IL136706A - Modular imaging device - Google Patents
Modular imaging deviceInfo
- Publication number
- IL136706A IL136706A IL13670698A IL13670698A IL136706A IL 136706 A IL136706 A IL 136706A IL 13670698 A IL13670698 A IL 13670698A IL 13670698 A IL13670698 A IL 13670698A IL 136706 A IL136706 A IL 136706A
- Authority
- IL
- Israel
- Prior art keywords
- tiles
- imaging
- modules
- module
- tile
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 146
- 230000005855 radiation Effects 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 6
- 230000009849 deactivation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 49
- 239000004065 semiconductor Substances 0.000 description 11
- 238000013459 approach Methods 0.000 description 10
- BHWVLZJTVIYLIV-UHFFFAOYSA-N 3,4,4',5-Tetrachlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1 BHWVLZJTVIYLIV-UHFFFAOYSA-N 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ORCSMBGZHYTXOV-UHFFFAOYSA-N bismuth;germanium;dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Ge].[Ge].[Ge].[Bi].[Bi].[Bi].[Bi] ORCSMBGZHYTXOV-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000009607 mammography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical class C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/243—Modular detectors, e.g. arrays formed from self contained units
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Landscapes
- General Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Multimedia (AREA)
- High Energy & Nuclear Physics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9726770A GB2332608B (en) | 1997-12-18 | 1997-12-18 | Modular imaging apparatus |
| PCT/EP1998/007526 WO1999033117A1 (en) | 1997-12-18 | 1998-11-19 | Modular imaging apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL136706A0 IL136706A0 (en) | 2001-06-14 |
| IL136706A true IL136706A (en) | 2004-07-25 |
Family
ID=10823839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL13670698A IL136706A (en) | 1997-12-18 | 1998-11-19 | Modular imaging device |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6403964B1 (ja) |
| EP (1) | EP1042815A1 (ja) |
| JP (2) | JP4852193B2 (ja) |
| AU (1) | AU1963199A (ja) |
| GB (1) | GB2332608B (ja) |
| IL (1) | IL136706A (ja) |
| WO (1) | WO1999033117A1 (ja) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2289983B (en) | 1994-06-01 | 1996-10-16 | Simage Oy | Imaging devices,systems and methods |
| GB2371196A (en) * | 2000-12-22 | 2002-07-17 | Simage Oy | High energy radiation scan imaging system |
| US7136452B2 (en) | 1995-05-31 | 2006-11-14 | Goldpower Limited | Radiation imaging system, device and method for scan imaging |
| US9029793B2 (en) | 1998-11-05 | 2015-05-12 | Siemens Aktiengesellschaft | Imaging device |
| AU4603200A (en) * | 1999-04-26 | 2000-11-10 | Simage Oy | Device for imaging radiation |
| FR2793072B1 (fr) * | 1999-04-30 | 2001-11-30 | Commissariat Energie Atomique | Dispositif de detection compact pour gamma camera |
| DE19933472A1 (de) * | 1999-07-20 | 2001-02-01 | Daimler Chrysler Ag | Netzwerk zur Signalverarbeitung, insbesondere zur Bilddatenverarbeitung, und Bildaufnahmesystem |
| JP4433519B2 (ja) * | 1999-08-16 | 2010-03-17 | 株式会社ニコン | 電子カメラ |
| US7104686B2 (en) * | 2001-05-30 | 2006-09-12 | Canon Kabushiki Kaisha | Radiographic apparatus |
| US6841784B2 (en) * | 2002-07-02 | 2005-01-11 | Ray Therapy Imaging Ab | Radiation sensor device |
| EP1543351A1 (en) * | 2002-09-18 | 2005-06-22 | Koninklijke Philips Electronics N.V. | X-ray detector with a plurality of detector units |
