IN189112B - - Google Patents

Info

Publication number
IN189112B
IN189112B IN985CA1996A IN189112B IN 189112 B IN189112 B IN 189112B IN 985CA1996 A IN985CA1996 A IN 985CA1996A IN 189112 B IN189112 B IN 189112B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Frank Dr Lau
Wolfgang Dr Kreutschneider
Manfred Dr Engelhardt
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN189112B publication Critical patent/IN189112B/en

Links

Classifications

    • H10P14/69215
    • H10P50/283
    • H10W10/0145
    • H10W10/041
    • H10W10/17
    • H10W10/40
IN985CA1996 1995-07-10 1996-05-30 IN189112B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19525072A DE19525072C2 (de) 1995-07-10 1995-07-10 Integrierte Schaltungsanordnung, bei der ein erstes Bauelement an einer Hauptfläche eines Halbleitersubstrats und ein zweites Bauelement am Grabenboden angeordnet sind, und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
IN189112B true IN189112B (OSRAM) 2002-12-21

Family

ID=7766444

Family Applications (1)

Application Number Title Priority Date Filing Date
IN985CA1996 IN189112B (OSRAM) 1995-07-10 1996-05-30

Country Status (9)

Country Link
US (1) US5990536A (OSRAM)
EP (1) EP0838089B1 (OSRAM)
JP (1) JPH11509043A (OSRAM)
KR (1) KR100418849B1 (OSRAM)
CN (1) CN1093983C (OSRAM)
AR (1) AR002791A1 (OSRAM)
DE (2) DE19525072C2 (OSRAM)
IN (1) IN189112B (OSRAM)
WO (1) WO1997003463A1 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6218720B1 (en) * 1998-10-21 2001-04-17 Advanced Micro Devices, Inc. Semiconductor topography employing a nitrogenated shallow trench isolation structure
US7071043B2 (en) * 2002-08-15 2006-07-04 Micron Technology, Inc. Methods of forming a field effect transistor having source/drain material over insulative material
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134445A (ja) * 1982-02-05 1983-08-10 Seiko Epson Corp 半導体装置の製造方法
JPS58169934A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 半導体集積回路装置
JPS61135151A (ja) * 1984-12-05 1986-06-23 Mitsubishi Electric Corp 半導体記憶装置
US5176789A (en) * 1985-09-21 1993-01-05 Semiconductor Energy Laboratory Co., Ltd. Method for depositing material on depressions
JPS6378573A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 半導体装置
US4835584A (en) * 1986-11-27 1989-05-30 American Telephone And Telegraph Company, At&T Bell Laboratories Trench transistor
DE3809218C2 (de) * 1987-03-20 1994-09-01 Mitsubishi Electric Corp Halbleitereinrichtung mit einem Graben und Verfahren zum Herstellen einer solchen Halbleitereinrichtung
JPH0620108B2 (ja) * 1987-03-23 1994-03-16 三菱電機株式会社 半導体装置の製造方法
US4977436A (en) * 1988-07-25 1990-12-11 Motorola, Inc. High density DRAM
JPH04151850A (ja) * 1990-10-15 1992-05-25 Nec Corp 溝絶縁分離型半導体集積回路の製造方法
FR2672731A1 (fr) * 1991-02-07 1992-08-14 France Telecom Procede d'oxydation localisee enterree d'un substrat de silicium et circuit integre correspondant.
US5122848A (en) * 1991-04-08 1992-06-16 Micron Technology, Inc. Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
EP0540262A2 (en) * 1991-10-31 1993-05-05 STMicroelectronics, Inc. Trench isolation region
JPH0637275A (ja) * 1992-07-13 1994-02-10 Toshiba Corp 半導体記憶装置及びその製造方法
US5512517A (en) * 1995-04-25 1996-04-30 International Business Machines Corporation Self-aligned gate sidewall spacer in a corrugated FET and method of making same

Also Published As

Publication number Publication date
CN1190490A (zh) 1998-08-12
WO1997003463A1 (de) 1997-01-30
DE59607729D1 (de) 2001-10-25
DE19525072A1 (de) 1997-01-16
JPH11509043A (ja) 1999-08-03
CN1093983C (zh) 2002-11-06
KR19990014889A (ko) 1999-02-25
US5990536A (en) 1999-11-23
AR002791A1 (es) 1998-04-29
KR100418849B1 (ko) 2004-04-21
DE19525072C2 (de) 2002-06-27
EP0838089B1 (de) 2001-09-19
EP0838089A1 (de) 1998-04-29

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