IL238129A0 - תכשיר עבור ציפוי מתכתי חשמלי המכיל גורם משווה - Google Patents

תכשיר עבור ציפוי מתכתי חשמלי המכיל גורם משווה

Info

Publication number
IL238129A0
IL238129A0 IL238129A IL23812915A IL238129A0 IL 238129 A0 IL238129 A0 IL 238129A0 IL 238129 A IL238129 A IL 238129A IL 23812915 A IL23812915 A IL 23812915A IL 238129 A0 IL238129 A0 IL 238129A0
Authority
IL
Israel
Prior art keywords
composition
leveling agent
metal electroplating
electroplating
metal
Prior art date
Application number
IL238129A
Other languages
English (en)
Other versions
IL238129B (he
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL238129A0 publication Critical patent/IL238129A0/he
Publication of IL238129B publication Critical patent/IL238129B/he

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IL238129A 2012-11-09 2015-04-02 תכשיר עבור ציפוי מתכתי חשמלי המכיל גורם משווה IL238129B (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261724350P 2012-11-09 2012-11-09
PCT/IB2013/059777 WO2014072885A2 (en) 2012-11-09 2013-10-30 Composition for metal electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
IL238129A0 true IL238129A0 (he) 2015-05-31
IL238129B IL238129B (he) 2020-03-31

Family

ID=50685268

Family Applications (1)

Application Number Title Priority Date Filing Date
IL238129A IL238129B (he) 2012-11-09 2015-04-02 תכשיר עבור ציפוי מתכתי חשמלי המכיל גורם משווה

Country Status (11)

Country Link
US (1) US9758885B2 (he)
EP (1) EP2917265B1 (he)
JP (1) JP6411354B2 (he)
KR (1) KR102140431B1 (he)
CN (1) CN104797633B (he)
IL (1) IL238129B (he)
MY (1) MY172822A (he)
RU (1) RU2015121797A (he)
SG (1) SG11201503617VA (he)
TW (1) TWI609922B (he)
WO (1) WO2014072885A2 (he)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US20150345039A1 (en) * 2015-07-20 2015-12-03 National Institute Of Standards And Technology Composition having alkaline ph and process for forming superconformation therewith
JP2018517793A (ja) * 2015-04-28 2018-07-05 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物
WO2017037040A1 (en) 2015-08-31 2017-03-09 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
US10662541B2 (en) * 2015-10-08 2020-05-26 Rohm And Haas Electronic Materials Llc Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides
JP6684354B2 (ja) * 2015-10-08 2020-04-22 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ アミンとポリアクリルアミドとの反応生成物の化合物を含有する銅電気めっき浴
JP6622908B2 (ja) * 2015-10-08 2019-12-18 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ アミン、ポリアクリルアミド、及びスルトンの反応生成物の化合物を含有する銅電気めっき浴
CN105543907A (zh) * 2015-12-09 2016-05-04 深圳市正天伟科技有限公司 一种耐高电流密度电镀铜添加剂及其制备方法
US10519557B2 (en) * 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102023363B1 (ko) * 2016-07-15 2019-09-24 한국생산기술연구원 니켈 도금용 평탄제 및 이를 포함하는 니켈 도금액
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US11926918B2 (en) 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
EP3360988B1 (en) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
US11387108B2 (en) 2017-09-04 2022-07-12 Basf Se Composition for metal electroplating comprising leveling agent
US11242606B2 (en) * 2018-04-20 2022-02-08 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
CN110117801B (zh) * 2019-06-21 2021-04-20 通元科技(惠州)有限公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法
CN110284162B (zh) * 2019-07-22 2020-06-30 广州三孚新材料科技股份有限公司 一种光伏汇流焊带无氰碱性镀铜液及其制备方法
KR20220069012A (ko) 2019-09-27 2022-05-26 바스프 에스이 레벨링제를 포함하는 구리 범프 전착용 조성물
WO2021058334A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
EP4127025A1 (en) 2020-04-03 2023-02-08 Basf Se Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
WO2022012932A1 (en) 2020-07-13 2022-01-20 Basf Se Composition for copper electroplating on a cobalt seed
CN118043502A (zh) 2021-10-01 2024-05-14 巴斯夫欧洲公司 用于铜电沉积的包含聚氨基酰胺型流平剂的组合物
US20230203695A1 (en) * 2021-12-29 2023-06-29 Basf Se Alkaline Composition For Copper Electroplating Comprising A Defect Reduction Agent
WO2024008562A1 (en) 2022-07-07 2024-01-11 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
WO2024132828A1 (en) 2022-12-19 2024-06-27 Basf Se A composition for copper nanotwin electrodeposition