| DE10244177A1 (de) * | 2002-09-23 | 2004-04-08 | Siemens Ag | Bilddetektor für Röntgeneinrichtungen mit rückseitig kontaktierten, organischen Bild-Sensoren |
| GB0224689D0 (en) * | 2002-10-23 | 2002-12-04 | Simage Oy | Formation of contacts on semiconductor substrates |
| WO2004038810A2 (en) * | 2002-10-25 | 2004-05-06 | Goldpower Limited | Circuit substrate and method |
| US7223981B1 (en) | 2002-12-04 | 2007-05-29 | Aguila Technologies Inc. | Gamma ray detector modules |
| DE60322662D1 (de) * | 2003-04-10 | 2008-09-18 | Agfa Healthcare Nv | Verfahren zur Erzeugung einem zusammenhängenden Bildes mit mehreren Röntgenabbildungsvorrichtungen |
| US7247858B2 (en) | 2003-04-10 | 2007-07-24 | Agfa Healthcare, N.V. | Method for creating a contiguous image using multiple X-ray imagers |
| US6982424B2 (en) * | 2003-06-02 | 2006-01-03 | Ge Medical Systems Global Technology Company, Llc | X-ray and CT image detector |
| DE10335662A1 (de) * | 2003-08-04 | 2005-03-10 | Siemens Ag | Detektormodul für einen Detektor zur Detektion ionisierender Strahlung sowie Detektor |
| JP3863872B2 (ja) * | 2003-09-30 | 2006-12-27 | 株式会社日立製作所 | 陽電子放出型断層撮影装置 |
| JP3863873B2 (ja) * | 2003-09-30 | 2006-12-27 | 株式会社日立製作所 | 放射線検査装置 |
| WO2005052636A1 (en) * | 2003-11-28 | 2005-06-09 | Philips Intellectual Property & Standards Gmbh | Radiation detector module |
| US7521683B2 (en) * | 2003-12-10 | 2009-04-21 | Koninklijke Philips Electronics N.V. | X-ray detector |
| JP4594624B2 (ja) * | 2004-01-13 | 2010-12-08 | 株式会社日立製作所 | 放射線検出装置および核医学診断装置 |
| JP2005241595A (ja) * | 2004-02-27 | 2005-09-08 | Japan Nuclear Cycle Development Inst States Of Projects | 被測定面形状に適合可能な放射能測定装置 |
| CN101010944B (zh) * | 2004-09-02 | 2010-06-16 | 索尼株式会社 | 摄像装置及摄像结果的输出方法 |
| US7555097B2 (en) * | 2005-09-28 | 2009-06-30 | Kabushiki Kaisha Toshiba | X-ray computer tomography system |
| JP2007125086A (ja) * | 2005-11-01 | 2007-05-24 | Ge Medical Systems Global Technology Co Llc | Ｘ線検出器およびｘ線ｃｔ装置 |
| US7796174B1 (en) * | 2006-04-25 | 2010-09-14 | Ball Aerospace & Technologies Corp. | Hybrid imager |
| US20080001246A1 (en) * | 2006-05-24 | 2008-01-03 | Dipak Sengupta | Single package detector and digital converter integration |
| JP2008096278A (ja) * | 2006-10-12 | 2008-04-24 | Fujifilm Corp | 放射線画像検出器 |
| US20110001052A1 (en) * | 2006-12-04 | 2011-01-06 | Luc Struye | Computed radiography system |
| US7956332B2 (en) * | 2008-10-29 | 2011-06-07 | General Electric Company | Multi-layer radiation detector assembly |
| JP5503883B2 (ja) * | 2009-03-06 | 2014-05-28 | 株式会社東芝 | Ｘ線ｃｔ装置及びｘ線検出装置 |
| JP5436004B2 (ja) * | 2009-03-31 | 2014-03-05 | キヤノン株式会社 | 撮影装置 |
| US9158369B2 (en) * | 2010-10-12 | 2015-10-13 | Tactonic Technologies, Llc | Sensors having a connecting frame and method for composite sensors |
| US8575558B2 (en) * | 2010-11-30 | 2013-11-05 | General Electric Company | Detector array with a through-via interposer |
| US20120193545A1 (en) * | 2011-01-31 | 2012-08-02 | General Electric Company | Detector systems with anode incidence face and methods of fabricating the same |
| FR2972268B1 (fr) * | 2011-03-01 | 2013-03-29 | Sagem Defense Securite | Detecteur de sursauts gamma compact a haute resolution |
| JP5903772B2 (ja) | 2011-04-11 | 2016-04-13 | ソニー株式会社 | 固体撮像素子およびカメラシステム |
| JP5508340B2 (ja) * | 2011-05-30 | 2014-05-28 | 富士フイルム株式会社 | 放射線画像検出装置及び放射線画像検出装置の制御方法 |
| JP5848047B2 (ja) | 2011-07-07 | 2016-01-27 | 富士フイルム株式会社 | 放射線検出素子、放射線画像撮影装置、及び放射線画像撮影システム |
