-13 2005-06-23 Hitachi Cable Ltd 光−電気変換モジュール及びそれを用いた光トランシーバ
US7196389B2 (en) 2005-02-14 2007-03-27 Mitsubishi Denki Kabushiki Kaisha Optical semiconductor device package and optical semiconductor device
JP2007048938A (ja) * 2005-08-10 2007-02-22 Rohm Co Ltd 半導体レーザ
JP2007059692A (ja) 2005-08-25 2007-03-08 Sumitomo Electric Ind Ltd 光モジュール
JP5358806B2 (ja) 2007-05-23 2013-12-04 Ｕｈｔ株式会社 ドリル
JP5079474B2 (ja) * 2007-11-29 2012-11-21 シャープ株式会社 キャップ部材およびそれを用いた半導体装置
JP2009175426A (ja) 2008-01-24 2009-08-06 Funai Electric Co Ltd プロジェクタおよびプロジェクタの光軸調整方法
JP5143792B2 (ja) * 2009-07-09 2013-02-13 シャープ株式会社 半導体レーザ装置
JP5505719B2 (ja) * 2010-06-28 2014-05-28 カシオ計算機株式会社 光源装置及びプロジェクタ
US9526167B2 (en) * 2010-11-02 2016-12-20 Kyocera Corporation Many-up wiring substrate, wiring board, and electronic device
JP5934914B2 (ja) * 2011-05-13 2016-06-15 パナソニックＩｐマネジメント株式会社 レーザアレイ光源ユニット
JP5316911B2 (ja) 2011-06-24 2013-10-16 カシオ計算機株式会社 光源装置及びプロジェクタ
JP5817313B2 (ja) 2011-08-09 2015-11-18 セイコーエプソン株式会社 光源装置及びプロジェクター
JP5846416B2 (ja) 2011-08-31 2016-01-20 カシオ計算機株式会社 光源装置及びプロジェクタ
JP2013089501A (ja) 2011-10-19 2013-05-13 Panasonic Corp 有機エレクトロルミネッセンス素子
US8576885B2 (en) * 2012-02-09 2013-11-05 Princeton Optronics, Inc. Optical pump for high power laser
JP5677396B2 (ja) 2012-10-15 2015-02-25 三菱電機株式会社 通信装置および通信方法
JP5626397B2 (ja) 2013-03-29 2014-11-19 株式会社三洋物産 パチンコ遊技機

Also Published As

Publication number Publication date
US20140313715A1 (en) 2014-10-23
EP2797184A3 (en) 2015-03-11
EP4224644A2 (en) 2023-08-09
JP6311424B2 (ja) 2018-04-18
CN104112982B (zh) 2021-03-26
EP2797184B1 (en) 2023-07-19
JP2015038958A (ja) 2015-02-26
US9726329B2 (en) 2017-08-08
EP4224644A3 (en) 2023-09-13
CN104112982A (zh) 2014-10-22
EP2797184A2 (en) 2014-10-29

Similar Documents

Publication Publication Date Title
EP4224644A3 (en) Light source apparatus
PL3519021T3 (pl) Moduł elektroniczny do monitorowania urządzeń wstrzykujących
EP3598532A4 (en) BATTERY MODULE PROVIDED WITH CONNECTOR CUTTING DEVICE
KR20180084819A (ko) 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기
EP3358614A4 (en) SWITCHING SUBSTRATE AND SEMICONDUCTOR ELEMENT
EP2908333A4 (en) SEMICONDUCTOR COMPONENT, CERAMIC CONDUCTOR PLATE AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD
BR112017014758A2 (pt) arranjo de eletrodos para monitoramento fisiológico e dispositivo que inclui ou utiliza o mesmo
EP3007221A4 (en) CIRCUIT BOARD WITH CONTINUOUS ELECTRODE, METHOD FOR THE PRODUCTION THEREOF AND SEMICONDUCTOR COMPONENT
EP3444841A4 (en) LIGHT EMITTING DEVICE, HOUSING FOR A LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
EP3104720C0 (en) AEROSOL GENERATING SYSTEM COMPRISING A DEVICE AND A CARTRIDGE, IN WHICH THE DEVICE PROVIDES ELECTRICAL CONTACT WITH THE CARTRIDGE
EP4095895A3 (en) Through electrode substrate and semiconductor device using through electrode substrate
EP3714321C0 (en) ELECTRO-OPTICALLY ACTIVE DEVICE
BR112015018811A2 (pt) dispositivos sensores eletroquímicos miniaturizados implantáveis
EP2851969A4 (en) LIGHT-EMITTING SEMICONDUCTOR ELEMENT
PE20141866A1 (es) Sistema de suministro de material de impresion y cartucho
EP3353813A4 (en) SEMICONDUCTOR COMPONENT CONTACTS WITH INCREASED CONTACT SURFACE
GB201811613D0 (en) Electrode integration into organs on chip devices
EP3358615A4 (en) SILICONE NITRIDE SWITCH PALLET AND SEMICONDUCTOR MODULE THEREWITH
TW201614780A (en) Semiconductor devices having through electrodes, semiconductor packages including the same, methods of manufacturing the same, electronic systems including the same, and memory cards including the same
EP3352321A4 (en) BATTERY SUPPLY POWER SUPPLY, CIRCUIT AND ELECTRONIC INSTRUMENT
EP3598495A4 (en) NETWORK SUBSTRATE AND ITS MANUFACTURING PROCESS, DISPLAY PANEL, AND DISPLAY APPARATUS
TW201613142A (en) Light-emitting unit and semiconductor light-emitting device
MX2016014361A (es) Montaje de conector de placa de circuito impreso que tiene protector de contacto con miembros de fijacion integrales.
EP3562136A4 (en) IMAGE CAPTURE MODULE, PRINTED CIRCUIT BOARD ASSEMBLY, MANUFACTURING PROCESS, AND ELECTRONIC DEVICE INCLUDING AN IMAGE SENSOR MODULE
EP3306649A4 (en) PRESSURE CONTACT SEMICONDUCTOR COMPONENT