TWI276231B - Organic light-emitting diode with drying film and method for manufacturing thereof - Google Patents
Organic light-emitting diode with drying film and method for manufacturing thereof Download PDFInfo
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I2?623lI2?623l
別本發明係關於一種有機發光二極體及其製造方法,特 榀胃於一種具有除水薄膜(drying layer)的有機發光二 W體及其製造方法。 一 【習知技術】 r 有機發光二極體(Organic Light-Emitting Diode ) 自發光、無視角、省電、製程容易、成本低、高應答 用:以及全彩化等優點,使有機發光二極體具有極大的應 <曰力’可望成為下一代的平面顯示器及平面光源照明, 匕括特殊光源及一般照明。 請參照 $ 一電極1 2 15。其中, W及第二電 有機發光二 第二電極14 使得載子在 由電子與電 發光層1 3中 式釋放出能 圖1所示,有機發光二極體1包括一基板U、一 、一有機發光層13、一第二電極14以及一蓋板 基板11與第一電極12為透光材質,而第一電極 極1 4係分別作為陽極與陰極;當施以一電流於 極體1時電洞係由第一電極12注入,同時電子由 注入,此時,由於外加電場所造成的電位差, 有機發光層13中移動、相遇而產生再結合,而 洞結合所產生的激子(excit〇rl)能夠激發有機 的發光分子’然後激發態的發光分子以光的形 量。 、 承上所述,在有機發光二極體中較常發生之衰退機制 為不發光區域(dark spot)的生成,因此要提升有機發光二 極體的耐久性(durability),就在於如何降低不發光區域The present invention relates to an organic light-emitting diode and a method of manufacturing the same, and an organic light-emitting body having a drying layer and a method of manufacturing the same. [Ordinary technology] r Organic Light-Emitting Diode Self-illumination, no viewing angle, power saving, easy process, low cost, high response: and full color, etc., make organic light-emitting diode The body has a great ability to be the next generation of flat panel display and flat light source illumination, including special light sources and general illumination. Please refer to $1 electrode 1 2 15. Wherein, W and the second electro-optical second electrode 14 enable the carrier to be released from the electron and electroluminescent layer 13 as shown in FIG. 1. The organic light-emitting diode 1 comprises a substrate U, an organic The light-emitting layer 13, the second electrode 14, and the cover substrate 11 and the first electrode 12 are made of a light-transmitting material, and the first electrode 12 is used as an anode and a cathode respectively; when a current is applied to the pole body 1 The hole system is injected by the first electrode 12, and the electrons are injected. At this time, due to the potential difference caused by the applied electric field, the organic light-emitting layer 13 moves and meets to recombine, and the excitons generated by the hole combination (excit〇rl) A luminescent molecule capable of exciting an organic luminescent molecule 'then excited state' in the form of light. As mentioned above, the decay mechanism that occurs more frequently in organic light-emitting diodes is the formation of a dark spot. Therefore, to improve the durability of the organic light-emitting diode, it is to reduce the Luminous area
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1276231 案號 91125334 五、發明說明(2) 的生成。而有機發光二極體結構中的有機官能性材料與作 為陰極的第二電極易與空氣中的水分及氧氣反應(尤^是 水分)’導致不發光區域的生成。因此,將水分徹底的= =是相當重要的。故,一般在製造有機發光二極體時,通 常會於真空狀態下進行鍍膜,並以封裝的方式,將有機發 光二極體加以密封。但這樣的方式,仍然無法完全確保^ 機發光二極體不會受到水分的影響而造成不發光區域的生 成0 如上所述,為了要徹底防止不發光區域的生成,進而 ^升有機發光'一極體的舞命及安定性,首要便是完全除去 有機發光二極體内部的水。一種常見的方法是在有機發光 一極體的内部添加一個吸水劑(water-trapping agent)或 是乾燥劑(drying agent)。為了解決有機發光二極體内部 不發光區域的生成,已有數種相關的專利申請案:如 Kawami等人於歐洲專利案EP0776 1 4 7中所提出的,將有機發 光二極體密封於一含有化學吸水特性之固體材料的密封 (airtight )容器内,這類具有化學吸水特性的化合物包 括氧化約及氧化鋇等金屬氧化物。而在英國專利案 GB 2368192中,His am itsu等人使用有機金屬化合物 (organometal lie compound)當做吸水材,此有機金屬化合 物可以有效的吸附有機發光二極體内部的水,同時能吸附 其他化學吸水劑(chemical drying agents)及物理吸水劑 (Physical drying agents),進而達到防止不發光區域的 產生。