GB1055673A - Improved electrode connections in a semi-conductor housing - Google Patents

Improved electrode connections in a semi-conductor housing

Info

Publication number
GB1055673A
GB1055673A GB815165A GB815165A GB1055673A GB 1055673 A GB1055673 A GB 1055673A GB 815165 A GB815165 A GB 815165A GB 815165 A GB815165 A GB 815165A GB 1055673 A GB1055673 A GB 1055673A
Authority
GB
United Kingdom
Prior art keywords
pin
conductor
semi
sleeve
conductor housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB815165A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD PRAHA NARODNT PODNIK
Original Assignee
CKD PRAHA NARODNT PODNIK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD PRAHA NARODNT PODNIK filed Critical CKD PRAHA NARODNT PODNIK
Publication of GB1055673A publication Critical patent/GB1055673A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

1,055,673. Sleeve couplings. CKD PRAHA, NARODNI PODNIK. Feb. 25, 1965 [March 31, 1964; Sept. 25, 1964], No. 8151/65. Heading H2E. [Also in Division H1] Two conductors are joined together using a recessed pin, one conductor lying within the recess while the other abuts or lies over the pin, a sleeve being placed around the conductors and pin and crimped in such a manner as to hold the assembly together. In an embodiment a vacuum tight housing containing a semi-conductor system 2 soldered to a base 1 is formed by a bushing 3 and insulator 4. A stranded conductor 6 lies within the recessed pin 5 which has a further stranded conductor 8 lying over it and a sleeve 9 crimped thereto. In an alternative embodiment (Fig. 2, not shown) the pin 5 is not pointed but flat at its upper end and this end abuts the conductor 8.
GB815165A 1964-03-31 1965-02-25 Improved electrode connections in a semi-conductor housing Expired GB1055673A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CS182764 1964-03-31
CS532564 1964-09-29

Publications (1)

Publication Number Publication Date
GB1055673A true GB1055673A (en) 1967-01-18

Family

ID=25745509

Family Applications (1)

Application Number Title Priority Date Filing Date
GB815165A Expired GB1055673A (en) 1964-03-31 1965-02-25 Improved electrode connections in a semi-conductor housing

Country Status (3)

Country Link
CH (1) CH432659A (en)
DE (1) DE1489736B2 (en)
GB (1) GB1055673A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530264A1 (en) * 1995-08-17 1997-02-20 Abb Management Ag Power semiconductor module

Also Published As

Publication number Publication date
DE1489736B2 (en) 1974-08-22
DE1489736A1 (en) 1969-11-06
CH432659A (en) 1967-03-31

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