IN143919B - - Google Patents
Info
- Publication number
- IN143919B IN143919B IN232/CAL/75A IN232CA1975A IN143919B IN 143919 B IN143919 B IN 143919B IN 232CA1975 A IN232CA1975 A IN 232CA1975A IN 143919 B IN143919 B IN 143919B
- Authority
- IN
- India
Links
Classifications
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- H10P14/6342—
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- H10P14/6506—
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- H10P14/6512—
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- H10P14/662—
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- H10P14/69215—
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- H10P14/6928—
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- H10P14/6929—
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- H10P14/6936—
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- H10P14/69433—
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- H10W74/01—
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- H10W74/131—
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- H10W74/134—
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- H10W74/147—
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- H10W74/43—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H10P14/69391—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US462492A US3895127A (en) | 1974-04-19 | 1974-04-19 | Method of selectively depositing glass on semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN143919B true IN143919B (enExample) | 1978-02-25 |
Family
ID=23836608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN232/CAL/75A IN143919B (enExample) | 1974-04-19 | 1975-02-10 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US3895127A (enExample) |
| JP (1) | JPS5760773B2 (enExample) |
| BE (1) | BE826941A (enExample) |
| BR (1) | BR7501335A (enExample) |
| CA (1) | CA1038329A (enExample) |
| DE (1) | DE2513945A1 (enExample) |
| FR (1) | FR2268357B1 (enExample) |
| GB (1) | GB1464682A (enExample) |
| IN (1) | IN143919B (enExample) |
| IT (1) | IT1044487B (enExample) |
| NL (1) | NL7503711A (enExample) |
| SE (1) | SE407427B (enExample) |
| YU (1) | YU77175A (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7500492A (nl) * | 1975-01-16 | 1976-07-20 | Philips Nv | Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. |
| JPS5393783A (en) * | 1977-01-26 | 1978-08-17 | Nec Home Electronics Ltd | Mesa type semiconductor device |
| IN147578B (enExample) * | 1977-02-24 | 1980-04-19 | Rca Corp | |
| IN147572B (enExample) * | 1977-02-24 | 1980-04-19 | Rca Corp | |
| DE2739762C2 (de) * | 1977-09-03 | 1982-12-02 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Verfahren zur Passivierung von Halbleiterkörpern |
| US4218493A (en) * | 1977-12-02 | 1980-08-19 | The Continental Group, Inc. | Electrostatic repair coating |
| US4235645A (en) * | 1978-12-15 | 1980-11-25 | Westinghouse Electric Corp. | Process for forming glass-sealed multichip semiconductor devices |
| FR2466859A1 (fr) * | 1979-10-05 | 1981-04-10 | Thomson Csf | Procede de sillonnage et de glassivation par masquage au nitrure de silicium et composants semi-conducteurs obtenus |
| US4296370A (en) * | 1979-10-11 | 1981-10-20 | Rca Corporation | Method of detecting a thin insulating film over a conductor |
| DE3138340C2 (de) * | 1981-09-26 | 1987-01-29 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Herstellen von mehreren planaren Bauelementen |
| US4551353A (en) * | 1981-12-30 | 1985-11-05 | Unitrode Corporation | Method for reducing leakage currents in semiconductor devices |
| DE3373594D1 (en) * | 1982-12-22 | 1987-10-15 | Nec Corp | Method of producing electrostrictive effect element |
| US5342563A (en) * | 1991-11-22 | 1994-08-30 | The Lubrizol Corporation | Methods of preparing sintered shapes and green bodies used therein |