而在美國專利案US6226890中,Boroson等人提出,1276231 Case No. 91125334 V. Generation of invention (2). The organofunctional material in the organic light-emitting diode structure and the second electrode as the cathode are easily reacted with moisture and oxygen in the air (especially moisture) to cause the formation of non-light-emitting regions. Therefore, it is quite important to have moisture completely ==. Therefore, in general, in the manufacture of an organic light-emitting diode, the coating is usually performed under vacuum, and the organic light-emitting diode is sealed by encapsulation. However, in this way, it is still impossible to completely ensure that the light-emitting diode is not affected by moisture and cause the generation of non-light-emitting areas. As described above, in order to completely prevent the generation of non-light-emitting areas, the organic light emission is further improved. The ultimate in the life and stability of the polar body is to completely remove the water inside the organic light-emitting diode. A common method is to add a water-trapping agent or a drying agent inside the organic light-emitting body. In order to solve the problem of the formation of non-light-emitting regions in the organic light-emitting diodes, there are several related patent applications: as disclosed in Kawami et al., European Patent Application No. EP 0776 147, the organic light-emitting diode is sealed in a In an airtight container of a solid material having chemical water absorption characteristics, such a compound having chemical water absorption characteristics includes a metal oxide such as oxidation and cerium oxide. In the British patent case GB 2368192, His am itsu et al. use an organometallic lie compound as a water absorbing material, which can effectively adsorb water inside the organic light-emitting diode while adsorbing other chemical water absorption. Chemical drying agents and physical drying agents further prevent the occurrence of non-light-emitting areas. In U.S. Patent No. 6,226,890, Boroson et al.
1276231 修正 I 號 91125334 五、發明說明(3) 將乾燥劑摻混於一具有較好的水氣透過率(w a ^ e r v a p q P transmission rate)的黏著劑(binder)中,再使其於有機 發光二極體内形成一薄膜,使其能有較好或維持固體乾 燥劑之吸水效果。 & 更詳細地說,一般將吸水材填充於有機發光二極體内 的方式有二,請參照圖2 A所示,其一係先將吸水材2 6裝填 於一已預鑄有凹槽251之蓋板25内,再於凹槽251上方加上 一層透水薄膜27,隨後將裝有吸水材26之蓋板25與已製備 好的有機發光二極體上下堆疊(如圖2B所示),並以封膠 2 52將蓋板25與基板21密合以形成一密封空間,而第一電極 22、有機發光層23、第二電極24、透水薄膜27及吸水材26 係位於此密封空間中。但使用該項技術,因為需要在凹槽 251、中裝填吸水材26,同時需要加上一層透水薄膜27,如此 將增加製程上的複雜性,使得生產的良率降低與製造成本 大增。 、 另外’請參照圖3A所示,其二係將吸水材36摻混於具 透水性之高分子溶液中,藉由塗佈的方式,於蓋板35上形 成一 $括有吸水材36之薄膜37,隨後再將溶劑去除,接著 再將蓋板35與已製備好的有機發光二極體上下堆疊(如圖 3B $不)’並以封膠351將蓋板35與基板31密合以形成一密 封空間’而第一電極32、有機發光層33、第二電極34、薄 膜37及吸水材36係位於此密封空間中。此方法雖然在製程 ^與封裝製程較為接近,而減少了製程技術上的複雜性, 但在塗佈製程之後,必須進行烘烤製程來將溶劑去除,結1276231 Revision I No. 91125334 V. Inventive Note (3) The desiccant is blended into a binder with good water vapor transmission rate (wa ervapq P transmission rate), and then it is made into organic light-emitting A film is formed in the polar body to better or maintain the water absorption effect of the solid desiccant. & In more detail, there are generally two ways to fill the water-absorbing material in the organic light-emitting diode. Please refer to FIG. 2A, which first fills the water-absorbing material 26 with