IN2013DE02875A - - Google Patents
Info
- Publication number
- IN2013DE02875A IN2013DE02875A IN2875DE2013A IN2013DE02875A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A IN 2875DE2013 A IN2875DE2013 A IN 2875DE2013A IN 2013DE02875 A IN2013DE02875 A IN 2013DE02875A
- Authority
- IN
- India
- Prior art keywords
- epoxy resin
- hardener
- self
- healing
- modified
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/025,215 US10221276B2 (en) | 2013-09-27 | 2014-09-26 | Self-healing epoxy resin composition |
EP14848204.5A EP3049256A4 (en) | 2013-09-27 | 2014-09-26 | A self-healing epoxy resin composition |
PCT/IB2014/001928 WO2015044757A1 (en) | 2013-09-27 | 2014-09-26 | A self-healing epoxy resin composition |
CN201480059536.9A CN105682936B (zh) | 2013-09-27 | 2014-09-26 | 一种自修复环氧树脂组合物 |
IN2875DE2013 IN2013DE02875A (es) | 2013-09-27 | 2014-09-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN2875DE2013 IN2013DE02875A (es) | 2013-09-27 | 2014-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2013DE02875A true IN2013DE02875A (es) | 2015-04-03 |
Family
ID=52742159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2875DE2013 IN2013DE02875A (es) | 2013-09-27 | 2014-09-26 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10221276B2 (es) |
EP (1) | EP3049256A4 (es) |
CN (1) | CN105682936B (es) |
IN (1) | IN2013DE02875A (es) |
WO (1) | WO2015044757A1 (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105440884B (zh) * | 2015-12-12 | 2017-12-19 | 青岛农业大学 | 一种水性环氧树脂自修复防腐蚀涂层的制备及应用 |
CN107602820B (zh) * | 2017-09-13 | 2019-06-25 | 中国科学院化学研究所 | 一种硅醇盐封端的有机硅多元胺固化剂及由其制备的自修复环氧树脂 |
CN108440740B (zh) * | 2018-02-14 | 2020-05-05 | 苏州大学 | 一种可逆自修复环氧树脂及其制备与回收重塑方法 |
US11193000B2 (en) | 2018-02-27 | 2021-12-07 | Soochow University | Reversible self-repairing epoxy resin and preparation and recovery remoulding method therefor |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR900000190B1 (ko) | 1984-11-16 | 1990-01-23 | 미쓰비시전기 주식회사 | 에폭시수지 조성물 |
JPS63130619A (ja) * | 1986-11-21 | 1988-06-02 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
JPH0259185A (ja) | 1988-08-25 | 1990-02-28 | Toshiba Corp | クラッド材の製造方法 |
JPH02258829A (ja) * | 1989-03-30 | 1990-10-19 | Toray Ind Inc | エポキシ系樹脂組成物 |
JP3012358B2 (ja) | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性エポキシ樹脂組成物 |
KR960010844B1 (ko) * | 1991-07-11 | 1996-08-09 | 제일모직 주식회사 | 내열성이 향상된 반도체소자 밀봉용 수지조성물 |
JPH06240002A (ja) * | 1993-02-19 | 1994-08-30 | Toray Dow Corning Silicone Co Ltd | オルガノポリシロキサンおよびその製造方法 |
US5939491A (en) * | 1997-08-01 | 1999-08-17 | Ppg Industries Ohio, Inc. | Curable compositions based on functional polysiloxanes |
JP3344315B2 (ja) * | 1998-04-28 | 2002-11-11 | 宇部興産株式会社 | 一色塗りポリイミドシロキサン系コ−ト材および硬化膜 |
WO2001086860A1 (en) | 2000-05-09 | 2001-11-15 | Verizon Laboratories Inc. | Stream-cipher method and apparatus |
JP3855649B2 (ja) * | 2000-09-26 | 2006-12-13 | 宇部興産株式会社 | 一液性エポキシ樹脂組成物および硬化物 |
DE102004022150A1 (de) | 2004-05-05 | 2005-12-01 | Henkel Kgaa | Zweikomponenten-Kleb-/ und Dichtstoff |
CN101469133B (zh) * | 2007-12-26 | 2012-01-04 | 国家纳米科学中心 | 具疏水、自清洁和自修复功能的高聚物复合材料及其用途 |
EP2326679A1 (en) | 2008-09-19 | 2011-06-01 | ABB Research Ltd. | Epoxy resin composition |
CN102482400B (zh) | 2009-07-14 | 2015-02-25 | Abb研究有限公司 | 环氧树脂组合物 |
CN102695739B (zh) | 2009-08-27 | 2014-08-13 | Abb研究有限公司 | 可固化环氧树脂组合物 |
WO2013042052A1 (en) * | 2011-09-19 | 2013-03-28 | Corinne Jean Greyling | Superhydrophobic coatings and methods of preparation |
JP5918590B2 (ja) | 2012-03-29 | 2016-05-18 | 東京電力株式会社 | 排ガス中のダイオキシン類分解処理方法及び処理装置 |
US9085719B2 (en) * | 2013-03-18 | 2015-07-21 | International Business Machines Corporation | Thermally reversible thermal interface materials with improved moisture resistance |
-
2014
- 2014-09-26 WO PCT/IB2014/001928 patent/WO2015044757A1/en active Application Filing
- 2014-09-26 US US15/025,215 patent/US10221276B2/en active Active
- 2014-09-26 IN IN2875DE2013 patent/IN2013DE02875A/en unknown
- 2014-09-26 EP EP14848204.5A patent/EP3049256A4/en active Pending
- 2014-09-26 CN CN201480059536.9A patent/CN105682936B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10221276B2 (en) | 2019-03-05 |
EP3049256A1 (en) | 2016-08-03 |
EP3049256A4 (en) | 2017-04-26 |
WO2015044757A1 (en) | 2015-04-02 |
CN105682936B (zh) | 2017-09-15 |
US20160229950A1 (en) | 2016-08-11 |
CN105682936A (zh) | 2016-06-15 |
WO2015044757A9 (en) | 2016-06-30 |
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