IN2009KN02420A - - Google Patents

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Publication number
IN2009KN02420A
IN2009KN02420A IN2420KON2009A IN2009KN02420A IN 2009KN02420 A IN2009KN02420 A IN 2009KN02420A IN 2420KON2009 A IN2420KON2009 A IN 2420KON2009A IN 2009KN02420 A IN2009KN02420 A IN 2009KN02420A
Authority
IN
India
Prior art keywords
radiation
target material
concerns
scanner
path
Prior art date
Application number
Other languages
English (en)
Inventor
Jari Ruuttu
Vesa Myllymäki
Reijo Lappalainen
Lasse Pulli
Juha Mäkitalo
Sampo Ylätalo
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20070158A external-priority patent/FI20070158L/fi
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Publication of IN2009KN02420A publication Critical patent/IN2009KN02420A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321—Discharge generated by other radiation
    • H01J37/32339—Discharge generated by other radiation using electromagnetic radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • X-Ray Techniques (AREA)
  • Coating By Spraying Or Casting (AREA)
IN2420KON2009 2007-02-23 2008-02-22 IN2009KN02420A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20070158A FI20070158L (fi) 2006-02-23 2007-02-23 Järjestely
PCT/FI2008/050083 WO2008102062A2 (en) 2007-02-23 2008-02-22 Method and arrangement for photon ablation of a target

Publications (1)

Publication Number Publication Date
IN2009KN02420A true IN2009KN02420A (es) 2015-08-07

Family

ID=39636924

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2420KON2009 IN2009KN02420A (es) 2007-02-23 2008-02-22

Country Status (8)