a groove. In the cover plate 25 of the 251, a water-permeable film 27 is further applied over the groove 251, and then the cover plate 25 containing the water absorbing material 26 is stacked on top of the prepared organic light-emitting diode (as shown in FIG. 2B). And sealing the cover plate 25 and the substrate 21 with the sealant 2 52 to form a sealed space, and the first electrode 22, the organic light-emitting layer 23, the second electrode 24, the water-permeable film 27 and the water absorbing material 26 are located in the sealed space. in. However, with this technique, it is necessary to fill the water absorbing material 26 in the groove 251, and at the same time, it is necessary to add a water permeable film 27, which increases the complexity of the process, and the production yield is lowered and the manufacturing cost is greatly increased. In addition, please refer to FIG. 3A, in which the water absorbing material 36 is blended into the water permeable polymer solution, and a water absorbing material 36 is formed on the cover plate 35 by coating. The film 37 is then removed from the solvent, and then the cover plate 35 is stacked on top of the prepared organic light-emitting diode (as shown in FIG. 3B), and the cover plate 35 is adhered to the substrate 31 with the sealant 351. A sealed space is formed, and the first electrode 32, the organic light-emitting layer 33, the second electrode 34, the film 37, and the water absorbing material 36 are located in the sealed space. Although the method is close to the packaging process and reduces the complexity of the process technology, after the coating process, the baking process must be performed to remove the solvent.
1276231 3 曰 修止 茗號9〗125泊4 五、發明說明(4) ^二會造成有機發光二極體内仍然殘留有部份溶劑,因而 =,封膠351的劣化,進而使得基板31與蓋板35之剝離,並 &成元件的損壞。 + &在上述舉例中,吸水材係利用塗佈方式,並利用高分 =液作為黏著劑將吸水材固定在有機發光二極體内部以 除水層,然而,有機發光二極體中的有機發光層及 =二電極,係利用沉積方式所形成,無法與常壓下的除水 製程達到製程整合在相同的操作壓力了,而需要破 真二導致製程複雜化、良率降低、製造成本增加;再者, Ϊ ΐ ^式形成—除水層還會有孔洞(Pin hQle)與塗佈死 月的問題。 益法iUr用黏著劑來固定吸水材時’除水層之厚度 .;、=效也減低,因而會限制有機發光二極體之厚度的縮 ,、私又,特別是有機發光二極體因結構簡平 面顯示器其厚度可以比液晶顯示器更薄,卻受== m'不彰,而使得在封裝時需要添加大量的吸水 ϊ可二極體厚度增加,犧牲了有機發光顯示 二極體内部的水分子,所以,只有固定於;m:;先 水材能夠達到吸附水分子的效果,目而益法二=的吸 材的吸附能力。 •、有效發揮吸水 如何提供一種有機發光二極體及i 以期犯夠整合沉積製程與封二每方法, 衣表枉冬铞作墩境來形成除水1276231 3 曰 茗 茗 9 〗 〗 〗 〗 〗 125 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五The cover plate 35 is peeled off and & damaged into components. + & In the above examples, the water absorbing material is applied by a coating method, and the water absorbing material is fixed inside the organic light emitting diode by a high score = liquid as an adhesive to remove the water layer, however, in the organic light emitting diode The organic light-emitting layer and the second electrode are formed by the deposition method, and cannot be integrated with the same operating pressure in the water removal process under normal pressure, and the need to break the two causes the process complexity, the yield reduction, and the manufacturing cost. Increase; in addition, Ϊ ΐ ^ form formation - there will be holes in the water layer (Pin hQle) and coating the dead moon. Yifa iUr uses an adhesive to fix the water absorbing material. 