IN191646B - - Google Patents

Info

Publication number
IN191646B
IN191646B IN1703CA1997A IN191646B IN 191646 B IN191646 B IN 191646B IN 1703CA1997 A IN1703CA1997 A IN 1703CA1997A IN 191646 B IN191646 B IN 191646B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Manfred Fries
Peter Stampka
Michael Huber
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN191646B publication Critical patent/IN191646B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
IN1703CA1997 1996-09-23 1997-09-16 IN191646B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19639033A DE19639033C1 (de) 1996-09-23 1996-09-23 Analysierschutz für einen Halbleiterchip

Publications (1)

Publication Number Publication Date
IN191646B true IN191646B (zh) 2003-12-13

Family

ID=7806632

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1703CA1997 IN191646B (zh) 1996-09-23 1997-09-16

Country Status (5)

Country Link
US (1) US6201296B1 (zh)
EP (1) EP0931344A1 (zh)
DE (1) DE19639033C1 (zh)
IN (1) IN191646B (zh)
WO (1) WO1998013872A1 (zh)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19639033C1 (de) * 1996-09-23 1997-08-07 Siemens Ag Analysierschutz für einen Halbleiterchip
AUPO817697A0 (en) * 1997-07-22 1997-08-14 Green, James Edward Security system
WO2000002159A1 (en) * 1998-07-07 2000-01-13 Koninklijke Philips Electronics N.V. Data carrier provided with data processing means and current peak pattern suppression means
WO2000011719A1 (de) * 1998-08-18 2000-03-02 Infineon Technologies Ag Halbleiterchip mit oberflächenabdeckung
US6373447B1 (en) * 1998-12-28 2002-04-16 Kawasaki Steel Corporation On-chip antenna, and systems utilizing same
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード
US7054162B2 (en) * 2000-02-14 2006-05-30 Safenet, Inc. Security module system, apparatus and process
DE10014303C1 (de) * 2000-03-23 2001-06-07 Infineon Technologies Ag Halbleiterbauelement mit Analysierschutz
WO2002048980A1 (en) * 2000-12-15 2002-06-20 Electrox Corp. Process for the manufacture of novel, inexpensive radio frequency identification devices
DE10065339B4 (de) * 2000-12-27 2004-04-15 Infineon Technologies Ag Kapazitiver Sensor als Schutzvorrichtung gegen Angriffe auf einen Sicherheitschip
DE10101281C1 (de) * 2001-01-12 2002-06-06 Infineon Technologies Ag Schutzschaltung gegen die Möglichkeit des Ausspionierens von Daten bzw. Informationen
DE10101330A1 (de) * 2001-01-13 2002-07-18 Philips Corp Intellectual Pty Elektrische oder elektronische Schaltungsanordnung und Verfahren zum Schützen der selben von Manipulation und/oder Missbrauch
DE10105987A1 (de) * 2001-02-09 2002-08-29 Infineon Technologies Ag Datenverarbeitungsvorrichtung
US7490250B2 (en) 2001-10-26 2009-02-10 Lenovo (Singapore) Pte Ltd. Method and system for detecting a tamper event in a trusted computing environment
US7525330B2 (en) * 2001-11-28 2009-04-28 Nxp, B.V. Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identity of the semiconductor device
DE10251317B4 (de) * 2001-12-04 2006-06-14 Infineon Technologies Ag Halbleiterchip
DE10218096A1 (de) * 2002-04-23 2003-11-13 Infineon Technologies Ag Integrierte Schaltung
KR100528673B1 (ko) * 2003-04-09 2005-11-16 주식회사 퓨쳐시스템 비상시 데이터 소거 장치
US7180008B2 (en) * 2004-01-23 2007-02-20 Pitney Bowes Inc. Tamper barrier for electronic device
US7342299B2 (en) * 2005-09-21 2008-03-11 International Business Machines Corporation Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
US7385491B2 (en) * 2005-09-28 2008-06-10 Itt Manufacturing Enterprises, Inc. Tamper monitor circuit
JP2007189110A (ja) * 2006-01-13 2007-07-26 Sharp Corp 半導体装置及びその製造方法
DE102007051788A1 (de) * 2007-10-30 2009-05-14 Giesecke & Devrient Gmbh Halbleiterchip mit einer Schutzschicht und Verfahren zum Betrieb eines Halbleiterchip
DE102008036422A1 (de) * 2008-08-05 2010-02-11 Infineon Technologies Ag Halbleiter-Chip mit Prüfeinrichtung
US9342710B2 (en) * 2013-11-21 2016-05-17 Nxp B.V. Electronic tamper detection
US9560737B2 (en) 2015-03-04 2017-01-31 International Business Machines Corporation Electronic package with heat transfer element(s)
US10426037B2 (en) 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US9894749B2 (en) 2015-09-25 2018-02-13 International Business Machines Corporation Tamper-respondent assemblies with bond protection
US9911012B2 (en) 2015-09-25 2018-03-06 International Business Machines Corporation Overlapping, discrete tamper-respondent sensors
US9924591B2 (en) 2015-09-25 2018-03-20 International Business Machines Corporation Tamper-respondent assemblies