| RU2608973C2 (ru) * | 2011-12-27 | 2017-01-30 | Конинклейке Филипс Н.В. | Установка тайлов для детекторов рет |
| KR101911314B1 (ko) | 2012-03-30 | 2018-10-24 | 삼성전자주식회사 | 엑스선 검출기 |
| US9012859B2 (en) | 2012-05-18 | 2015-04-21 | General Electric Company | Tiled X-ray imager panel and method of forming the same |
| US20150293040A1 (en) * | 2012-12-05 | 2015-10-15 | Hitachi, Ltd. | Calculation system and calculation method |
| CZ304899B6 (cs) * | 2013-08-30 | 2015-01-07 | České vysoké učení technické v Praze Ústav technické a experimentální fyziky | Detektor ionizujícího záření umožňující vytvoření souvislého digitálního obrazu |
| EP3137924A1 (en) * | 2014-04-30 | 2017-03-08 | Analogic Corporation | Detector array for imaging modality |
| JP6595803B2 (ja) * | 2014-06-13 | 2019-10-23 | キヤノン株式会社 | 放射線撮像装置、放射線撮像システムおよびその制御方法 |
| EP3143430B1 (en) * | 2014-10-31 | 2018-01-10 | Koninklijke Philips N.V. | Sensor device and imaging system for detecting radiation signals |
| CN105832353B (zh) | 2015-01-30 | 2020-11-06 | 佳能株式会社 | 放射线摄像系统 |
| CZ306067B6 (cs) * | 2015-05-12 | 2016-07-20 | Advacam S.R.O. | Modul detektoru ionizujícího záření |
| US10686003B2 (en) * | 2015-12-31 | 2020-06-16 | General Electric Company | Radiation detector assembly |
| JP6877289B2 (ja) * | 2017-07-31 | 2021-05-26 | キヤノン株式会社 | 放射線検出装置、放射線検出システム、及び放射線出装置の製造方法 |
| US10481284B2 (en) * | 2017-10-19 | 2019-11-19 | Kromek Group, PLC | Modular gamma imaging device |
| US10598801B2 (en) | 2017-10-19 | 2020-03-24 | Kromek Group, PLC | Modular gamma imaging device |
| US20190285758A1 (en) * | 2017-12-09 | 2019-09-19 | Linbo Yang | Integrated Multi Slice X-ray Detector for In-Line Computed Tomography |
| JP7166833B2 (ja) * | 2018-08-03 | 2022-11-08 | キヤノンメディカルシステムズ株式会社 | 放射線検出器及び放射線検出器モジュール |
| CN110664422A (zh) | 2019-09-09 | 2020-01-10 | 东软医疗系统股份有限公司 | 探测器模块、探测器及医疗成像设备 |
| US11346924B2 (en) * | 2019-12-09 | 2022-05-31 | Waymo Llc | SiPM with cells of different sizes |
| US11253212B2 (en) * | 2020-01-07 | 2022-02-22 | General Electric Company | Tileable X-ray detector cassettes |
| KR20220084405A (ko) * | 2020-10-06 | 2022-06-21 | 고쿠리츠 다이가꾸 호우진 시즈오까 다이가꾸 | 방사선 촬상 장치 |
| CN112951864B (zh) * | 2021-04-29 | 2022-08-02 | 中国科学院长春光学精密机械与物理研究所 | 一种拼接用图像传感器的窄边柔性封装结构及其封装方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467342A (en) * | 1982-07-15 | 1984-08-21 | Rca Corporation | Multi-chip imager |
| US5043582A (en) * | 1985-12-11 | 1991-08-27 | General Imagining Corporation | X-ray imaging system and solid state detector therefor |
| FR2598250B1 (fr) * | 1986-04-30 | 1988-07-08 | Thomson Csf | Panneau de prise de vue radiologique, et procede de fabrication |
| JPH01240887A (ja) * | 1988-03-23 | 1989-09-26 | Hitachi Ltd | 放射線検出器及びその製造方法 |
| FR2652655A1 (fr) * | 1989-10-04 | 1991-04-05 | Commissariat Energie Atomique | Dispositif matriciel de grandes dimensions pour la prise ou la restitution d'images. |
| JP2881856B2 (ja) * | 1989-11-07 | 1999-04-12 | 株式会社島津製作所 | 放射線像受像装置 |
| JP2890553B2 (ja) * | 1989-11-24 | 1999-05-17 | 株式会社島津製作所 | Ｘ線像撮像装置 |
| US5065245A (en) * | 1990-04-30 | 1991-11-12 | Eastman Kodak Company | Modular image sensor array |
| FR2693033B1 (fr) * | 1992-06-30 | 1994-08-19 | Commissariat Energie Atomique | Dispositif d'imagerie de grande dimension. |
| US5661309A (en) * | 1992-12-23 | 1997-08-26 | Sterling Diagnostic Imaging, Inc. | Electronic cassette for recording X-ray images |
