IL196548A0 - Method for applying a metal layer to a substrate - Google Patents

Method for applying a metal layer to a substrate

Info

Publication number
IL196548A0
IL196548A0 IL196548A IL19654809A IL196548A0 IL 196548 A0 IL196548 A0 IL 196548A0 IL 196548 A IL196548 A IL 196548A IL 19654809 A IL19654809 A IL 19654809A IL 196548 A0 IL196548 A0 IL 196548A0
Authority
IL
Israel
Prior art keywords
applying
substrate
metal layer
metal
layer
Prior art date
Application number
IL196548A
Other languages
English (en)
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL196548A0 publication Critical patent/IL196548A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/006—Nanoparticles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
IL196548A 2006-08-03 2009-01-15 Method for applying a metal layer to a substrate IL196548A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06118413 2006-08-03
PCT/EP2007/057754 WO2008015168A1 (de) 2006-08-03 2007-07-27 Verfahren zum aufbringen einer metallschicht auf einem substrat

Publications (1)

Publication Number Publication Date
IL196548A0 true IL196548A0 (en) 2009-11-18

Family

ID=38645710

Family Applications (1)

Application Number Title Priority Date Filing Date
IL196548A IL196548A0 (en) 2006-08-03 2009-01-15 Method for applying a metal layer to a substrate

Country Status (10)

Country Link
US (1) US20100006442A1 (ru)
EP (1) EP2049711A1 (ru)
JP (1) JP2009545671A (ru)
KR (1) KR20090036600A (ru)
CN (1) CN101522956A (ru)
BR (1) BRPI0714608A2 (ru)
IL (1) IL196548A0 (ru)
RU (1) RU2009107274A (ru)
TW (1) TW200825206A (ru)
WO (1) WO2008015168A1 (ru)