'The thickness of the water removal layer is reduced. The effect is also reduced, thus limiting the shrinkage of the thickness of the organic light-emitting diode, and the privacy, especially the organic light-emitting diode. The structure of the flat-panel display can be thinner than the liquid crystal display, but it is not limited by the == m', so that a large amount of squeegee needs to be added during the packaging, and the thickness of the diode is increased, sacrificing the inside of the organic light-emitting display diode. Water molecules, so, only fixed in; m:; first water can achieve the effect of adsorbing water molecules, the best way to absorb the absorption capacity of the suction material. • Effectively exerting water absorption How to provide an organic light-emitting diode and i to make it possible to integrate the deposition process and seal each method, and form a water-repellent environment to form water removal
1276231 j 號 91125^4 五、發明說明(5) 層、減小除水層之原声 —1 *—· 正b木‘, 厚度M及有效發揮除欢抵 正疋备别光電產業的重要課題之一。x層之吸附能力, 曰 月 正θ αΙΓκ/手度以及有效 正疋當别光電產業的重要課題之 【發明概要】 水薄ϊ:ίΐ問題’本發明之目的為提供— ' 又的有機發光二極體及其製、i、種能夠減小除 的有機發光二極體及其製ΪΪ;發揮除水薄膜 本發明之又一 a的為提供一 2 =去。 裝製程之操作環境來形 沉積製程與封 製造方法。 寻膜的有機發光二極體及其 為達上述目的’依本發 方法係,用沉積方式來形成除水薄膜。、二極體及其製造 緣是,依本發明之有機發光二極體 一電極、一有機發光層、一第二 一^二基板、一第 :護層。在本發明中,第一電極係形成於:板:膜=二 上,除水薄膜係以沉積方式形成於基板上方,保 於基板上方並且與基板形成—密封空間,以便將第二電 有機發光層、第二電極及除水薄膜容置於此密封空間 另夕胃卜,本發明亦提供一種有機發光二極體製造方法, 其包括提供一基板、於基板上形成一第一電極、於第一電 極上形成一有機發光層、於有機發光層上形成一第二電 第11頁 1276231 故 91125334— Λ 曰 五、發明說明(6) 極、以沉積方 上方形成一保 密封空間,其 及除水薄膜。 如上所述 方法係利用沉 膜時能夠整合 造成本,減少 下的機會以提 留的問題及節 吸水材,所以 水薄膜之吸附 修正 式於基板 護層。在 係容置有 ,由於依 積方式來 沉積製程 有機發光 昇良率, 省成本; 能夠減小 能力。 上方形成—仏, 本發明ί,Ϊ水薄…及於基板 保護層係與基板形成一 電極、有機發光層、第二電極 本,月之有機發光二極體及其製造 :射2薄犋,所以在形成除水薄 1、Α ^ 程之操作環境,以降低製 兀件於封奘制< |製程前暴露在大氣環境 而且利用沉積製程能夠避免溶劑殘 此外/由於不需使用黏著劑來固定 除水薄臈之厚度、並有效地發揮除 【較佳實施例之詳細說明】 以下將參照相關圖式,古穿明# 士 機發光二極體及其法二r月較佳實施例之有 參照符號加以說明 其中相同的元件將以相同的 體"請括u:示,依本發明較佳實施例之有機發光二極 = 一第一電極42、-有機發光層43、-Ϊ 一電極44、=除水薄膜45以及一保護層46。 第 士圖所示,第一電極42係形成於基板41之上;有 光層4 3係形成於筮 _ 0 , ^ 有機發 機發光声43之卜上;第二電極44係形成於有 佴罐6 ’除水薄膜45係形成於第二電極44上;而 °曰’、匕覆第一電極42、有機發光層43、第二電極1276231 j No. 91125^4 V. Invention description (5) Layer, reduce the original sound of the water removal layer - 1 * - · 正 b木', thickness M and effectively play an important role in the preparation of the optoelectronic industry One. The adsorption capacity of the x layer, the 正 正 θ α ΙΓ / / hand and the effective 疋 疋 重要 光电 光电 光电 光电 光电 光电 光电 光电 光电 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 ' ' ' ' ' ' ' ' The polar body and its system, i, species can reduce the removal of the organic light-emitting diode and its preparation; the water-removing film is used to provide a 2 = de-off. The manufacturing environment of the process is used to form processes and seal manufacturing methods. The film-forming organic light-emitting diode and the film for forming the water-removal film are formed by deposition according to the method of the present invention. The diode and the manufacturing edge thereof are an organic light emitting diode electrode, an organic light emitting layer, a second substrate, and a protective layer according to the present invention. In the present invention, the first electrode is formed on: a plate: film=two, and the water-removing film is formed on the substrate in a deposition manner, and is secured over the substrate and forms a sealed space with the substrate to enable the second electro-optical light to be emitted. The layer, the second electrode