IL146333A - Robust interconnect structure - Google Patents

Robust interconnect structure

Info

Publication number
IL146333A
IL146333A IL14633300A IL14633300A IL146333A IL 146333 A IL146333 A IL 146333A IL 14633300 A IL14633300 A IL 14633300A IL 14633300 A IL14633300 A IL 14633300A IL 146333 A IL146333 A IL 146333A
Authority
IL
Israel
Prior art keywords
layer
interconnect structure
robust interconnect
robust
alcu
Prior art date
Application number
IL14633300A
Other languages
English (en)
Other versions
IL146333A0 (en
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23218114&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL146333(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ibm filed Critical Ibm
Publication of IL146333A0 publication Critical patent/IL146333A0/xx
Publication of IL146333A publication Critical patent/IL146333A/xx

Links

Classifications

    • H10W20/40—
    • H10W72/012—
    • H10W72/221—
    • H10W72/251—
    • H10W72/252—
    • H10W72/29—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/952—
    • H10W74/147—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Noodles (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Handling Of Sheets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
IL14633300A 1999-05-19 2000-05-15 Robust interconnect structure IL146333A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/314,003 US6133136A (en) 1999-05-19 1999-05-19 Robust interconnect structure
PCT/GB2000/001847 WO2000072380A1 (en) 1999-05-19 2000-05-15 Robust interconnect structure

Publications (2)

Publication Number Publication Date
IL146333A0 IL146333A0 (en) 2002-07-25
IL146333A true IL146333A (en) 2005-03-20

Family

ID=23218114

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14633300A IL146333A (en) 1999-05-19 2000-05-15 Robust interconnect structure

Country Status (17)

Country Link
US (1) US6133136A (pl)
EP (1) EP1186034B1 (pl)
JP (1) JP3898894B2 (pl)
KR (1) KR100463492B1 (pl)
CN (1) CN1165081C (pl)
AT (1) ATE426247T1 (pl)
AU (1) AU4933500A (pl)
CA (1) CA2368950C (pl)
CZ (1) CZ302748B6 (pl)
DE (1) DE60041817D1 (pl)
ES (1) ES2320523T3 (pl)
HU (1) HUP0201473A2 (pl)
IL (1) IL146333A (pl)
MY (1) MY118419A (pl)
PL (1) PL201072B1 (pl)
TW (1) TW473921B (pl)
WO (1) WO2000072380A1 (pl)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6187680B1 (en) * 1998-10-07 2001-02-13 International Business Machines Corporation Method/structure for creating aluminum wirebound pad on copper BEOL
JP3387083B2 (ja) * 1999-08-27 2003-03-17 日本電気株式会社 半導体装置及びその製造方法
US6451681B1 (en) * 1999-10-04 2002-09-17 Motorola, Inc. Method of forming copper interconnection utilizing aluminum capping film
US6191023B1 (en) * 1999-11-18 2001-02-20 Taiwan Semiconductor Manufacturing Company Method of improving copper pad adhesion
US6387793B1 (en) 2000-03-09 2002-05-14 Hrl Laboratories, Llc Method for manufacturing precision electroplated solder bumps
JP3651765B2 (ja) * 2000-03-27 2005-05-25 株式会社東芝 半導体装置
US6551931B1 (en) * 2000-11-07 2003-04-22 International Business Machines Corporation Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
US20030116845A1 (en) * 2001-12-21 2003-06-26 Bojkov Christo P. Waferlevel method for direct bumping on copper pads in integrated circuits
JP3759909B2 (ja) * 2002-02-22 2006-03-29 松下電器産業株式会社 半導体装置及びその製造方法
US20030227091A1 (en) * 2002-06-06 2003-12-11 Nishant Sinha Plating metal caps on conductive interconnect for wirebonding
US6875693B1 (en) * 2003-03-26 2005-04-05 Lsi Logic Corporation Via and metal line interface capable of reducing the incidence of electro-migration induced voids
US6835580B1 (en) * 2003-06-26 2004-12-28 Semiconductor Components Industries, L.L.C. Direct chip attach structure and method
US6951775B2 (en) * 2003-06-28 2005-10-04 International Business Machines Corporation Method for forming interconnects on thin wafers
US20050098605A1 (en) * 2003-11-06 2005-05-12 International Business Machines Corporation Apparatus and method for low pressure wirebond
US7068138B2 (en) * 2004-01-29 2006-06-27 International Business Machines Corporation High Q factor integrated circuit inductor
KR100605315B1 (ko) 2004-07-30 2006-07-28 삼성전자주식회사 집적회로 칩의 입출력 패드 구조
JP2006120677A (ja) * 2004-10-19 2006-05-11 Alps Electric Co Ltd 配線基板の接続端子構造
US7282433B2 (en) 2005-01-10 2007-10-16 Micron Technology, Inc. Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
US20100117231A1 (en) * 2006-08-30 2010-05-13 Dennis Lang Reliable wafer-level chip-scale solder bump structure
JP2008159948A (ja) * 2006-12-25 2008-07-10 Rohm Co Ltd 半導体装置
US20080157382A1 (en) * 2006-12-28 2008-07-03 Chinthakindi Anil K Direct termination of a wiring metal in a semiconductor device
US7935408B2 (en) * 2007-10-26 2011-05-03 International Business Machines Corporation Substrate anchor structure and method
JP5627835B2 (ja) 2007-11-16 2014-11-19 ローム株式会社 半導体装置および半導体装置の製造方法
US7868453B2 (en) * 2008-02-15 2011-01-11 International Business Machines Corporation Solder interconnect pads with current spreading layers
CN101630667A (zh) 2008-07-15 2010-01-20 中芯国际集成电路制造(上海)有限公司 形成具有铜互连的导电凸块的方法和系统
US7851346B2 (en) * 2008-07-21 2010-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding metallurgy for three-dimensional interconnect
JP5249080B2 (ja) * 2009-02-19 2013-07-31 セイコーインスツル株式会社 半導体装置
JP5316261B2 (ja) * 2009-06-30 2013-10-16 富士通株式会社 マルチチップモジュールおよびプリント基板ユニット並びに電子機器
US8610283B2 (en) * 2009-10-05 2013-12-17 International Business Machines Corporation Semiconductor device having a copper plug
US9214385B2 (en) 2009-12-17 2015-12-15 Globalfoundries Inc. Semiconductor device including passivation layer encapsulant
US8446006B2 (en) * 2009-12-17 2013-05-21 International Business Machines Corporation Structures and methods to reduce maximum current density in a solder ball
US8492892B2 (en) 2010-12-08 2013-07-23 International Business Machines Corporation Solder bump connections
US20120326299A1 (en) * 2011-06-24 2012-12-27 Topacio Roden R Semiconductor chip with dual polymer film interconnect structures
CN104051323B (zh) * 2013-03-13 2017-12-29 中芯国际集成电路制造(上海)有限公司 一种半导体封装结构及其制备方法
CN104241146B (zh) * 2013-06-09 2017-10-31 中芯国际集成电路制造(上海)有限公司 金属垫的形成方法及半导体结构
US10002834B2 (en) * 2015-03-11 2018-06-19 Applied Materials, Inc. Method and apparatus for protecting metal interconnect from halogen based precursors
CN106505031B (zh) * 2015-09-07 2019-12-31 中芯国际集成电路制造(上海)有限公司 一种铜互连结构的制作方法、铜互连结构及电子装置
US10461026B2 (en) 2016-06-30 2019-10-29 International Business Machines Corporation Techniques to improve reliability in Cu interconnects using Cu intermetallics
US10535698B2 (en) 2017-11-28 2020-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor with pad structure
JP7430481B2 (ja) * 2018-05-31 2024-02-13 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4434434A (en) * 1981-03-30 1984-02-28 International Business Machines Corporation Solder mound formation on substrates
US5268072A (en) * 1992-08-31 1993-12-07 International Business Machines Corporation Etching processes for avoiding edge stress in semiconductor chip solder bumps
US5503286A (en) * 1994-06-28 1996-04-02 International Business Machines Corporation Electroplated solder terminal
US5545927A (en) * 1995-05-12 1996-08-13 International Business Machines Corporation Capped copper electrical interconnects
EP0751566A3 (en) * 1995-06-30 1997-02-26 Ibm Metal thin film barrier for electrical connections
US5785236A (en) * 1995-11-29 1998-07-28 Advanced Micro Devices, Inc. Advanced copper interconnect system that is compatible with existing IC wire bonding technology
US5731624A (en) * 1996-06-28 1998-03-24 International Business Machines Corporation Integrated pad and fuse structure for planar copper metallurgy
US6020640A (en) * 1996-12-19 2000-02-01 Texas Instruments Incorporated Thick plated interconnect and associated auxillary interconnect
JPH11340265A (ja) * 1998-05-22 1999-12-10 Sony Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR100463492B1 (ko) 2004-12-29
IL146333A0 (en) 2002-07-25
HUP0201473A2 (en) 2002-08-28
JP3898894B2 (ja) 2007-03-28
ES2320523T3 (es) 2009-05-25
EP1186034A1 (en) 2002-03-13
CA2368950A1 (en) 2000-11-30
CN1165081C (zh) 2004-09-01
TW473921B (en) 2002-01-21
ATE426247T1 (de) 2009-04-15
PL201072B1 (pl) 2009-03-31
EP1186034B1 (en) 2009-03-18
CA2368950C (en) 2012-10-02
CZ20014145A3 (cs) 2002-04-17
DE60041817D1 (de) 2009-04-30
KR20020005743A (ko) 2002-01-17
AU4933500A (en) 2000-12-12
JP2003500860A (ja) 2003-01-07
PL351305A1 (en) 2003-04-07
CZ302748B6 (cs) 2011-10-19
MY118419A (en) 2004-10-30
CN1350703A (zh) 2002-05-22
WO2000072380A1 (en) 2000-11-30
US6133136A (en) 2000-10-17

Similar Documents

Publication Publication Date Title
IL146333A (en) Robust interconnect structure
MXPA01012635A (es) Dispositivos, sistemas y metodos para auxiliar al corazon.
ZA200007359B (en) Laminate having barrier properties.
PL355109A1 (pl) Pochodne tert-butylo-(7-metylo-imidazo[1,2a]pirydyn-3-ylo)-aminy
MXPA01010754A (es) Configuracion de conjunto de teclas.
SG104919A1 (en) Method ot form, and structure of, a dual damascene interconnect device
MXPA02000051A (es) Composicion estructural de espuma-concreto resistente a huracan.
MXPA01008758A (es) Cristales laminados.
ZA99393B (en) Trovafloxacin mesylate tablet.
ZA200204325B (en) Area Denial.
MXPA03003526A (es) Estructura de interconexion escalable que utiliza manejo de calidad de servicio.
ZA200110127B (en) Substituted benzimidazole.
ZA200106409B (en) Encapsulation.
ZA200201685B (en) Copper tubing.
ZA200002601B (en) Metal composite.
ZA200200540B (en) Foundation structure.
ZA991008B (en) Acoustic devices.
ZA200105947B (en) Metallic network elevated floorboard structure.
AU3122P (en) ARCTIC BLAZE Prunus persica var. nucipersica
ZA200105736B (en) Barrier.
ZA200002686B (en) Barrier.
GB9905717D0 (en) Reject i.d.
ITRM990032A1 (it) Disconnettore telefonico.
ZA200007743B (en) Security devices.
BR7902311Y1 (pt) disposição construtiva aplicada em equipamento separador água-óleo.

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees