DE1489736A1 - Encapsulation electrode for semiconductor elements - Google Patents

Description

Patent attorney
Dipl,: i ,,. Urr.precht _r - 1489736

Monks 22, Stalnadortotr. 10

Expl.

233-10.443P March 31, 1965

ÖKD Prah *, narodni podnik, P r a h a 9 (OSSR) Electrode of an encapsulation for semiconductor elements

The invention relates to an arrangement of a sheet metal electrode an encapsulation for semiconductor element * alt a tendon member connected within the encapsulation and an auxiliary conductor outside the enclosure

Encapsulations for semiconductor elements «, especially those which are used in the 8tarkstroBteohnik consist in usually from a base plate on which a semiconductor element is arranged and which sugleioh one of the electrodes forms and a bushing within which the «wide electrode is electrically isolated from the base plate · Zwieohen ( An expansion member is arranged between the electrode and the semiconductor element, which provides the electrical connection between these two Manufactures parts Outside the enclosure, a current-carrying conductor is connected to the electrode

This is the most important of the construction of the encapsulation The requirements imposed is the compliance with the vacuum flexibility of the interior and the hats of the semiconductor team against Penetration τοη Teruarslaiguiigeii.

233-S3932-LH (6)

909146/1248

With these requirements in mind, one of the most important problems is a suitable design of the electrode ssjBt expansion member and ladder in such a way that both the vacuum tight that is, as well as good electrical conductivity and the ability of the components used to adapt to thermal expansion is guaranteed.

laoh the known state of leohnik this problem is solved in different ways. One of the well-known measures consists in inserting a conductor in the encapsulation is introduced, which relohts up to the actual semiconductor element Ba the strand conductor impurities on the semiconductor element could bring the same at its end protruding into the interior of the encapsulation with a vacuum-sealed envelope be provided, which is in vacuum-tight connection with the implementation. Sine of the well-known servings is known as Corrugated pipe executed.

Another known solution consists in the use of an expansion member designed as an independent part, which forms a conductive connection between the semiconductor element and the electrode within the encapsulation. The leader is to the Electrode connected outside the enclosure. Such constructions meet all, ac the properties of the encapsulation requirements, especially what the vacuum tightness is concerned.

909845/1246 bad original

U89736

The construction of the feedthrough and electrode is however complicated. In each of these designs, the expansion member housed inside the encapsulation and the conductor are on attached to the electrode by two independent means * This disadvantage is also present in those versions with which both the expansion member and the conductor are attached to the electrode by means of a deformation, the so-called indentation are. I am a confused part of all these well-known Versions consists in that the attachment of the expansion member and the conductor in the axial direction one behind the other carried out 1st, which adversely affects the external dimensions of the degree affects

The invention is based on these known designs, in which the expansion member is an independent, with respect to the conductor forms a separate part enclosed within the encapsulation, and relates to an arrangement of the electrode on a new and more advantageous way (

The new Herkaal of the encapsulation for semiconductor elements of the invention is that over the end of the electrode and the conductor resting on it is pulled over a sleeve which is attached to the conductor and the electrode duroh deformation is, the deformation of the sleeve at the point where the conductor rests against the Al · electrode to a single depth, AsJ Both the electrode and the expansion member are deformed on the same side and so you are connected and firmly connected.

909845/1246

The encapsulation according to the invention is further improved by that an outwardly protruding pin is provided at the closed end of the electrode, on which a Litsenleiter is attached, and the attachment of the conductor ensuring deformation takes place at the point of Cones instead.

Furthermore, the subject matter of the invention can be improved in that a channel provided in the electrode is used as a receptacle of the end of the expansion member into the peg, on which the conductor is attached, and the deformation takes place in a single place, and was so deep that the sleeve, the conductor, the electrode, and the dilator were at the same time deformed and connected

In the case of the encapsulation of semiconductor elements, it is part of the goal that the expansion member and the ladder within the ab-closure have the same size · durohmeters. In order to meet this requirement, the arrangement of the electrode is solved in such a way that there is one which forms the end of the conductor and extends over the electrode coated sleeve at the point iss leaning over the conductor has the same inner diameter as the channel within the electrode bsw. the protruding pin, in soft the expansion member is oktokt.

In comparison to the designs that have become known, the invention achieves a more economical production,

909845/1246

BATH ORIGINAL

which is due to a simpler manufacturing process. In particular in the embodiments described is achieved by the invention that in one and the same operation by which the necessary deformation is made, both the ladder, and the expansion member are attached to the electrode. A significant advantage of this design is also essential Reduction of the external dimensions of the encapsulation by the fact that both the expansion member, as the conductors are also fastened in the axial direction at one and the same point. Stay here all the advantages of reliable vacuum sealing, as well as protection against the ingress of contaminants to the semiconductor element persist.

