IL86514A0 - - Google Patents
Info
- Publication number
- IL86514A0 IL86514A0 IL86514A IL8651488A IL86514A0 IL 86514 A0 IL86514 A0 IL 86514A0 IL 86514 A IL86514 A IL 86514A IL 8651488 A IL8651488 A IL 8651488A IL 86514 A0 IL86514 A0 IL 86514A0
- Authority
- IL
- Israel
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/265—Contactless testing
- G01R31/2656—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL86514A IL86514A0 (US06168655-20010102-C00055.png) | 1988-05-26 | 1988-05-26 | |
| GB8912064A GB2220100A (en) | 1988-05-26 | 1989-05-25 | Wafer inspection system |
| US07/356,701 US5105147A (en) | 1988-05-26 | 1989-05-25 | Wafer inspection system |
| JP1134444A JPH02236149A (ja) | 1988-05-26 | 1989-05-26 | 印刷回路検査システム |
| DE3917260A DE3917260A1 (de) | 1988-05-26 | 1989-05-26 | Waferinspektionseinrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL86514A IL86514A0 (US06168655-20010102-C00055.png) | 1988-05-26 | 1988-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL86514A0 true IL86514A0 (US06168655-20010102-C00055.png) | 1988-11-15 |
Family
ID=11058873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL86514A IL86514A0 (US06168655-20010102-C00055.png) | 1988-05-26 | 1988-05-26 |
Country Status (5)
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH680275A5 (US06168655-20010102-C00055.png) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
| JP2821046B2 (ja) * | 1991-09-05 | 1998-11-05 | 三菱電機エンジニアリング株式会社 | 半導体素子用特性検査装置 |
| KR100291110B1 (ko) * | 1993-06-19 | 2001-06-01 | 히가시 데쓰로 | 프로우브장치 및 그것을 사용한 피검사체의 검사방법 |
| US5421889A (en) * | 1993-06-29 | 1995-06-06 | Tokyo Electron Limited | Method and apparatus for inverting samples in a process |
| DE4412202C2 (de) * | 1994-04-08 | 1996-04-18 | Ludwig Dr Koester | Verfahren zur berührungslosen Bestimmung des Leitungstyps von Halbleitermaterialien und Meßkopf zur Durchführung des Verfahrens |
| KR100192961B1 (ko) * | 1995-12-29 | 1999-06-15 | 윤종용 | 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법 |
| JPH09321102A (ja) * | 1996-05-31 | 1997-12-12 | Tokyo Electron Ltd | 検査装置 |
| US6392190B1 (en) | 1998-01-23 | 2002-05-21 | Smith International | Automated hardfacing system |
| US6167322A (en) | 1998-07-10 | 2000-12-26 | Holbrooks; Orville Ray | Intelligent wafer handling system and method |
| US6324298B1 (en) * | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
| US6113056A (en) * | 1998-08-04 | 2000-09-05 | Micrion Corporation | Workpiece vibration damper |
| US6156580A (en) * | 1998-11-18 | 2000-12-05 | Advanced Micro Devices, Inc. | Semiconductor wafer analysis system and method |
| US6401008B1 (en) | 1998-11-18 | 2002-06-04 | Advanced Micro Devices, Inc. | Semiconductor wafer review system and method |
| US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
| WO2000058188A1 (en) * | 1999-03-25 | 2000-10-05 | N & K Technology, Inc. | Wafer handling robot having x-y stage for wafer handling and positioning |
| US6341259B1 (en) | 1999-06-04 | 2002-01-22 | Interscience, Inc. | Microsystems integrated testing and characterization system and method |
| AU2727401A (en) | 1999-12-15 | 2001-06-25 | Introbotics Corporation | Automated domain reflectometry testing system |
| US6356337B1 (en) * | 2000-03-08 | 2002-03-12 | Anvik Corporation | Two-sided substrate imaging using single-approach projection optics |
| US6798229B2 (en) * | 2000-05-11 | 2004-09-28 | Brian D. Butler | Wide-bandwidth coaxial probe |
| US6708132B1 (en) | 2000-06-02 | 2004-03-16 | Interscience, Inc. | Microsystems integrated testing and characterization system and method |
| US6612590B2 (en) | 2001-01-12 | 2003-09-02 | Tokyo Electron Limited | Apparatus and methods for manipulating semiconductor wafers |
| US7294317B2 (en) * | 2001-02-08 | 2007-11-13 | Sd Lizenzverwertungsgesellschaft Mbh & Co. | Exothermic reaction system |
| DE10117167B4 (de) * | 2001-04-06 | 2004-06-03 | Leica Microsystems Wetzlar Gmbh | Inspektionsmikroskop und Objektiv für ein Inspektionsmikroskop |