| US5436458A (en) * | 1993-12-06 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Solid state radiation detection panel having tiled photosensitive detectors arranged to minimize edge effects between tiles |
| US5381014B1 (en) * | 1993-12-29 | 1997-06-10 | Du Pont | Large area x-ray imager and method of fabrication |
| GB2289983B (en) * | 1994-06-01 | 1996-10-16 | Simage Oy | Imaging devices,systems and methods |
| US5629524A (en) * | 1995-02-21 | 1997-05-13 | Advanced Scientific Concepts, Inc. | High speed crystallography detector |
| GB2305096B (en) * | 1995-08-29 | 1997-09-10 | Simage Oy | Imaging system and method |
| US5635718A (en) * | 1996-01-16 | 1997-06-03 | Minnesota Mining And Manufacturing Company | Multi-module radiation detecting device and fabrication method |
| JP2558403Y2 (ja) * | 1996-06-28 | 1997-12-24 | 株式会社島津製作所 | 放射線検出器 |
| GB2315157B (en) * | 1996-07-11 | 1998-09-30 | Simage Oy | Imaging apparatus |
| GB2322233B (en) * | 1997-02-18 | 2001-07-25 | Simage Oy | Semi-conductor imaging device |
-
1997
- 1997-12-18 GB GB9726770A patent/GB2332608B/en not_active Expired - Fee Related
-
1998
- 1998-11-19 WO PCT/EP1998/007526 patent/WO1999033117A1/en active Application Filing
- 1998-11-19 AU AU19631/99A patent/AU1963199A/en not_active Abandoned
- 1998-11-19 IL IL13670698A patent/IL136706A/en not_active IP Right Cessation
- 1998-11-19 EP EP98964428A patent/EP1042815A1/en not_active Ceased
- 1998-11-19 JP JP2000525931A patent/JP4852193B2/ja not_active Expired - Lifetime
- 1998-11-23 US US09/197,606 patent/US6403964B1/en not_active Expired - Lifetime
-
2002
- 2002-05-10 US US10/141,940 patent/US20020130266A1/en not_active Abandoned
-
2011
- 2011-09-13 JP JP2011199589A patent/JP5002069B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| AU1963199A (en) | 1999-07-12 |
| US20020130266A1 (en) | 2002-09-19 |
| EP1042815A1 (en) | 2000-10-11 |
| JP2001527295A (ja) | 2001-12-25 |
| GB2332608A (en) | 1999-06-23 |
| WO1999033117A1 (en) | 1999-07-01 |
| JP2011257431A (ja) | 2011-12-22 |
| GB9726770D0 (en) | 1998-02-18 |
| US6403964B1 (en) | 2002-06-11 |
| JP4852193B2 (ja) | 2012-01-11 |
| JP5002069B2 (ja) | 2012-08-15 |
| GB2332608B (en) | 2000-09-06 |
| IL136706A0 (en) | 2001-06-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6403964B1 (en) | Modular imaging apparatus | |
| US6236051B1 (en) | Semiconductor radiation detector | |
| US7339176B2 (en) | Radiation detector head | |
| US6408110B2 (en) | Tiled imaging apparatus providing substantially continuous imaging | |
| EP1459384B1 (en) | Sensor arrangement consisting of light-sensitive and/or x-ray sensitive sensors | |
| US20130026376A1 (en) | Radiation detector module | |
| US6323475B1 (en) | Hybrid semiconductor imaging device having plural readout substrates | |
| US9960203B2 (en) | Radiation sensor | |
| US6703617B1 (en) | Device for imaging radiation | |
| WO2002052505A2 (en) | A radiation imaging system and scanning device | |
| EP1060414A1 (en) | Semiconductor imaging device | |
| Luhta et al. | A new 2D-tiled detector for multislice CT | |
| JP4088986B2 (ja) | ２次元放射線検出器 | |
| US20240134071A1 (en) | Radiation detector module including application specific integrated circuit with through-substrate vias | |
| GB2349504A (en) | Imaging device assembly | |
| WO2023091162A1 (en) | Edge arrangment for tileable pixelated emission sensor | |
| GB2371196A (en) | High energy radiation scan imaging system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| EXP | Patent expired |