| US5268233A (en) * | 1991-11-22 | 1993-12-07 | The Lubrizol Corporation | Methods of preparing sintered shapes and green shapes used therein |
| US6780491B1 (en) * | 1996-12-12 | 2004-08-24 | Micron Technology, Inc. | Microstructures including hydrophilic particles |
| US6448190B1 (en) | 1999-05-21 | 2002-09-10 | Symetrix Corporation | Method and apparatus for fabrication of integrated circuit by selective deposition of precursor liquid |
| US6613695B2 (en) * | 2000-11-24 | 2003-09-02 | Asm America, Inc. | Surface preparation prior to deposition |
| US6960537B2 (en) * | 2001-10-02 | 2005-11-01 | Asm America, Inc. | Incorporation of nitrogen into high k dielectric film |
| US20030118947A1 (en) * | 2001-12-04 | 2003-06-26 | Primaxx, Inc. | System and method for selective deposition of precursor material |
| US6945121B2 (en) | 2002-12-04 | 2005-09-20 | Kimberly, Clark Worldwide, Inc. | Apparatus for simulating a dynamic force response |
| US7855401B2 (en) * | 2005-06-29 | 2010-12-21 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
| US7525122B2 (en) * | 2005-06-29 | 2009-04-28 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
| US7598576B2 (en) * | 2005-06-29 | 2009-10-06 | Cree, Inc. | Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices |
| US8557702B2 (en) * | 2009-02-02 | 2013-10-15 | Asm America, Inc. | Plasma-enhanced atomic layers deposition of conductive material over dielectric layers |
| US9812338B2 (en) | 2013-03-14 | 2017-11-07 | Cree, Inc. | Encapsulation of advanced devices using novel PECVD and ALD schemes |
| US8994073B2 (en) | 2012-10-04 | 2015-03-31 | Cree, Inc. | Hydrogen mitigation schemes in the passivation of advanced devices |
| US9991399B2 (en) | 2012-10-04 | 2018-06-05 | Cree, Inc. | Passivation structure for semiconductor devices |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2966429A (en) * | 1956-08-31 | 1960-12-27 | Gen Electric | Method of and apparatus for making printed circuits |
| US3280019A (en) * | 1963-07-03 | 1966-10-18 | Ibm | Method of selectively coating semiconductor chips |
| US3400000A (en) * | 1965-05-17 | 1968-09-03 | Du Pont | Surface modified electrostatic enamel powders and method |
| US3629086A (en) * | 1969-12-12 | 1971-12-21 | Ford Motor Co | Anodic deposition of ceramic frit with cationic envelope |
| US3642597A (en) * | 1970-03-20 | 1972-02-15 | Gen Electric | Semiconductor passivating process |
| JPS5339442B2 (enExample) * | 1972-03-02 | 1978-10-21 | ||
| JPS551703B2 (enExample) * | 1972-07-07 | 1980-01-16 |
-
1974
- 1974-04-19 US US462492A patent/US3895127A/en not_active Expired - Lifetime
-
1975
- 1975-02-10 IN IN232/CAL/75A patent/IN143919B/en unknown
- 1975-03-05 SE SE7502450A patent/SE407427B/xx unknown
- 1975-03-05 CA CA221,479A patent/CA1038329A/en not_active Expired
- 1975-03-06 BR BR1730/75A patent/BR7501335A/pt unknown
- 1975-03-25 FR FR7509253A patent/FR2268357B1/fr not_active Expired
- 1975-03-26 JP JP50037392A patent/JPS5760773B2/ja not_active Expired
- 1975-03-27 NL NL7503711A patent/NL7503711A/xx not_active Application Discontinuation
- 1975-03-27 YU YU00771/75A patent/YU77175A/xx unknown
- 1975-03-29 DE DE19752513945 patent/DE2513945A1/de not_active Withdrawn
- 1975-04-04 IT IT67867/75A patent/IT1044487B/it active
- 1975-04-10 GB GB1474375A patent/GB1464682A/en not_active Expired
- 1975-07-16 BE BE154554A patent/BE826941A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2268357B1 (enExample) | 1979-03-09 |
| CA1038329A (en) | 1978-09-12 |
| BE826941A (fr) | 1975-07-16 |
| SE7502450L (sv) | 1975-10-20 |
| NL7503711A (nl) | 1975-10-21 |
| US3895127A (en) | 1975-07-15 |
| FR2268357A1 (enExample) | 1975-11-14 |
| DE2513945A1 (de) | 1975-10-30 |
| IT1044487B (it) | 1980-03-20 |
| BR7501335A (pt) | 1976-03-09 |
| SE407427B (sv) | 1979-03-26 |
| YU77175A (en) | 1983-04-27 |
| GB1464682A (en) | 1977-02-16 |
| JPS5760773B2 (enExample) | 1982-12-21 |
| JPS50137684A (enExample) | 1975-10-31 |