and the water-removing film are accommodated in the sealed space. The invention also provides a method for manufacturing an organic light-emitting diode, comprising: providing a substrate, forming a first electrode on the substrate, An organic light-emitting layer is formed on one of the electrodes, and a second electrode is formed on the organic light-emitting layer. The first electricity is on the 11th page, 1272623, so 91125334 - 曰 曰 、, invention description (6) pole, forming a sealed space above the deposition side, and Water film. As described above, the method utilizes a film to integrate the cause of the film, reduces the chance of retention, and saves the water absorbing material, so that the adsorption of the water film is corrected to the substrate cover. It is placed in the system, and the deposition process is organically based on the growth rate, which saves the cost; it can reduce the capacity. The upper layer is formed by 仏, the invention is Ϊ, the water is thin... and the substrate protective layer and the substrate form an electrode, the organic light-emitting layer, the second electrode, the moon organic light-emitting diode and the manufacture thereof: the film is thin, Therefore, in the formation of the water thinning 1, the operating environment, in order to reduce the sealing of the parts in the sealing system before exposure to the atmosphere and the use of deposition processes can avoid solvent residues / because no adhesive is needed Fixing the thickness of the water removal thinner and effectively exerting the details of the preferred embodiment. Reference will be made to the related drawings, the ancient light-emitting diode and the preferred embodiment of the method. The same elements will be denoted by the same reference numerals, and the organic light-emitting diodes according to the preferred embodiment of the present invention will be described as an organic light-emitting diode according to a preferred embodiment of the present invention. The electrode 44, the water removal film 45, and a protective layer 46. As shown in the figure, the first electrode 42 is formed on the substrate 41; the light layer 43 is formed on the 筮_0, ^ organic light illuminating sound 43; and the second electrode 44 is formed on the ytterbium The tank 6' water removal film 45 is formed on the second electrode 44; and the first electrode 42, the organic light-emitting layer 43, and the second electrode
I晒 第12頁 1276231 _案號91125334_年月 a 條正__ 五、發明說明(7) 44、以及除水薄膜45。 本實施例中’基板41通常為一透明基板,例如為一玻 璃基板、一塑膠(plastic)基板或是一柔性(fiexible) 基板。其中,塑膠基板與柔性基板可為一聚碳酸酉旨 (polycarbonate,PC)基板、一聚 g旨(p〇iyester,pet) 基板、一環烯共聚物(cyclic olefin copolymer,COC) 基板、一金屬絡合物基材一ί哀烯共聚物(metall〇cene-based cyclic olefin copolymer, mCOC )基板或——薄型玻 璃(Thin Glass)基板。I Sun 12th page 1276231 _ Case No. 91125334_年月 a Positive __ 5, invention description (7) 44, and water removal film 45. In the present embodiment, the substrate 41 is usually a transparent substrate, such as a glass substrate, a plastic substrate or a fiexible substrate. The plastic substrate and the flexible substrate may be a polycarbonate (PC) substrate, a poly(p〇iyester, pet) substrate, a cyclic olefin copolymer (COC) substrate, a metal network. A metall〇cene-based cyclic olefin copolymer (mCOC) substrate or a thin glass substrate.