Should a stranded conductor be used as a conductor, the electrode according to the invention is designed in such a way that one is attached to it arranged peg is provided with a point above the floor closing the channel, on which the stranded conductor is stuck will.

In the drawing, the invention is illustrated by way of example; show it

Pig. 1 shows a longitudinal section through the encapsulation;

Fig. 2 is a longitudinal section through the encapsulation, the conductor and the expansion member having the same durometer exhibit.

BATH

909845/1248

The semiconductor element 2 is arranged on the base plate 1 and is soldered to the same. The implementation 3 with an insulation part 4 carries the electrode 5. The expansion member 6, designed as a stranded conductor, is attached to the electrode 5 and is shown in FIG an axial channel in the pin 7 of the electrode 5 protrudes. The channel is finished in vertical direction and at the end of the spigot a tip is provided. The electrode 5 is in the implementation "3 arranged so that the with its pin 7, which the channel with inserted expansion member 6, protrudes outward from the implementation.

The conductor 8 is designed as a stranded conductor which is plugged onto the pin 7 from the outside and surrounds it on all sides. The sleeve 9 is sucked up over the end of the stranded conductor widened in this way. For an easier arrangement of the conductor β and the Sleeve 9 and the electrode 5, the outer surface of the electrode 5 is stepped into two cylindrical parts with seating surfaces.

laoh plugging in the soldered to the semiconductor element Expansion member 6 in the channel, the electrode and after attachment the passage 3 on the base plate 1 is over the outer surface the electrode 5 or the pin 7t of the conductor 8 pushed over. The sleeve 9 is coated over the same. The sleeve is on it duroh impressions deformed, so that the electrode or the pin 7 are also deformed at the same time. This will result in a single Operation of both the head 8, **. s also the expansion link 6

909845/1246

BATH ORIGINAL

U89736

attached to the electrode, and swar in the same place in one and the same distance τοη the base plate.

In FIG. 2, a yerbiming sleeve 9, which forms the conductor θ and is fixed to it by pressing, has in its part sucked onto the conductor 8 the same inner diameter as the channel in the electrode 5 into which the expansion conductor 6 is inserted · the stepped on grOfieren diameter ä HUlsenteil uafafit the cup-shaped electrode 5 and is printed at a low position at which the Dehnungeleiter 6 detects the bit electrode is connected daduroh gleiohseitig "

It is obvious that instead of a "Litsenleitere" any other suitable material can be used both for the expansion member 6 and also for the conductor θ

BATH ORIGINAL 909845/1246

Claims (4)

- 8 claims 1. Electrode of an encapsulation for semiconductor element, which vacuum-tight by means of an electrically insulating part is attached to the base plate of the enclosure, which the «width of the Forms electrodes and which has an externally closed channel inside, in which a channel inside the encapsulation arranged expansion member is introduced, which the electrical Connection between the electrode and the semiconductor element is established, the electrode protruding from the encapsulation in such a way that that the expansion member introduced into it can be attached to it by deformation taking place from the outside, and to the A conductor is attached to the electrode from the outside, characterized in that the The end of the electrode (5) and the conductor (8) resting on the same are fastened to the conductor and the electrode by deformation Sleeve (9) is coated, the deformation of the ) Sleeve is carried out at the point of contact with the electrode to such a depth that both the electrode and the expansion member (6) are deformed at the same time. 2. electrode of an encapsulation for semiconductor elements according to claim 1, characterized in that at the closed end the electrode (5) is provided with an outwardly protruding pin (7) on which the conductor (8) has an inside arranged channel is plugged on and the deformation ensuring the attachment of the conductor at the location of the pin 7 lies. 9 0 9 8 4 5/1246 3 * Electrode of an encapsulation for neck conductor elements according to the Claims 1 and 2, daduroh known, that the In the Electrode (5) penetrates the channel in the pin (7), on which the conductor (8) is struck and the deformation has been carried out in a single place and down to such a point Depth acts that sugleioh the HUI «· (9), the head (8), the Electrode (5 or 7) and the expansion member (6) are deformed » 4. Electrode of an encapsulation for semiconductor elements naoh den Claims 1 to 3, characterized in that the sleeve (9) the end piece of the conductor "(8) forms and in its part with which it is sucked onto the conductor, the same durometer how the channel within the electrode (5) or in the pin (7) of the electrode, in which the "expansion member (6)" is ingested is. BATH 909845/1246 Blank page