IL251973A0 - Test systems and techniques with improved detection - Google Patents

Test systems and techniques with improved detection

Info

Publication number
IL251973A0
IL251973A0 IL251973A IL25197317A IL251973A0 IL 251973 A0 IL251973 A0 IL 251973A0 IL 251973 A IL251973 A IL 251973A IL 25197317 A IL25197317 A IL 25197317A IL 251973 A0 IL251973 A0 IL 251973A0
Authority
IL
Israel
Prior art keywords
techniques
inspection systems
enhanced detection
enhanced
detection
Prior art date
Application number
IL251973A
Other languages
English (en)
Hebrew (he)
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL251973A0 publication Critical patent/IL251973A0/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL251973A 2014-12-02 2017-04-27 Test systems and techniques with improved detection IL251973A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462086596P 2014-12-02 2014-12-02
US14/944,124 US9599573B2 (en) 2014-12-02 2015-11-17 Inspection systems and techniques with enhanced detection
PCT/US2015/063020 WO2016089779A1 (en) 2014-12-02 2015-11-30 Inspection systems and techniques with enhanced detection

Publications (1)

Publication Number Publication Date
IL251973A0 true IL251973A0 (en) 2017-06-29

Family

ID=56079025

Family Applications (1)

Application Number Title Priority Date Filing Date
IL251973A IL251973A0 (en) 2014-12-02 2017-04-27 Test systems and techniques with improved detection

Country Status (8)

Country Link
US (2) US9599573B2 (enExample)
JP (1) JP6681576B2 (enExample)
KR (1) KR102318273B1 (enExample)
CN (1) CN107003250B (enExample)
IL (1) IL251973A0 (enExample)
SG (1) SG11201704382XA (enExample)
TW (1) TWI652472B (enExample)
WO (1) WO2016089779A1 (enExample)

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US9599573B2 (en) * 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection
WO2018050972A1 (fr) * 2016-09-16 2018-03-22 Centre National De La Recherche Scientifique Dispositif optique de caractérisation d'un échantillon
US10082470B2 (en) * 2016-09-27 2018-09-25 Kla-Tencor Corporation Defect marking for semiconductor wafer inspection
US11047806B2 (en) * 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US11662646B2 (en) * 2017-02-05 2023-05-30 Kla Corporation Inspection and metrology using broadband infrared radiation
DE102017205212A1 (de) * 2017-03-28 2018-10-04 Carl Zeiss Smt Gmbh Verfahren zum Detektieren von Partikeln an der Oberfläche eines Objekts, Wafer und Maskenblank
US10444161B2 (en) 2017-04-05 2019-10-15 Kla-Tencor Corporation Systems and methods for metrology with layer-specific illumination spectra
US11016033B2 (en) 2017-12-29 2021-05-25 Goldway Technology Limited Diamond clarity measurement process and system
EP3518041A1 (en) * 2018-01-30 2019-07-31 ASML Netherlands B.V. Inspection apparatus and inspection method
US10937705B2 (en) * 2018-03-30 2021-03-02 Onto Innovation Inc. Sample inspection using topography
US11151711B2 (en) * 2018-06-06 2021-10-19 Kla-Tencor Corporation Cross layer common-unique analysis for nuisance filtering
IL279655B (en) * 2018-07-18 2022-09-01 Nova Ltd Optical metrology in the time domain and testing of semiconductor devices
KR102120551B1 (ko) * 2018-09-14 2020-06-09 (주)오로스 테크놀로지 오버레이 측정장치
US10545099B1 (en) 2018-11-07 2020-01-28 Kla-Tencor Corporation Ultra-high sensitivity hybrid inspection with full wafer coverage capability
WO2020194491A1 (ja) * 2019-03-26 2020-10-01 株式会社日立ハイテク 欠陥検査装置
JP2021001770A (ja) * 2019-06-20 2021-01-07 日本電産サンキョー株式会社 外観検査装置および外観検査方法
CN111239161B (zh) * 2020-02-28 2025-03-07 郑州旭飞光电科技有限公司 基板玻璃缺陷检测装置
US11512948B2 (en) * 2020-05-26 2022-11-29 Kla Corporation Imaging system for buried metrology targets
KR102519813B1 (ko) * 2022-10-17 2023-04-11 (주)오로스테크놀로지 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램

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US5162867A (en) * 1990-01-26 1992-11-10 Canon Kabushiki Kaisha Surface condition inspection method and apparatus using image transfer
US7136159B2 (en) 2000-09-12 2006-11-14 Kla-Tencor Technologies Corporation Excimer laser inspection system
US6608321B1 (en) 2001-02-01 2003-08-19 Advanced Micro Devices, Inc. Differential wavelength inspection system
US20040207836A1 (en) 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
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US7405417B2 (en) * 2005-12-20 2008-07-29 Asml Netherlands B.V. Lithographic apparatus having a monitoring device for detecting contamination
JP2008218799A (ja) * 2007-03-06 2008-09-18 Topcon Corp 表面検査方法及び装置
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JP2010245165A (ja) 2009-04-02 2010-10-28 Mitsubishi Electric Corp 電力用半導体装置の製造方法および電力用半導体装置の製造装置
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CN102288550B (zh) 2010-06-21 2013-03-27 张国胜 适用于光电检测的差分测量方法及装置
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US9496425B2 (en) * 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US20130313440A1 (en) * 2012-05-22 2013-11-28 Kla-Tencor Corporation Solid-State Laser And Inspection System Using 193nm Laser
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
US9075027B2 (en) 2012-11-21 2015-07-07 Kla-Tencor Corporation Apparatus and methods for detecting defects in vertical memory
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US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US9599573B2 (en) 2014-12-02 2017-03-21 Kla-Tencor Corporation Inspection systems and techniques with enhanced detection

Also Published As

Publication number Publication date
CN107003250A (zh) 2017-08-01
US20170176346A1 (en) 2017-06-22
SG11201704382XA (en) 2017-06-29
US9599573B2 (en) 2017-03-21
KR102318273B1 (ko) 2021-10-26
WO2016089779A1 (en) 2016-06-09
CN107003250B (zh) 2020-02-28
US10126251B2 (en) 2018-11-13
TW201631315A (zh) 2016-09-01
JP6681576B2 (ja) 2020-04-15
JP2018503244A (ja) 2018-02-01
US20160153914A1 (en) 2016-06-02
TWI652472B (zh) 2019-03-01
KR20170091706A (ko) 2017-08-09

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