NL7500492A - Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. - Google Patents
Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze.Info
- Publication number
- NL7500492A NL7500492A NL7500492A NL7500492A NL7500492A NL 7500492 A NL7500492 A NL 7500492A NL 7500492 A NL7500492 A NL 7500492A NL 7500492 A NL7500492 A NL 7500492A NL 7500492 A NL7500492 A NL 7500492A
- Authority
- NL
- Netherlands
- Prior art keywords
- semi
- guide devices
- manufacture
- manufactured according
- glass cover
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
- H01L21/02145—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides the material containing aluminium, e.g. AlSiOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
- H01L21/02161—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides the material containing more than one metal element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Bipolar Transistors (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Conductive Materials (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7500492A NL7500492A (nl) | 1975-01-16 | 1975-01-16 | Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. |
DE2600321A DE2600321C3 (de) | 1975-01-16 | 1976-01-07 | Verfahren zur Herstellung eines Glasüberzuges auf einer Halbleiteranordnung |
CA243,160A CA1047171A (en) | 1975-01-16 | 1976-01-08 | Manufacture of semiconductor insulating films by electrophoresis |
AU10187/76A AU504812B2 (en) | 1975-01-16 | 1976-01-12 | Glass coating semiconductor devices |
JP251576A JPS556292B2 (nl) | 1975-01-16 | 1976-01-13 | |
IT19210/76A IT1054204B (it) | 1975-01-16 | 1976-01-13 | Metodo per la fabricazione di dispositivi semiconduttori fabbricati in accordo con tale metodo |
SE7600278A SE7600278L (sv) | 1975-01-16 | 1976-01-13 | Sett att framstella halvledaranordningar, varvid en glasbeleggning utformas pa en tunn halvledarskiva |
GB1175/76A GB1532471A (en) | 1975-01-16 | 1976-01-13 | Making semiconductor devices |
MX163017A MX143640A (es) | 1975-01-16 | 1976-01-13 | Mejoras en metodo para fabricar dispositivos semiconductores |
CH34376A CH599677A5 (nl) | 1975-01-16 | 1976-01-13 | |
FR7601087A FR2298189A1 (fr) | 1975-01-16 | 1976-01-16 | Procede pour fabriquer des dispositifs semicon |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7500492A NL7500492A (nl) | 1975-01-16 | 1975-01-16 | Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7500492A true NL7500492A (nl) | 1976-07-20 |
Family
ID=19822999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7500492A NL7500492A (nl) | 1975-01-16 | 1975-01-16 | Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS556292B2 (nl) |
AU (1) | AU504812B2 (nl) |
CA (1) | CA1047171A (nl) |
CH (1) | CH599677A5 (nl) |
DE (1) | DE2600321C3 (nl) |
FR (1) | FR2298189A1 (nl) |
GB (1) | GB1532471A (nl) |
IT (1) | IT1054204B (nl) |
MX (1) | MX143640A (nl) |
NL (1) | NL7500492A (nl) |
SE (1) | SE7600278L (nl) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IN147578B (nl) * | 1977-02-24 | 1980-04-19 | Rca Corp | |
IN147572B (nl) * | 1977-02-24 | 1980-04-19 | Rca Corp | |
GB2117796B (en) * | 1982-04-06 | 1985-06-19 | Standard Telephones Cables Ltd | Forming ceramic layers; dielectric structures |
GB2158463B (en) * | 1982-04-06 | 1986-11-19 | Stc Plc | Forming ceramic films |
GB2117795A (en) * | 1982-04-06 | 1983-10-19 | Standard Telephones Cables Ltd | Fabricating capacitors; forming ceramic films |
DE4343810C1 (de) * | 1993-12-22 | 1995-04-20 | Roland Man Druckmasch | Fotoelektrischer Meßkopf |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3303399A (en) * | 1964-01-30 | 1967-02-07 | Ibm | Glasses for encapsulating semiconductor devices and resultant devices |
IE33405B1 (en) * | 1968-12-09 | 1974-06-12 | Gen Electric | Semiconductor wafers sub-dividable into pellets and methods of fabricating same |
US3895127A (en) * | 1974-04-19 | 1975-07-15 | Rca Corp | Method of selectively depositing glass on semiconductor devices |
-
1975
- 1975-01-16 NL NL7500492A patent/NL7500492A/nl not_active Application Discontinuation
-
1976
- 1976-01-07 DE DE2600321A patent/DE2600321C3/de not_active Expired
- 1976-01-08 CA CA243,160A patent/CA1047171A/en not_active Expired
- 1976-01-12 AU AU10187/76A patent/AU504812B2/en not_active Expired
- 1976-01-13 MX MX163017A patent/MX143640A/es unknown
- 1976-01-13 IT IT19210/76A patent/IT1054204B/it active
- 1976-01-13 SE SE7600278A patent/SE7600278L/ not_active Application Discontinuation
- 1976-01-13 CH CH34376A patent/CH599677A5/xx not_active IP Right Cessation
- 1976-01-13 JP JP251576A patent/JPS556292B2/ja not_active Expired
- 1976-01-13 GB GB1175/76A patent/GB1532471A/en not_active Expired
- 1976-01-16 FR FR7601087A patent/FR2298189A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
AU504812B2 (en) | 1979-11-01 |
JPS556292B2 (nl) | 1980-02-15 |
GB1532471A (en) | 1978-11-15 |
AU1018776A (en) | 1977-07-21 |
MX143640A (es) | 1981-06-17 |
JPS5197375A (nl) | 1976-08-26 |
DE2600321A1 (de) | 1976-07-22 |
FR2298189B1 (nl) | 1982-04-16 |
DE2600321B2 (de) | 1980-12-04 |
IT1054204B (it) | 1981-11-10 |
CH599677A5 (nl) | 1978-05-31 |
SE7600278L (sv) | 1976-07-19 |
CA1047171A (en) | 1979-01-23 |
FR2298189A1 (fr) | 1976-08-13 |
DE2600321C3 (de) | 1981-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BC | A request for examination has been filed | ||
BI | The patent application has been withdrawn |