IL96738A0 - Catalytic,water-soluble polymeric films for metal coatings - Google Patents

Catalytic,water-soluble polymeric films for metal coatings

Info

Publication number
IL96738A0
IL96738A0 IL96738A IL9673890A IL96738A0 IL 96738 A0 IL96738 A0 IL 96738A0 IL 96738 A IL96738 A IL 96738A IL 9673890 A IL9673890 A IL 9673890A IL 96738 A0 IL96738 A0 IL 96738A0
Authority
IL
Israel
Prior art keywords
catalytic
water
polymeric films
soluble polymeric
metal coatings
Prior art date
Application number
IL96738A
Other languages
English (en)
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/609,718 external-priority patent/US5082734A/en
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of IL96738A0 publication Critical patent/IL96738A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H01M8/1004—Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Catalysts (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Insulated Conductors (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
IL96738A 1989-12-21 1990-12-20 Catalytic,water-soluble polymeric films for metal coatings IL96738A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45456589A 1989-12-21 1989-12-21
US56988290A 1990-08-20 1990-08-20
US07/609,718 US5082734A (en) 1989-12-21 1990-11-13 Catalytic, water-soluble polymeric films for metal coatings

Publications (1)

Publication Number Publication Date
IL96738A0 true IL96738A0 (en) 1991-09-16

Family

ID=27412609

Family Applications (1)

Application Number Title Priority Date Filing Date
IL96738A IL96738A0 (en) 1989-12-21 1990-12-20 Catalytic,water-soluble polymeric films for metal coatings

Country Status (13)

Country Link
US (1) US5275861A (ja)
EP (1) EP0510065B1 (ja)
JP (1) JP2902109B2 (ja)
KR (1) KR950000014B1 (ja)
CN (2) CN1035393C (ja)
AT (1) ATE172755T1 (ja)
AU (1) AU635393B2 (ja)
BR (1) BR9007929A (ja)
CA (1) CA2069495C (ja)
DE (1) DE69032728T2 (ja)
HU (1) HUT62040A (ja)
IL (1) IL96738A0 (ja)
WO (1) WO1991009986A1 (ja)

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ES1070648Y (es) * 2009-07-16 2010-01-11 Hilatura Cientifica Atais S L Malla laminar atenuadora de radiaciones electromagneticas
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JP6066398B2 (ja) * 2011-08-17 2017-01-25 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解金属化のための安定なスズを含まない触媒
KR101904093B1 (ko) * 2011-08-17 2018-10-04 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 무전해 금속화를 위한 안정한 촉매
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Also Published As

Publication number Publication date
WO1991009986A1 (en) 1991-07-11
AU7167391A (en) 1991-07-24
HU9202045D0 (en) 1992-10-28
KR950000014B1 (ko) 1995-01-07
CA2069495A1 (en) 1991-06-22
DE69032728T2 (de) 1999-03-18
CA2069495C (en) 2006-05-09
AU635393B2 (en) 1993-03-18
EP0510065B1 (en) 1998-10-28
US5275861A (en) 1994-01-04
DE69032728D1 (de) 1998-12-03
ATE172755T1 (de) 1998-11-15
JPH05503121A (ja) 1993-05-27
HUT62040A (en) 1993-03-29
JP2902109B2 (ja) 1999-06-07
KR920703873A (ko) 1992-12-18
BR9007929A (pt) 1992-10-06
CN1152628A (zh) 1997-06-25
EP0510065A1 (en) 1992-10-28
CN1035393C (zh) 1997-07-09
CN1053646A (zh) 1991-08-07

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