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CN101970720B (zh) * 2008-03-13 2014-10-15 巴斯夫欧洲公司 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
JP2010080911A (ja) * 2008-04-30 2010-04-08 Tayca Corp 広帯域電磁波吸収体及びその製造方法
WO2009135780A1 (en) * 2008-05-08 2009-11-12 Basf Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
KR101118473B1 (ko) * 2009-03-27 2012-03-12 (주)바이오니아 나노다공막 및 이의 제조방법
CN102365395B (zh) 2009-04-07 2015-04-29 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
US9242897B2 (en) * 2009-05-18 2016-01-26 Ppg Industries Ohio, Inc. Aqueous dispersions and methods of making same
DE102009023796B4 (de) 2009-05-22 2012-04-19 Technische Universität Dresden Vorrichtung und Verfahren zur Metallisierung von Rastersondenspitzen
WO2010133217A1 (de) 2009-05-22 2010-11-25 Technische Universität Dresden Vorrichtung und verfahren zur metallisierung von rastersondenspitzen
US9203130B2 (en) * 2009-11-18 2015-12-01 Dsm Ip Assets B.V. RF filter housing
FR2959231B1 (fr) * 2010-04-22 2012-04-20 Arkema France Materiau composite thermoplastique et/ou elastomerique a base de nanotubes de carbone et de graphenes
CN102030919B (zh) * 2010-11-12 2012-02-08 杭州中富彩新材料科技有限公司 环保型表面高分子改性水性着色剂及其制备方法
KR101218176B1 (ko) * 2010-11-29 2013-01-03 연세대학교 산학협력단 표면 강성 제어를 통한 내마모성 코팅 구조 및 그 제조방법
JP5792963B2 (ja) * 2011-02-01 2015-10-14 早川ゴム株式会社 グラフェン構造を持つナノ構造体の吸着方法及びその吸着方法を用いた無電解メッキ方法
US20120234682A1 (en) * 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
KR20140098229A (ko) * 2011-12-02 2014-08-07 비와이케이-케미 게엠베하 비도전성 기판상에 전기 도전성 구조를 생산하는 방법 및 이러한 방법으로 만들어진 구조
DE102011122283A1 (de) 2011-12-23 2013-06-27 Schoeller-Electronics Gmbh Elektrisch leitfähiges Bauelement und Verfahren zur Herstellung eines solchen Bauelements
CH706336B1 (fr) * 2012-04-02 2016-03-31 Haute Ecole Arc Bain galvanique pour le dépôt électrolytique d'un matériau composite.
US20140057127A1 (en) 2012-08-22 2014-02-27 Infineon Technologies Ag Method for processing at least one carbon fiber, method for fabricating a carbon copper composite, and carbon copper composite
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
TWI524825B (zh) * 2012-10-29 2016-03-01 財團法人工業技術研究院 碳材導電膜的轉印方法
CN103264226A (zh) * 2013-05-23 2013-08-28 广东工业大学 一种基于激光空化的碳纳米管植入方法
CN104244672A (zh) * 2013-06-17 2014-12-24 英业达科技有限公司 电子装置壳体结构及其形成方法
CN103433619B (zh) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 激光熔覆打印机及线路板的制作方法
DE102013217882A1 (de) 2013-09-06 2015-03-12 Sgl Carbon Se Elektrodensubstrat aus Kohlenstofffasern
WO2015056978A1 (ko) * 2013-10-16 2015-04-23 고려대학교 산학협력단 나노텍스처 필름 제조 장치
JPWO2015098639A1 (ja) * 2013-12-26 2017-03-23 古河電気工業株式会社 多層絶縁電線、コイルおよび電気・電子機器
JP6209770B2 (ja) * 2015-02-19 2017-10-11 石原ケミカル株式会社 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法
US20200157699A1 (en) * 2017-05-25 2020-05-21 Basf Se Article comprising a polymer body and a metal plating
DE102017007488B4 (de) 2017-08-09 2021-05-12 Carolin John Verfahren zum Veredeln zumindest einer Oberfläche sowie Gegenstand mit zumindest einer Oberfläche
CN107843366B (zh) * 2017-12-18 2023-10-20 江西卓讯微电子有限公司 导电薄膜及薄膜电阻应变式压力传感器
JP6961826B2 (ja) 2017-12-26 2021-11-05 株式会社ブリヂストン 低分子量テーパードスチレン−ブタジエンコポリマーの合成、及びタイヤにおけるその使用
ES2721125A1 (es) * 2018-01-26 2019-07-26 Fundacion Para La Promocion De La Innovacion Investig Y Desarrollo Tecnologico De La Industria De Au Dispersion acuosa electricamente conductora, uso de dicha dispersion acuosa electricamente conductora y procedimiento de electrodeposicion de metales en materiales no conductores
JP7204195B2 (ja) * 2018-01-26 2023-01-16 ユニチカ株式会社 めっき下地剤およびそれを用いた積層体
KR20210052942A (ko) 2019-11-01 2021-05-11 현대자동차주식회사 자동차 부재의 제조 방법 및 이를 통해 제조된 자동차 부재
CN113118234B (zh) * 2021-04-16 2022-09-27 江西富鸿金属有限公司 一种医疗设备用镀锡合金线的生产工艺
CN116024600B (zh) * 2022-11-28 2024-06-18 江苏安凯特科技股份有限公司 一种耐反向电流析氯钛阳极的制备工艺

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US6798127B2 (en) * 2002-10-09 2004-09-28 Nano-Proprietary, Inc. Enhanced field emission from carbon nanotubes mixed with particles
DE10259498A1 (de) * 2002-12-19 2004-07-01 Bayer Ag Leitfähige Thermoplaste mit Ruß und Kohlenstoff-Nanofibrillen
DE10328374A1 (de) * 2003-06-24 2005-02-03 Siemens Ag Piezoelektrisches Bauteil mit elektrischen Anschlusselementen und Verwendung des Bauteils
US20060025515A1 (en) * 2004-07-27 2006-02-02 Mainstream Engineering Corp. Nanotube composites and methods for producing

Also Published As

Publication number Publication date
EP2049711A1 (de) 2009-04-22
WO2008015168A1 (de) 2008-02-07
KR20090036600A (ko) 2009-04-14
JP2009545671A (ja) 2009-12-24
CN101522956A (zh) 2009-09-02
TW200825206A (en) 2008-06-16
RU2009107274A (ru) 2010-09-10
US20100006442A1 (en) 2010-01-14
BRPI0714608A2 (pt) 2013-06-18

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