IN192638B - - Google Patents

Info

Publication number
IN192638B
IN192638B IN916MA1996A IN192638B IN 192638 B IN192638 B IN 192638B IN 916MA1996 A IN916MA1996 A IN 916MA1996A IN 192638 B IN192638 B IN 192638B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Kurt Faller
Toni Dr Frey
Helmut Keser
Ferdinand Steinruck
Raymond Dr Zehringer
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of IN192638B publication Critical patent/IN192638B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IN916MA1996 1995-08-17 1996-05-30 IN192638B (ca)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19530264A DE19530264A1 (de) 1995-08-17 1995-08-17 Leistungshalbleitermodul

Publications (1)

Publication Number Publication Date
IN192638B true IN192638B (ca) 2004-05-08

Family

ID=7769712

Family Applications (1)

Application Number Title Priority Date Filing Date
IN916MA1996 IN192638B (ca) 1995-08-17 1996-05-30

Country Status (6)

Country Link
US (1) US5705853A (ca)
EP (1) EP0762496B1 (ca)
JP (1) JP4020990B2 (ca)
CN (1) CN1089493C (ca)
DE (2) DE19530264A1 (ca)
IN (1) IN192638B (ca)

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EP1263046A1 (de) * 2001-06-01 2002-12-04 ABB Schweiz AG Kontaktanordnung
EP1263045A1 (en) * 2001-06-01 2002-12-04 ABB Schweiz AG High power semiconductor module
DE10149886A1 (de) * 2001-10-10 2003-04-30 Eupec Gmbh & Co Kg Leistunghalbleitermodul
EP1318545A1 (de) * 2001-12-06 2003-06-11 Abb Research Ltd. Leistungshalbleiter-Submodul und Leistungshalbleiter-Modul
EP1318547B1 (de) 2001-12-06 2013-04-17 ABB Research Ltd. Leistungshalbleiter-Modul
DE10244748A1 (de) * 2002-09-25 2003-09-11 Siemens Ag Leistungshalbleitermodul und Verfahren zur Herstellung desselben
DE10326176A1 (de) * 2003-06-10 2005-01-05 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleitermodul
DE10352671A1 (de) 2003-11-11 2005-06-23 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungsmodul
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KR101243515B1 (ko) 2008-03-20 2013-03-20 에이비비 테크놀로지 아게 전압 소스 컨버터
DE102008033852B3 (de) * 2008-07-19 2009-09-10 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul und Verfahren zu deren Herstellung
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
US8742814B2 (en) 2009-07-15 2014-06-03 Yehuda Binder Sequentially operated modules
US8602833B2 (en) 2009-08-06 2013-12-10 May Patents Ltd. Puzzle with conductive path
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
US9019718B2 (en) 2011-08-26 2015-04-28 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US9597607B2 (en) 2011-08-26 2017-03-21 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
US11330714B2 (en) 2011-08-26 2022-05-10 Sphero, Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
WO2013057172A1 (en) 2011-10-21 2013-04-25 Abb Technology Ag Power semiconducter module and power semiconductor module assembly with multiple power semiconducter modules
FR2994333B1 (fr) 2012-08-03 2014-08-01 Ge Energy Power Conversion Technology Ltd Dispositif electronique semi-conducteur destine a etre monte dans un ensemble a empilement presse et ensemble a empilement presse comportant un tel dispositif
US8987876B2 (en) * 2013-03-14 2015-03-24 General Electric Company Power overlay structure and method of making same
JP6043238B2 (ja) * 2013-04-26 2016-12-14 株式会社豊田中央研究所 半導体モジュール
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
JP6480098B2 (ja) * 2013-10-31 2019-03-06 三菱電機株式会社 半導体装置
JP6189798B2 (ja) * 2014-07-08 2017-08-30 日立オートモティブシステムズ株式会社 電力変換装置
CN105336723B (zh) * 2014-07-28 2018-09-14 通用电气公司 半导体模块、半导体模块组件及半导体装置
US10147699B2 (en) * 2015-05-26 2018-12-04 Mitsubishi Electric Corporation Pressure contact type semiconductor apparatus
DE112016007205B4 (de) 2016-09-09 2025-09-11 Mitsubishi Electric Corporation Halbleitervorrichtung
JP6692438B2 (ja) * 2016-09-13 2020-05-13 三菱電機株式会社 半導体モジュール
JP6688198B2 (ja) * 2016-09-27 2020-04-28 日本発條株式会社 圧接ユニットおよび電力用半導体装置
CN108428677B (zh) * 2018-03-16 2020-09-11 全球能源互联网研究院有限公司 一种压接型igbt弹性压装结构及压接型igbt封装结构
EP3696854A1 (de) * 2019-02-13 2020-08-19 Siemens Aktiengesellschaft Leistungshalbleitermodul und verfahren zur herstellung eines leistungshalbleitermoduls
US11616844B2 (en) 2019-03-14 2023-03-28 Sphero, Inc. Modular electronic and digital building systems and methods of using the same
EP3926670A1 (de) 2020-06-15 2021-12-22 Siemens Aktiengesellschaft Leistungshalbleitermodul mit zumindest einem leistungshalbleiterelement

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Also Published As

Publication number Publication date
JPH09107068A (ja) 1997-04-22
EP0762496B1 (de) 2005-07-13
EP0762496A3 (de) 1999-05-06
CN1089493C (zh) 2002-08-21
EP0762496A2 (de) 1997-03-12
JP4020990B2 (ja) 2007-12-12
DE59611245D1 (de) 2005-08-18
US5705853A (en) 1998-01-06
CN1149202A (zh) 1997-05-07
DE19530264A1 (de) 1997-02-20

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