IL126993A - Siloxane and siloxane derivatives as encapsulants for organic light emitting devices - Google Patents
Siloxane and siloxane derivatives as encapsulants for organic light emitting devicesInfo
- Publication number
- IL126993A IL126993A IL12699396A IL12699396A IL126993A IL 126993 A IL126993 A IL 126993A IL 12699396 A IL12699396 A IL 12699396A IL 12699396 A IL12699396 A IL 12699396A IL 126993 A IL126993 A IL 126993A
- Authority
- IL
- Israel
- Prior art keywords
- siloxane
- film
- optical element
- organic
- light emitting
- Prior art date
Links
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title claims abstract description 107
- 239000008393 encapsulating agent Substances 0.000 title description 27
- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 239000012044 organic layer Substances 0.000 claims abstract description 22
- 230000004044 response Effects 0.000 claims abstract description 4
- 230000037361 pathway Effects 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- -1 Siloxanes Chemical class 0.000 description 22
- 239000000975 dye Substances 0.000 description 20
- 239000010410 layer Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001053 micromoulding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 241000133640 Aspergillus multicolor Species 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229940123457 Free radical scavenger Drugs 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229940123973 Oxygen scavenger Drugs 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/917—Electroluminescent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB1996/000665 WO1998002019A1 (en) | 1996-07-10 | 1996-07-10 | Siloxane and siloxane derivatives as encapsulants for organic light emitting devices |
Publications (2)
Publication Number | Publication Date |
---|---|
IL126993A0 IL126993A0 (en) | 1999-09-22 |
IL126993A true IL126993A (en) | 2002-12-01 |
Family
ID=11004450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12699396A IL126993A (en) | 1996-07-10 | 1996-07-10 | Siloxane and siloxane derivatives as encapsulants for organic light emitting devices |
Country Status (9)
Country | Link |
---|---|
US (3) | US5855994A (ja) |
EP (1) | EP0910931B1 (ja) |
JP (1) | JP3957760B2 (ja) |
AT (1) | ATE205998T1 (ja) |
DE (1) | DE69615410T2 (ja) |
ES (1) | ES2164250T3 (ja) |
IL (1) | IL126993A (ja) |
TW (1) | TW421774B (ja) |
WO (1) | WO1998002019A1 (ja) |
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JP2000150149A (ja) * | 1998-11-13 | 2000-05-30 | Rohm Co Ltd | 有機el素子の製造方法 |
US6552488B1 (en) * | 1999-08-24 | 2003-04-22 | Agilent Technologies, Inc. | Organic electroluminescent device |
US20010053559A1 (en) * | 2000-01-25 | 2001-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating display device |
US6867539B1 (en) | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
US6538375B1 (en) * | 2000-08-17 | 2003-03-25 | General Electric Company | Oled fiber light source |
KR100477784B1 (ko) * | 2000-08-31 | 2005-03-22 | 매그나칩 반도체 유한회사 | 트렌치 내부의 공기로 이루어지는 집광층을 구비하는이미지 센서 및 그 제조 방법 |
JP4053260B2 (ja) * | 2000-10-18 | 2008-02-27 | シャープ株式会社 | 有機エレクトロルミネッセンス表示素子 |
US6692326B2 (en) | 2001-06-16 | 2004-02-17 | Cld, Inc. | Method of making organic electroluminescent display |
JP4766218B2 (ja) * | 2001-07-09 | 2011-09-07 | セイコーエプソン株式会社 | 有機elアレイ露光ヘッドとその作製方法及びそれを用いた画像形成装置 |
US6656611B2 (en) | 2001-07-20 | 2003-12-02 | Osram Opto Semiconductors Gmbh | Structure-defining material for OLEDs |
JP2003054030A (ja) * | 2001-08-10 | 2003-02-26 | Sharp Corp | 発光素子および発光素子アレイ並びに発光素子アレイを用いたプリンタ |