第一電極42可以是利用濺鍍(sputtering )方式或是 離子電鍍(ion plating)方式形成於基板41上,此第一電 極4 2通常作為陽極且其材質通常為一透明的可導電之金屬 氧化物,例如是氧化銦錫(I TO )、氧化鋁鋅(AZ0 )或是 氧化銦鋅(IZ0 )。 有機發光層4 3通常包含一電洞注入層、一電洞傳遞 層、一發光層、一電子傳遞層以及一電子注入層(圖中未 顯示)。舉例而言,電洞注入層的主要材料*c〇pper phthalocyanine (CuPc);電洞傳輸層的材料主要係為The first electrode 42 may be formed on the substrate 41 by sputtering or ion plating. The first electrode 42 is usually used as an anode and the material is usually a transparent conductive metal oxide. The substance is, for example, indium tin oxide (I TO ), aluminum zinc oxide (AZ0 ) or indium zinc oxide (IZ0). The organic light-emitting layer 43 generally includes a hole injection layer, a hole transfer layer, a light-emitting layer, an electron transport layer, and an electron injection layer (not shown). For example, the main material of the hole injection layer is *c〇pper phthalocyanine (CuPc); the material of the hole transport layer is mainly
4,4 -bis[N-(l-naphthyl)-N-phenylamino]biphenyl (NPB );電子注入層的材料主要係為氟化鋰(LiF );電 子傳輸層的材料主要係為tris(8-quinolinato-N1,08)-aluminum (Alq)。而且,有機發光層43可以是以蒸鍍 (evaporation)、旋轉塗佈(Spin coating)、喷墨印刷 (ink jet printing)或是印刷(printing)方式形成於4,4 -bis[N-(l-naphthyl)-N-phenylamino]biphenyl (NPB); the material of the electron injecting layer is mainly lithium fluoride (LiF); the material of the electron transport layer is mainly tris (8- quinolinato-N1,08)-aluminum (Alq). Further, the organic light-emitting layer 43 may be formed by evaporation, spin coating, ink jet printing, or printing.
第13頁 1276231 修正 皇號91125咖 五、發明說明(8) $ 一電極42之上。在匕外’有機發光層43所發射的光線可為 藍光、綠光、紅光、白光、其他的單色光、或是全彩光。 、第一電極44通常係作為陰極,且其可以是利用蒸鍍 法電子束鍛膜法(E-gun)或是濺鍍法(sputtering)所形 成,其材質可為鋁、鋁/鋰、鈣、鎂銀合金或是銀等導電性 材料。 除水薄膜45係利用沉積方式所形成,例如是氣相沉積 (vapor deposition)、物理氣袓沉積(phySicai vapor deposition)、化學氣相沉積(chemicai vap〇r deposition)、或是蒸鍍(evap〇rati〇n)。在本實施例 中’除水薄膜45之材料為能夠用作為沉積源(dep〇siti〇n source )的材料,亦即是其可以應用於沉積製程中,而且 其係具有吸附水分子能力的材料;此除水薄膜45之材料可 以疋有機金屬化合物(organometalic complex compound)、鹼金屬化合物(alkaline metal compound )、驗金屬氧化物(alkaline metal oxide compound)、鹼土金屬化合物(aikaline earth metal compound )、驗土金屬氧化物(alkaline earth metal oxide compound)、含硫金屬化合物(sulfate compound)、金屬 _ 化物(metal halide compound)、過 氯酸化合物(perchlorate compound)、或是有機化合物 (organic compound )。 保護層46係為一非透氣膜(non —permeabie film), 其可以是利用沉積方式形成,其材質可為氧化矽(s i 〇 )、Page 13 1276231 Revision Emperor 91125 coffee 5, invention description (8) $ above the electrode 42. The light emitted by the organic light-emitting layer 43 may be blue light, green light, red light, white light, other monochromatic light, or full color light. The first electrode 44 is generally used as a cathode, and may be formed by evaporating electron beam forging (E-gun) or sputtering, and may be made of aluminum, aluminum/lithium, or calcium. , magnesium-silver alloy or silver conductive materials. The water removal film 45 is formed by a deposition method such as vapor deposition, physicai vapor deposition, chemical vapor deposition (chemicai vap〇r deposition), or evaporation (evap〇). Rati〇n). In the present embodiment, the material of the water-removing film 45 is a material that can be used as a deposition source, that is, it can be applied to a deposition process, and it is a material having the ability to adsorb water molecules. The material of the water removal film 45 may be an organometalic complex compound, an alkali metal compound, an alkali metal oxide compound, an akaline earth metal compound, and a test. An alkaline earth metal oxide compound, a sulfur compound, a metal halide compound, a perchlorate compound, or an organic compound. The protective layer 46 is a non-permeabie film, which may be formed by deposition, and may be made of yttrium oxide (s i 〇 ).