Country Link
US (1) US8828506B2 (es)
EP (1) EP2137336B1 (es)
JP (1) JP5666138B2 (es)
KR (1) KR101565099B1 (es)
DK (1) DK2137336T3 (es)
IL (1) IL199623A0 (es)
IN (1) IN2009KN02420A (es)
WO (1) WO2008102062A2 (es)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4637178B2 (ja) * 2004-09-21 2011-02-23 ヴィヴェス，ホアン イグレシアス 赤外線を用いた粉末材料の造粒及び／又は乾燥方法及び装置
US20080311345A1 (en) * 2006-02-23 2008-12-18 Picodeon Ltd Oy Coating With Carbon Nitride and Carbon Nitride Coated Product
EP1994195A1 (en) * 2006-02-23 2008-11-26 Picodeon Ltd OY Semiconductor and an arrangement and a method for producing a semiconductor
FI20070889L (fi) * 2007-11-21 2009-05-22 Picodeon Ltd Oy Pinnankäsittelymenetelmä
PL2159300T3 (pl) * 2008-08-25 2012-06-29 Solmates Bv Sposób osadzania materiału
US9283638B2 (en) * 2011-11-25 2016-03-15 Rofin-Baasel Lasertech Gmbh & Co. Kg Device for forming longitudinally spaced grooves or slits into a material web with a focused laser beam
US10835313B2 (en) * 2014-01-30 2020-11-17 Medlumics S.L. Radiofrequency ablation catheter with optical tissue evaluation
FI126769B (en) 2014-12-23 2017-05-15 Picodeon Ltd Oy Lighthouse type scanner with a rotating mirror and a circular target
JP6568218B2 (ja) 2014-12-23 2019-08-28 ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー 化学線硬化型高分子混合物、硬化高分子混合物、及び関連するプロセス
ITRM20150111A1 (it) * 2015-03-16 2016-09-16 Lorusso Alessio Sistema di movimentazione meccatronica per una macchina per la prototipazione rapida
DE102015004163B4 (de) * 2015-04-01 2017-03-23 Primes Gmbh Vorrichtung und Verfahren zur Bestimmung von Eigenschaften eines Laserstrahls
US9812305B2 (en) 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US10522300B2 (en) 2015-05-26 2019-12-31 National Research Council Of Canada Metallic surface with karstified relief, forming same, and high surface area metallic electrochemical interface
US10373811B2 (en) * 2015-07-24 2019-08-06 Aes Global Holdings, Pte. Ltd Systems and methods for single magnetron sputtering
WO2017105960A1 (en) 2015-12-17 2017-06-22 Bridgestone Americas Tire Operations, Llc Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing
EP3532267B1 (en) 2016-10-27 2023-03-01 Bridgestone Americas Tire Operations, LLC Processes for producing cured polymeric products by additive manufacturing
KR101906854B1 (ko) * 2017-07-25 2018-10-11 한전원자력연료 주식회사 이동형 핵연료 집합체 구조 변형 측정장비
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
DE102018003675A1 (de) * 2018-05-04 2019-11-07 Siltectra Gmbh Verfahren zum Abtrennen von Festkörperschichten von Kompositstrukturen aus SiC und einer metallischen Beschichtung oder elektrischen Bauteilen
EP3587620A1 (en) * 2018-06-28 2020-01-01 Solmates B.V. Device for pulsed laser deposition and a substrate with a substrate surface for reduction of particles on the substrate
DE202019005592U1 (de) * 2019-01-22 2021-02-08 Hegla Gmbh & Co. Kg Vorrichtung zum Bearbeiten und zum Trennen einer Verbundsicherheitsglastafel
WO2022161605A1 (en) * 2021-01-27 2022-08-04 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Thermal laser evaporation system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987007A (en) * 1988-04-18 1991-01-22 Board Of Regents, The University Of Texas System Method and apparatus for producing a layer of material from a laser ion source
JP3336682B2 (ja) 1992-07-02 2002-10-21 住友電気工業株式会社 硬質炭素膜
JP3255469B2 (ja) * 1992-11-30 2002-02-12 三菱電機株式会社 レーザ薄膜形成装置
JPH0855821A (ja) * 1994-08-16 1996-02-27 Nec Corp 薄膜形成装置および薄膜形成方法
US6063455A (en) 1995-10-09 2000-05-16 Institute For Advanced Engineering Apparatus for manufacturing diamond film having a large area and method thereof
AUPO912797A0 (en) * 1997-09-11 1997-10-02 Australian National University, The Ultrafast laser deposition method
WO2000022184A1 (en) 1998-10-12 2000-04-20 The Regents Of The University Of California Laser deposition of thin films
JP2004188437A (ja) 2002-12-09 2004-07-08 Fuji Photo Film Co Ltd 微細傾斜面の加工方法
JP2005097698A (ja) 2003-09-26 2005-04-14 Kansai Electric Power Co Inc:The 酸化物薄膜の形成方法
JP4436162B2 (ja) * 2004-03-16 2010-03-24 株式会社リコー レーザ加工装置
JP4534543B2 (ja) 2004-03-19 2010-09-01 凸版印刷株式会社 超短パルスレーザーによる材料加工方法
US7723212B2 (en) 2004-07-30 2010-05-25 Mitsuboshi Diamond Industrial Co., Ltd Method for forming median crack in substrate and apparatus for forming median crack in substrate
EP1910013A2 (en) * 2005-07-13 2008-04-16 Picodeon Ltd OY Radiation arrangement
FI20060178L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Pinnoitusmenetelmä

Also Published As

Publication number Publication date
IL199623A0 (en) 2010-04-15
DK2137336T3 (da) 2014-07-07
EP2137336B1 (en) 2014-04-02
EP2137336A2 (en) 2009-12-30
KR101565099B1 (ko) 2015-11-03
WO2008102062A2 (en) 2008-08-28
US8828506B2 (en) 2014-09-09
US20100196624A1 (en) 2010-08-05
JP2010519051A (ja) 2010-06-03
WO2008102062A3 (en) 2009-03-12
JP5666138B2 (ja) 2015-02-12
KR20090116740A (ko) 2009-11-11

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