KR100787301B1 (ko) * | 2001-08-30 | 2007-12-21 | 샤프 가부시키가이샤 | 유기 el 장치의 제조 방법 및 유기 el 장치 |
JP4104339B2 (ja) * | 2002-02-06 | 2008-06-18 | 松下電器産業株式会社 | 発光素子及びその製造方法、並びに表示装置 |
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US6887733B2 (en) * | 2002-09-11 | 2005-05-03 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Method of fabricating electronic devices |
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JP4208526B2 (ja) * | 2002-09-12 | 2009-01-14 | キヤノン株式会社 | 有機elディスプレイ装置及び該ディスプレイ装置を有する電子機器 |
US7699482B2 (en) | 2002-09-25 | 2010-04-20 | Fujifilm Corporation | Light-emitting element |
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US20040206953A1 (en) * | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
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US7344901B2 (en) * | 2003-04-16 | 2008-03-18 | Corning Incorporated | Hermetically sealed package and method of fabricating of a hermetically sealed package |
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JP4093943B2 (ja) * | 2003-09-30 | 2008-06-04 | 三洋電機株式会社 | 発光素子およびその製造方法 |
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US20130236681A1 (en) * | 2012-03-06 | 2013-09-12 | Chang Min Lee | Photocurable composition, barrier layer including the same, and encapsulated apparatus including the same |
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KR20230117645A (ko) | 2017-04-26 | 2023-08-08 | 오티아이 루미오닉스 인크. | 표면의 코팅을 패턴화하는 방법 및 패턴화된 코팅을포함하는 장치 |
CN108198844A (zh) * | 2018-01-03 | 2018-06-22 | 京东方科技集团股份有限公司 | 一种显示面板、其制作方法及显示装置 |
CN110783367B (zh) | 2018-07-31 | 2022-05-24 | 京东方科技集团股份有限公司 | 显示面板 |
KR20200099651A (ko) | 2019-02-14 | 2020-08-25 | 삼성디스플레이 주식회사 | 유기 발광 소자 및 이를 포함한 발광 장치 |
JP2022528267A (ja) | 2019-03-25 | 2022-06-09 | シノヴィア テクノロジーズ | 非平衡熱硬化プロセス |
JP2023553379A (ja) | 2020-12-07 | 2023-12-21 | オーティーアイ ルミオニクス インコーポレーテッド | 核形成抑制被膜及び下地金属被膜を用いた導電性堆積層のパターニング |
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-
1996
- 1996-07-10 JP JP50496498A patent/JP3957760B2/ja not_active Expired - Lifetime
- 1996-07-10 AT AT96918817T patent/ATE205998T1/de active
- 1996-07-10 IL IL12699396A patent/IL126993A/en not_active IP Right Cessation
- 1996-07-10 WO PCT/IB1996/000665 patent/WO1998002019A1/en active IP Right Grant
- 1996-07-10 EP EP96918817A patent/EP0910931B1/en not_active Expired - Lifetime
- 1996-07-10 ES ES96918817T patent/ES2164250T3/es not_active Expired - Lifetime
- 1996-07-10 DE DE69615410T patent/DE69615410T2/de not_active Expired - Lifetime
- 1996-11-14 US US08/747,791 patent/US5855994A/en not_active Expired - Lifetime
-
1997
- 1997-04-29 TW TW086105605A patent/TW421774B/zh not_active IP Right Cessation
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1998
- 1998-09-16 US US09/154,620 patent/US6337381B1/en not_active Expired - Lifetime
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2001
- 2001-08-23 US US09/935,888 patent/US6468590B2/en not_active Expired - Lifetime
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US6468590B2 (en) | 2002-10-22 |
EP0910931B1 (en) | 2001-09-19 |
DE69615410T2 (de) | 2002-06-20 |
US5855994A (en) | 1999-01-05 |
IL126993A0 (en) | 1999-09-22 |
ES2164250T3 (es) | 2002-02-16 |
JP3957760B2 (ja) | 2007-08-15 |
US6337381B1 (en) | 2002-01-08 |
TW421774B (en) | 2001-02-11 |
ATE205998T1 (de) | 2001-10-15 |
EP0910931A1 (en) | 1999-04-28 |
DE69615410D1 (de) | 2001-10-25 |
US20020004577A1 (en) | 2002-01-10 |
WO1998002019A1 (en) | 1998-01-15 |
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