第14頁 1276231Page 14 1276231
五、發明說明(9) 氮化矽(S“N4)及氮氧化矽(Si〇xNy),另外其亦可以是利用 注膠的方式形成於第一電極42、有機發光層43、第二電極 44、以及除水薄膜4 5周圍,此外其還可以是預製的薄膜並 利用黏貼方式形成於第一電極42、有機發光層43、第^電 極44、以及除水薄膜45周圍;而保護層46的材質可為環氧 樹脂(epoxy resin )。如圖所示,保護層46及基板41係構 成一封閉空間,以便將第一電極42、有機發光層43、第二 電極44及除水薄膜45與外界隔絕,以便避免水氣、氧氣的 侵银。 、 除此之外’除水薄膜45亦可以是沉積於第一電極42、 有機發光層43及第二電極44周圍;如圖5所示,在依本發明 另一較佳實施例之有機發光二極體5中,除水薄膜45係包覆 第一電極42、有機發光層43及第二電極44,而保護層46係 形成於除水薄膜4 5外侧。 為使本發明之内容更容易理解,以下將舉數個實例, 以說明依本發明較佳實施例之有機發光二極體製造方法的 流程° 請參照圖6所示,依本發明較佳實施例之有機發光二極 體之製造方法6包括以下數個步驟。 首先,步驟6 0 1係提供一基板。在本實施例中,此基板 可為透明材質之一玻璃基板、一塑膠基板或是一柔性基 板。 接著’步驟6 0 2係於基板上形成一第一電極。在本實施 例中’第一電極係利用濺鍍方式或是離子電鍍方式形成於5. Description of the Invention (9) Cerium nitride (S"N4) and bismuth oxynitride (Si〇xNy), or it may be formed on the first electrode 42, the organic light-emitting layer 43, and the second electrode by means of injection molding. 44, and around the water removal film 45, in addition, it may be a prefabricated film and formed on the first electrode 42, the organic light-emitting layer 43, the fourth electrode 44, and the water-removing film 45 by adhesion; and the protective layer 46 The material may be an epoxy resin. As shown, the protective layer 46 and the substrate 41 form a closed space for the first electrode 42, the organic light-emitting layer 43, the second electrode 44, and the water-removing film 45. It is isolated from the outside to avoid the intrusion of moisture and oxygen. In addition, the water removal film 45 may be deposited on the first electrode 42, the organic light-emitting layer 43 and the second electrode 44; as shown in FIG. In the organic light-emitting diode 5 according to another preferred embodiment of the present invention, the water-removing film 45 covers the first electrode 42, the organic light-emitting layer 43, and the second electrode 44, and the protective layer 46 is formed. The outer side of the water film 45. In order to make the content of the present invention easier to understand, the following The flow chart of the method for fabricating an organic light emitting diode according to a preferred embodiment of the present invention is shown in FIG. 6. The method 6 for manufacturing an organic light emitting diode according to a preferred embodiment of the present invention includes In the following steps, the substrate is provided as a substrate of a transparent material, a plastic substrate or a flexible substrate. [Step 6 0 2 is followed by A first electrode is formed on the substrate. In the embodiment, the first electrode is formed by sputtering or ion plating.