| US6695572B2 (en) * | 2001-09-28 | 2004-02-24 | Agere Systems Inc. | Method and apparatus for minimizing semiconductor wafer contamination |
| US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
| US7230441B2 (en) * | 2002-07-18 | 2007-06-12 | Rudolph Technologies, Inc. | Wafer staging platform for a wafer inspection system |
| DE10303459A1 (de) * | 2003-01-29 | 2004-08-19 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Kontrollieren des Randes eines scheibenförmigen Gegenstandes |
| US7323888B1 (en) * | 2003-11-01 | 2008-01-29 | Colvin James B | System and method for use in functional failure analysis by induced stimulus |
| US7872485B2 (en) * | 2004-10-18 | 2011-01-18 | Colvin James B | System and method for use in functional failure analysis by induced stimulus |
| DE102004008289B4 (de) * | 2004-02-20 | 2006-07-27 | Integrated Dynamics Engineering Gmbh | Roboterführungseinheit zur Bereitstellung einer Präzisionsbewegung eines Gegenstands |
| DE102004017114B4 (de) * | 2004-04-07 | 2012-03-15 | Integrated Dynamics Engineering Gmbh | Vorrichtung zur Handhabung eines scheibenartigen Elements, insbesondere zur Handhabung eines Wafers |
| JP4915897B2 (ja) * | 2005-07-19 | 2012-04-11 | 東京エレクトロン株式会社 | 脈動軽減装置及び検査装置 |
| TWI478272B (zh) * | 2007-08-15 | 2015-03-21 | 尼康股份有限公司 | A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method |
| US20100175926A1 (en) * | 2009-01-15 | 2010-07-15 | Baker Hughes Incorporated | Roller cones having non-integral cutting structures, drill bits including such cones, and methods of forming same |
| KR101711193B1 (ko) * | 2010-06-04 | 2017-02-28 | 삼성전자 주식회사 | 웨이퍼 검사 방법 및 웨이퍼 검사 시스템 |
| JP5333408B2 (ja) * | 2010-10-22 | 2013-11-06 | 東京エレクトロン株式会社 | 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体 |
| US9431282B2 (en) * | 2011-12-27 | 2016-08-30 | Rudolph Technologies, Inc. | Wafer inversion mechanism |
| DE112014003220T5 (de) * | 2013-07-11 | 2016-04-28 | Kla-Tencor Corporation | Konfigurationen für einen Metrologietisch und Verfahren zum Betreiben des Metrologietisches |
| US10840121B2 (en) | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1044379A (en) * | 1974-12-28 | 1978-12-12 | Sony Corporation | Wafer transfer device |
| US4516253A (en) * | 1983-03-15 | 1985-05-07 | Micronix Partners | Lithography system |
| US4507078A (en) * | 1983-03-28 | 1985-03-26 | Silicon Valley Group, Inc. | Wafer handling apparatus and method |
| GB2157078B (en) * | 1984-03-30 | 1987-09-30 | Perkin Elmer Corp | Wafer alignment apparatus |
| JPS60239037A (ja) * | 1984-05-12 | 1985-11-27 | Yoshie Hasegawa | 半導体ウエハプロ−バ |
| US4604715A (en) * | 1984-10-19 | 1986-08-05 | General Electric Company | Robotic inspection system |
| JPS61105411A (ja) * | 1984-10-29 | 1986-05-23 | Mitsutoyo Mfg Co Ltd | 多次元測定機の測定方法 |
| US4656358A (en) * | 1985-03-12 | 1987-04-07 | Optoscan Corporation | Laser-based wafer measuring system |
| US4755746A (en) * | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
| EP0219826B1 (en) * | 1985-10-24 | 1994-09-07 | Texas Instruments Incorporated | Vacuum processing system |
| US4694243A (en) * | 1986-05-28 | 1987-09-15 | Westinghouse Electric Corp. | Optical measurement using polarized and unpolarized light |
| JPS6362245A (ja) * | 1986-09-02 | 1988-03-18 | Canon Inc | ウエハプロ−バ |
| JPH0669056B2 (ja) * | 1986-09-11 | 1994-08-31 | 東京エレクトロン株式会社 | プロ−ブ装置 |
| US4772846A (en) * | 1986-12-29 | 1988-09-20 | Hughes Aircraft Company | Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy |
-
1988
- 1988-05-26 IL IL86514A patent/IL86514A0/xx unknown
-
1989
- 1989-05-25 GB GB8912064A patent/GB2220100A/en not_active Withdrawn
- 1989-05-25 US US07/356,701 patent/US5105147A/en not_active Expired - Fee Related
- 1989-05-26 DE DE3917260A patent/DE3917260A1/de not_active Withdrawn
- 1989-05-26 JP JP1134444A patent/JPH02236149A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB2220100A (en) | 1989-12-28 |
| JPH02236149A (ja) | 1990-09-19 |
| DE3917260A1 (de) | 1989-12-07 |
| US5105147A (en) | 1992-04-14 |
| GB8912064D0 (en) | 1989-07-12 |