US9578764B1 (en) 2015-09-25 2017-02-21 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US9591776B1 (en) 2015-09-25 2017-03-07 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s)
US10172239B2 (en) 2015-09-25 2019-01-01 International Business Machines Corporation Tamper-respondent sensors with formed flexible layer(s)
US10175064B2 (en) 2015-09-25 2019-01-08 International Business Machines Corporation Circuit boards and electronic packages with embedded tamper-respondent sensor
US10098235B2 (en) 2015-09-25 2018-10-09 International Business Machines Corporation Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US10143090B2 (en) 2015-10-19 2018-11-27 International Business Machines Corporation Circuit layouts of tamper-respondent sensors
US9978231B2 (en) 2015-10-21 2018-05-22 International Business Machines Corporation Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)
US9913389B2 (en) 2015-12-01 2018-03-06 International Business Corporation Corporation Tamper-respondent assembly with vent structure
US10327343B2 (en) 2015-12-09 2019-06-18 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9555606B1 (en) 2015-12-09 2017-01-31 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9554477B1 (en) 2015-12-18 2017-01-24 International Business Machines Corporation Tamper-respondent assemblies with enclosure-to-board protection
US9916744B2 (en) 2016-02-25 2018-03-13 International Business Machines Corporation Multi-layer stack with embedded tamper-detect protection
US9904811B2 (en) 2016-04-27 2018-02-27 International Business Machines Corporation Tamper-proof electronic packages with two-phase dielectric fluid
US9913370B2 (en) 2016-05-13 2018-03-06 International Business Machines Corporation Tamper-proof electronic packages formed with stressed glass
US9881880B2 (en) 2016-05-13 2018-01-30 International Business Machines Corporation Tamper-proof electronic packages with stressed glass component substrate(s)
US9858776B1 (en) 2016-06-28 2018-01-02 International Business Machines Corporation Tamper-respondent assembly with nonlinearity monitoring
US10321589B2 (en) 2016-09-19 2019-06-11 International Business Machines Corporation Tamper-respondent assembly with sensor connection adapter
US10299372B2 (en) 2016-09-26 2019-05-21 International Business Machines Corporation Vented tamper-respondent assemblies
US10271424B2 (en) 2016-09-26 2019-04-23 International Business Machines Corporation Tamper-respondent assemblies with in situ vent structure(s)
US9999124B2 (en) 2016-11-02 2018-06-12 International Business Machines Corporation Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
US10327329B2 (en) 2017-02-13 2019-06-18 International Business Machines Corporation Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
US10306753B1 (en) 2018-02-22 2019-05-28 International Business Machines Corporation Enclosure-to-board interface with tamper-detect circuit(s)
US11122682B2 (en) 2018-04-04 2021-09-14 International Business Machines Corporation Tamper-respondent sensors with liquid crystal polymer layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2617979B1 (fr) * 1987-07-10 1989-11-10 Thomson Semiconducteurs Dispositif de detection de la depassivation d'un circuit integre
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
FR2649817B1 (fr) * 1989-07-13 1993-12-24 Gemplus Card International Carte a microcircuit protegee contre l'intrusion
DE4018688C2 (de) * 1990-06-11 1998-07-02 Siemens Ag Verfahren zum Schutz einer integrierten Schaltung gegen das Auslesen sensitiver Daten
US5389738A (en) * 1992-05-04 1995-02-14 Motorola, Inc. Tamperproof arrangement for an integrated circuit device
JP3305843B2 (ja) * 1993-12-20 2002-07-24 株式会社東芝 半導体装置
FR2727227B1 (fr) * 1994-11-17 1996-12-20 Schlumberger Ind Sa Dispositif de securite actif a memoire electronique
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
AU6238396A (en) * 1995-08-01 1997-02-26 Austria Card Plastikkarten Und Ausweissysteme Gmbh Card-shaped data carrier for contactless applications with acomponent and a transmission system for the contactless applcations, method of producing such a card-shaped data carrier and module therefor
US5861652A (en) * 1996-03-28 1999-01-19 Symbios, Inc. Method and apparatus for protecting functions imbedded within an integrated circuit from reverse engineering
DE19639033C1 (de) * 1996-09-23 1997-08-07 Siemens Ag Analysierschutz für einen Halbleiterchip

Also Published As

Publication number Publication date
EP0931344A1 (de) 1999-07-28
DE19639033C1 (de) 1997-08-07
US6201296B1 (en) 2001-03-13
WO1998013872A1 (de) 1998-04-02

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