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494653B1 (he) * 1970-10-27 1974-02-02
GB8530460D0 (en) * 1985-12-11 1986-01-22 Ciba Geigy Ag Holograms
DE19758121C2 (de) 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
DE10139452A1 (de) * 2001-08-10 2003-02-20 Basf Ag Quaternierte Polyamidamine, deren Herstellung, entsprechende Mittel und deren Verwendung
JP2007107074A (ja) * 2005-10-17 2007-04-26 Okuno Chem Ind Co Ltd 酸性電気銅めっき液及び電気銅めっき方法
JP5558675B2 (ja) 2007-04-03 2014-07-23 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物
WO2010115717A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN102365395B (zh) 2009-04-07 2015-04-29 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
WO2010115757A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
SG174265A1 (en) 2009-04-07 2011-10-28 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
MY157126A (en) 2009-07-30 2016-05-13 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
JP5775077B2 (ja) 2009-07-30 2015-09-09 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物
WO2011064154A2 (en) * 2009-11-27 2011-06-03 Basf Se Composition for metal electroplating comprising leveling agent
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US9631292B2 (en) 2011-06-01 2017-04-25 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features

Also Published As

Publication number Publication date
US9758885B2 (en) 2017-09-12
WO2014072885A2 (en) 2014-05-15
EP2917265A4 (en) 2016-06-29
TW201434967A (zh) 2014-09-16
EP2917265A2 (en) 2015-09-16
RU2015121797A (ru) 2017-01-10
CN104797633A (zh) 2015-07-22
JP2016504489A (ja) 2016-02-12
JP6411354B2 (ja) 2018-10-24
KR20150082541A (ko) 2015-07-15
TWI609922B (zh) 2018-01-01
IL238129B (he) 2020-03-31
US20150284865A1 (en) 2015-10-08
SG11201503617VA (en) 2015-06-29
MY172822A (en) 2019-12-12
EP2917265B1 (en) 2019-01-02
KR102140431B1 (ko) 2020-08-03
WO2014072885A3 (en) 2014-07-03
CN104797633B (zh) 2018-04-24

Similar Documents

Publication Publication Date Title
IL238129A0 (he) תכשיר עבור ציפוי מתכתי חשמלי המכיל גורם משווה
IL223183A0 (en) Composition for metal electroplating comprising leveling agent
SG10201510522XA (en) Composition for metal electroplating comprising leveling agent
IL221655A (he) תכשיר עבור ציפוי חשמלי מתכתי המכיל גורם משווה
EP2873699A4 (en) HART COATING COMPOSITION
EP2843007A4 (en) HART COATING COMPOSITION
IL219556A0 (en) Composition for metal electroplating comprising leveling agent
SG11201404577XA (en) Bactericidal agent composition
GB201215100D0 (en) Polymide composition
EP2891703A4 (en) LUBRICANT COMPOSITION
HK1204019A1 (en) Indicator coatings for metal surfaces
HUE047436T2 (hu) Fém katalizátorkészítmény
EP2826846A4 (en) LUBRICANT COMPOSITION
ZA201402914B (en) Hard metal composition
EP2823830A4 (en) MESH-HIGHNESS MEDIUM
SG11201404647QA (en) Lubricant composition
HK1210709A1 (en) Composition for external use
EP2878633A4 (en) curing composition
EP2922926A4 (en) COATING COMPOSITION
HK1206976A1 (en) Composition for agent for external use
EP2868740A4 (en) LUBRICANT COMPOSITION
EP2902457A4 (en) COATING AGENT COMPOSITION
EP2803741A4 (en) ALLOY STEEL
GB201314568D0 (en) Lubricant compositions
GB201314570D0 (en) Lubricant compositions

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed