IL138641A - EMI method compatible with surface vehicle technologies and method for installing EMI gasket on surface harness - Google Patents
EMI method compatible with surface vehicle technologies and method for installing EMI gasket on surface harnessInfo
- Publication number
- IL138641A IL138641A IL13864199A IL13864199A IL138641A IL 138641 A IL138641 A IL 138641A IL 13864199 A IL13864199 A IL 13864199A IL 13864199 A IL13864199 A IL 13864199A IL 138641 A IL138641 A IL 138641A
- Authority
- IL
- Israel
- Prior art keywords
- electrically conductive
- gasket
- gasket assembly
- support layer
- emi
- Prior art date
Links
- 238000005516 engineering process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims abstract description 104
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 50
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 39
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 229920001971 elastomer Polymers 0.000 claims description 18
- 239000000806 elastomer Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- -1 polytetrafluoroethylene Polymers 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000004005 microsphere Substances 0.000 description 23
- 239000002245 particle Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 15
- 230000000712 assembly Effects 0.000 description 13
- 238000000429 assembly Methods 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 12
- 239000002131 composite material Substances 0.000 description 11
- 239000002243 precursor Substances 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 238000009434 installation Methods 0.000 description 9
- 239000004604 Blowing Agent Substances 0.000 description 8
- 239000011162 core material Substances 0.000 description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 7
- 239000011324 bead Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000006072 paste Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- IHIDFKLAWYPTKB-UHFFFAOYSA-N 1,3-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=C(Cl)C=CC=C1Cl IHIDFKLAWYPTKB-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- 229920006169 Perfluoroelastomer Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000001282 iso-butane Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000012260 resinous material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 235000015096 spirit Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 239000004131 EU approved raising agent Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000103 Expandable microsphere Polymers 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920005560 fluorosilicone rubber Polymers 0.000 description 1
- 235000010855 food raising agent Nutrition 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/052,080 US6255581B1 (en) | 1998-03-31 | 1998-03-31 | Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| PCT/US1999/003577 WO1999051074A1 (en) | 1998-03-31 | 1999-02-19 | Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL138641A0 IL138641A0 (en) | 2001-10-31 |
| IL138641A true IL138641A (en) | 2004-07-25 |
Family
ID=21975333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13864199A IL138641A (en) | 1998-03-31 | 1999-02-19 | EMI method compatible with surface vehicle technologies and method for installing EMI gasket on surface harness |
Country Status (15)
| Country | Link |
|---|---|
| US (2) | US6255581B1 (es) |
| EP (1) | EP1090538B1 (es) |
| JP (1) | JP4249391B2 (es) |
| KR (1) | KR100680015B1 (es) |
| CN (1) | CN1206896C (es) |
| AT (1) | ATE242591T1 (es) |
| AU (1) | AU749275B2 (es) |
| BR (1) | BR9909228B1 (es) |
| CA (1) | CA2325141C (es) |
| DE (1) | DE69908594T2 (es) |
| DK (1) | DK1090538T3 (es) |
| ES (1) | ES2195546T3 (es) |
| HU (1) | HUP0102258A3 (es) |
| IL (1) | IL138641A (es) |
| WO (1) | WO1999051074A1 (es) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002032203A1 (en) * | 2000-10-11 | 2002-04-18 | Telefonaktiebolaget L M Ericsson (Publ) | A method of making a gasket on a pcb and a pcb |
| EP1198164A1 (en) * | 2000-10-11 | 2002-04-17 | Telefonaktiebolaget L M Ericsson (Publ) | A method of making a gasket on a PCB and a PCB. |
| US20060119046A1 (en) * | 2000-12-23 | 2006-06-08 | Helmut Kahl | Method for producing a shielding gasket |
| DE10064968B4 (de) * | 2000-12-23 | 2006-01-19 | Helmut Kahl | Verfahren zur Herstellung einer Abschirmdichtung |
| US6570776B2 (en) * | 2001-06-20 | 2003-05-27 | Ericsson, Inc. | Shielded electronics package structure with enhanced mechanical reliability |
| NL1019088C2 (nl) * | 2001-10-02 | 2003-04-08 | Stork Screens Bv | Tegen straling beschermende pakking, alsmede werkwijze voor het vervaardigen daarvan. |
| EP1345486A3 (de) * | 2002-03-11 | 2006-04-19 | Helmut Kahl | Gerätegehäuse mit leitfähig beschichteter Abschirmdichtung bzw.- wand |
| DE10310604A1 (de) * | 2002-03-11 | 2003-10-09 | Helmut Kahl | Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich |
| US7129421B2 (en) * | 2002-12-06 | 2006-10-31 | Gore Enterprise Holdings, Inc. | Soft surface mount technology compatible EMI gasket |
| JP3978174B2 (ja) | 2003-03-07 | 2007-09-19 | 北川工業株式会社 | コンタクト |
| US20040180209A1 (en) * | 2003-03-12 | 2004-09-16 | Chih-Min Cheng | Thermal interface material |
| US6776226B1 (en) | 2003-03-12 | 2004-08-17 | National Starch And Chemical Investment Holding Corporation | Electronic device containing thermal interface material |
| US6874573B2 (en) * | 2003-07-31 | 2005-04-05 | National Starch And Chemical Investment Holding Corporation | Thermal interface material |
| US7344796B2 (en) * | 2004-02-18 | 2008-03-18 | Freudenberg-Nok General Partnership | Fluoroelastomer gasket compositions |
| US20050187331A1 (en) * | 2004-02-20 | 2005-08-25 | Yuan Hui L. | Fluoroelastomer gasket compositions |
| US20050187325A1 (en) * | 2004-02-20 | 2005-08-25 | Yuan Hui L. | Silicone gasket compositions |
| SE0401800D0 (sv) * | 2004-07-08 | 2004-07-08 | Andrew Corp | Shielding device in a base station |
| KR100664158B1 (ko) * | 2004-10-06 | 2007-01-04 | 엘지전자 주식회사 | 단락 방지용 전원단자 및 이를 포함하는 이동통신 단말기 |
| WO2007019732A1 (en) * | 2005-08-19 | 2007-02-22 | Intel Corporation | Surface mount component having magnetic layer thereon and method of forming same |
| US7488900B1 (en) | 2006-09-22 | 2009-02-10 | Laird Technologies, Inc. | Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding |
| JP5017547B2 (ja) * | 2006-11-10 | 2012-09-05 | 北川工業株式会社 | 導電コンタクト |
| US7488181B2 (en) * | 2007-01-09 | 2009-02-10 | Laird Technologies, Inc. | Electrocoated contacts compatible with surface mount technology |
| US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
| MY147054A (en) | 2008-03-07 | 2012-10-15 | Joinset Co Ltd | Solderable elastic electric contact terminal |
| DK2325948T3 (da) * | 2008-09-16 | 2013-06-03 | Fuji Polymer Ind | Elektroledende gummikomponent, fremgangsmåde til at bruge den og bærbar telefon omfattende den |
| JP2011040812A (ja) * | 2009-08-06 | 2011-02-24 | Panasonic Corp | 携帯無線機 |
| WO2011088164A2 (en) | 2010-01-14 | 2011-07-21 | Laird Technologies, Inc. | Electrical contacts with laser defined geometries |
| KR101040594B1 (ko) | 2010-04-16 | 2011-06-10 | 최철수 | 표면실장용 가스켓 및 그 제조방법 |
| KR100993253B1 (ko) * | 2010-04-28 | 2010-11-10 | 김선기 | 탄성 전기접촉단자 |
| US8002581B1 (en) * | 2010-05-28 | 2011-08-23 | Tyco Electronics Corporation | Ground interface for a connector system |
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1998
- 1998-03-31 US US09/052,080 patent/US6255581B1/en not_active Expired - Lifetime
-
1999
- 1999-02-19 JP JP2000541859A patent/JP4249391B2/ja not_active Expired - Lifetime
- 1999-02-19 DK DK99909514T patent/DK1090538T3/da active
- 1999-02-19 CA CA002325141A patent/CA2325141C/en not_active Expired - Lifetime
- 1999-02-19 IL IL13864199A patent/IL138641A/en not_active IP Right Cessation
- 1999-02-19 AT AT99909514T patent/ATE242591T1/de active
- 1999-02-19 AU AU28702/99A patent/AU749275B2/en not_active Expired
- 1999-02-19 KR KR1020007010844A patent/KR100680015B1/ko not_active Expired - Lifetime
- 1999-02-19 BR BRPI9909228-0B1A patent/BR9909228B1/pt not_active IP Right Cessation
- 1999-02-19 CN CNB998045772A patent/CN1206896C/zh not_active Ceased
- 1999-02-19 WO PCT/US1999/003577 patent/WO1999051074A1/en not_active Ceased
- 1999-02-19 HU HU0102258A patent/HUP0102258A3/hu unknown
- 1999-02-19 EP EP99909514A patent/EP1090538B1/en not_active Expired - Lifetime
- 1999-02-19 ES ES99909514T patent/ES2195546T3/es not_active Expired - Lifetime
- 1999-02-19 DE DE69908594T patent/DE69908594T2/de not_active Expired - Lifetime
- 1999-12-03 US US09/454,476 patent/US6235986B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69908594T2 (de) | 2004-04-29 |
| KR20010042299A (ko) | 2001-05-25 |
| AU2870299A (en) | 1999-10-18 |
| HK1035630A1 (en) | 2001-11-30 |
| ATE242591T1 (de) | 2003-06-15 |
| JP2002510873A (ja) | 2002-04-09 |
| US6235986B1 (en) | 2001-05-22 |
| JP4249391B2 (ja) | 2009-04-02 |
| AU749275B2 (en) | 2002-06-20 |
| BR9909228A (pt) | 2000-11-28 |
| IL138641A0 (en) | 2001-10-31 |
| US6255581B1 (en) | 2001-07-03 |
| EP1090538B1 (en) | 2003-06-04 |
| CN1206896C (zh) | 2005-06-15 |
| KR100680015B1 (ko) | 2007-02-09 |
| EP1090538A1 (en) | 2001-04-11 |
| HUP0102258A3 (en) | 2001-11-28 |
| CA2325141C (en) | 2004-05-04 |
| DK1090538T3 (da) | 2003-09-29 |
| ES2195546T3 (es) | 2003-12-01 |
| WO1999051074A1 (en) | 1999-10-07 |
| DE69908594D1 (de) | 2003-07-10 |
| HUP0102258A2 (hu) | 2001-09-28 |
| CA2325141A1 (en) | 1999-10-07 |
| BR9909228B1 (pt) | 2013-09-17 |
| CN1295782A (zh) | 2001-05-16 |
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