IN2009KN02420A - - Google Patents
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- Publication number
- IN2009KN02420A IN2009KN02420A IN2420KON2009A IN2009KN02420A IN 2009KN02420 A IN2009KN02420 A IN 2009KN02420A IN 2420KON2009 A IN2420KON2009 A IN 2420KON2009A IN 2009KN02420 A IN2009KN02420 A IN 2009KN02420A
- Authority
- IN
- India
- Prior art keywords
- radiation
- target material
- concerns
- scanner
- path
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
- H01J37/32339—Discharge generated by other radiation using electromagnetic radiation
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Physical Vapour Deposition (AREA)
- X-Ray Techniques (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20070158A FI20070158L (fi) | 2006-02-23 | 2007-02-23 | Järjestely |
PCT/FI2008/050083 WO2008102062A2 (en) | 2007-02-23 | 2008-02-22 | Method and arrangement for photon ablation of a target |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2009KN02420A true IN2009KN02420A (ko) | 2015-08-07 |
Family
ID=39636924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2420KON2009 IN2009KN02420A (ko) | 2007-02-23 | 2008-02-22 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8828506B2 (ko) |
EP (1) | EP2137336B1 (ko) |
JP (1) | JP5666138B2 (ko) |
KR (1) | KR101565099B1 (ko) |
DK (1) | DK2137336T3 (ko) |
IL (1) | IL199623A0 (ko) |
IN (1) | IN2009KN02420A (ko) |
WO (1) | WO2008102062A2 (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4637178B2 (ja) * | 2004-09-21 | 2011-02-23 | ヴィヴェス,ホアン イグレシアス | 赤外線を用いた粉末材料の造粒及び/又は乾燥方法及び装置 |
US20080311345A1 (en) * | 2006-02-23 | 2008-12-18 | Picodeon Ltd Oy | Coating With Carbon Nitride and Carbon Nitride Coated Product |
EP1994195A1 (en) * | 2006-02-23 | 2008-11-26 | Picodeon Ltd OY | Semiconductor and an arrangement and a method for producing a semiconductor |
FI20070889L (fi) * | 2007-11-21 | 2009-05-22 | Picodeon Ltd Oy | Pinnankäsittelymenetelmä |
PL2159300T3 (pl) * | 2008-08-25 | 2012-06-29 | Solmates Bv | Sposób osadzania materiału |
US9283638B2 (en) * | 2011-11-25 | 2016-03-15 | Rofin-Baasel Lasertech Gmbh & Co. Kg | Device for forming longitudinally spaced grooves or slits into a material web with a focused laser beam |
US10835313B2 (en) * | 2014-01-30 | 2020-11-17 | Medlumics S.L. | Radiofrequency ablation catheter with optical tissue evaluation |
FI126769B (en) | 2014-12-23 | 2017-05-15 | Picodeon Ltd Oy | Lighthouse type scanner with a rotating mirror and a circular target |
JP6568218B2 (ja) | 2014-12-23 | 2019-08-28 | ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー | 化学線硬化型高分子混合物、硬化高分子混合物、及び関連するプロセス |
ITRM20150111A1 (it) * | 2015-03-16 | 2016-09-16 | Lorusso Alessio | Sistema di movimentazione meccatronica per una macchina per la prototipazione rapida |
DE102015004163B4 (de) * | 2015-04-01 | 2017-03-23 | Primes Gmbh | Vorrichtung und Verfahren zur Bestimmung von Eigenschaften eines Laserstrahls |
US9812305B2 (en) | 2015-04-27 | 2017-11-07 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
US11049702B2 (en) | 2015-04-27 | 2021-06-29 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
US10522300B2 (en) | 2015-05-26 | 2019-12-31 | National Research Council Of Canada | Metallic surface with karstified relief, forming same, and high surface area metallic electrochemical interface |
US10373811B2 (en) * | 2015-07-24 | 2019-08-06 | Aes Global Holdings, Pte. Ltd | Systems and methods for single magnetron sputtering |
WO2017105960A1 (en) | 2015-12-17 | 2017-06-22 | Bridgestone Americas Tire Operations, Llc | Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing |
EP3532267B1 (en) | 2016-10-27 | 2023-03-01 | Bridgestone Americas Tire Operations, LLC | Processes for producing cured polymeric products by additive manufacturing |
KR101906854B1 (ko) * | 2017-07-25 | 2018-10-11 | 한전원자력연료 주식회사 | 이동형 핵연료 집합체 구조 변형 측정장비 |
EP3540090A1 (en) * | 2018-03-12 | 2019-09-18 | Solmates B.V. | Method for pulsed laser deposition |
DE102018003675A1 (de) * | 2018-05-04 | 2019-11-07 | Siltectra Gmbh | Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen Bauteilen |
EP3587620A1 (en) * | 2018-06-28 | 2020-01-01 | Solmates B.V. | Device for pulsed laser deposition and a substrate with a substrate surface for reduction of particles on the substrate |
DE202019005592U1 (de) * | 2019-01-22 | 2021-02-08 | Hegla Gmbh & Co. Kg | Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel |
WO2022161605A1 (en) * | 2021-01-27 | 2022-08-04 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Thermal laser evaporation system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4987007A (en) * | 1988-04-18 | 1991-01-22 | Board Of Regents, The University Of Texas System | Method and apparatus for producing a layer of material from a laser ion source |
JP3336682B2 (ja) | 1992-07-02 | 2002-10-21 | 住友電気工業株式会社 | 硬質炭素膜 |
JP3255469B2 (ja) * | 1992-11-30 | 2002-02-12 | 三菱電機株式会社 | レーザ薄膜形成装置 |
JPH0855821A (ja) * | 1994-08-16 | 1996-02-27 | Nec Corp | 薄膜形成装置および薄膜形成方法 |
US6063455A (en) | 1995-10-09 | 2000-05-16 | Institute For Advanced Engineering | Apparatus for manufacturing diamond film having a large area and method thereof |
AUPO912797A0 (en) * | 1997-09-11 | 1997-10-02 | Australian National University, The | Ultrafast laser deposition method |
WO2000022184A1 (en) | 1998-10-12 | 2000-04-20 | The Regents Of The University Of California | Laser deposition of thin films |
JP2004188437A (ja) | 2002-12-09 | 2004-07-08 | Fuji Photo Film Co Ltd | 微細傾斜面の加工方法 |
JP2005097698A (ja) | 2003-09-26 | 2005-04-14 | Kansai Electric Power Co Inc:The | 酸化物薄膜の形成方法 |
JP4436162B2 (ja) * | 2004-03-16 | 2010-03-24 | 株式会社リコー | レーザ加工装置 |
JP4534543B2 (ja) | 2004-03-19 | 2010-09-01 | 凸版印刷株式会社 | 超短パルスレーザーによる材料加工方法 |
US7723212B2 (en) | 2004-07-30 | 2010-05-25 | Mitsuboshi Diamond Industrial Co., Ltd | Method for forming median crack in substrate and apparatus for forming median crack in substrate |
EP1910013A2 (en) * | 2005-07-13 | 2008-04-16 | Picodeon Ltd OY | Radiation arrangement |
FI20060178L (fi) * | 2006-02-23 | 2007-08-24 | Picodeon Ltd Oy | Pinnoitusmenetelmä |
-
2008
- 2008-02-22 JP JP2009550738A patent/JP5666138B2/ja active Active
- 2008-02-22 KR KR1020097016607A patent/KR101565099B1/ko active IP Right Grant
- 2008-02-22 DK DK08718536.9T patent/DK2137336T3/da active
- 2008-02-22 IN IN2420KON2009 patent/IN2009KN02420A/en unknown
- 2008-02-22 WO PCT/FI2008/050083 patent/WO2008102062A2/en active Application Filing
- 2008-02-22 EP EP08718536.9A patent/EP2137336B1/en active Active
- 2008-02-22 US US12/522,991 patent/US8828506B2/en active Active
-
2009
- 2009-06-30 IL IL199623A patent/IL199623A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
IL199623A0 (en) | 2010-04-15 |
DK2137336T3 (da) | 2014-07-07 |
EP2137336B1 (en) | 2014-04-02 |
EP2137336A2 (en) | 2009-12-30 |
KR101565099B1 (ko) | 2015-11-03 |
WO2008102062A2 (en) | 2008-08-28 |
US8828506B2 (en) | 2014-09-09 |
US20100196624A1 (en) | 2010-08-05 |
JP2010519051A (ja) | 2010-06-03 |
WO2008102062A3 (en) | 2009-03-12 |
JP5666138B2 (ja) | 2015-02-12 |
KR20090116740A (ko) | 2009-11-11 |
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