第15頁 1276231 案號91125抑4 五、發明說明(10) 基板上’其材質係例如為氧化銦錫。 在步驟603中’一有機發光層係被形成於第一電極上· 在本實施例中,有機發光層可以是一單層結構,另外, 以及一電子注入 機發光層亦可以是複數層結構,例如包括一電洞注入層、 一電洞傳遞層、一發光層、一電子傳遞層 曰 層。 步驟604係於有機發光層上形成一第二電極。在本實施 例中,第二電極可以是利用蒸鍍法、電子束鍍膜法、 濺鍍法所形成。 / 步驟605係以沉積方式於基板上方形成一除水薄膜。在 本實施例中,除水薄膜可以是利用氣相沉積、物理氣相沉 積、化學氣相沉積、或是蒸鍍方式所形成,而其位置可以 是位於第二電極上、或是包覆第一電極、有機發光層及第 一電極。需注意者,除水薄膜之材料係為具有吸附水分子 能力、且能夠用作為沉積源的材料,例如是蒸鍍源 (evaporation source),此除水薄膜之材料可以是有機 金屬化合物、鹼金屬化合物、鹼金屬氧化物、鹼土金屬化 合物、驗土金屬氧化物、含硫金屬化合物、金屬函化物、 過氣酸化合物、或是有機化合物。 最後’步驟6 0 6係形成一保護層以包覆第一電極、有機 發光層、第二電極及除水薄膜。在本實施例中,保護層之 材質可為氧化矽(Si02)、氮化矽(Si3N4)、氮氧化石夕 (S i 0X Ny)及ί衣氧樹脂’其係與基板係形成一密封空間,而且 第一電極、有機發光層、第二電極及除水薄膜係位於此密Page 15 1276231 Case No. 91125 4 4. Description of the Invention (10) The material on the substrate is, for example, indium tin oxide. In step 603, an organic light-emitting layer is formed on the first electrode. In this embodiment, the organic light-emitting layer may be a single-layer structure, and an electron injecting layer may also be a plurality of layers. For example, it includes a hole injection layer, a hole transfer layer, a light-emitting layer, and an electron transport layer. Step 604 is to form a second electrode on the organic light-emitting layer. In the present embodiment, the second electrode may be formed by a vapor deposition method, an electron beam plating method, or a sputtering method. / Step 605 forms a water removal film on the substrate in a deposition manner. In this embodiment, the water removal film may be formed by vapor deposition, physical vapor deposition, chemical vapor deposition, or evaporation, and the position may be located on the second electrode or coated. An electrode, an organic light emitting layer and a first electrode. It should be noted that the material of the water removal film is a material having the ability to adsorb water molecules and can be used as a deposition source, for example, an evaporation source, and the material of the water removal film may be an organometallic compound or an alkali metal. a compound, an alkali metal oxide, an alkaline earth metal compound, a soil metal oxide, a sulfur-containing metal compound, a metal complex, a peroxy acid compound, or an organic compound. Finally, the step 605 forms a protective layer to coat the first electrode, the organic light-emitting layer, the second electrode, and the water-removing film. In this embodiment, the material of the protective layer may be yttrium oxide (SiO 2 ), tantalum nitride (Si 3 N 4 ), nitrous oxide sulphide (S i 0X Ny), and ε oxy oxy-resin to form a sealed space with the substrate system. And the first electrode, the organic light-emitting layer, the second electrode, and the water-removing film are located at the dense
第16頁 1276231 索號 11125334 五、發明說明(11) 封空間中。 綜上所述’由於 方法係利用沉積方式 膜時能夠整合封裝製 是形成第二電極時的 成本去建造執行塗佈 機台,故能夠降低製 形成除水薄膜能夠避 劑殘留問題,而且能 還能夠避免黏著劑的 吸附能力。 以上所述僅為舉 本發明之精神與範疇 應包含於後附之申請Page 16 1276231 Cable number 11125334 V. Description of invention (11) In the sealed space. In summary, since the method is capable of integrating the packaging system by using the deposition method, the cost of forming the second electrode is used to construct the coating machine, so that the problem of residue formation of the water-removing film can be reduced, and It can avoid the adsorption capacity of the adhesive. The above is only for the spirit and scope of the present invention and should be included in the attached application.
依本發 來形成 程與前 沉積製 製程的 造成本 免習知 夠有效 干擾而 明之有機發 除水薄膜’ 段沉積製程 程,所以製 環境、及購 。除此之外 之塗佈黏著 地減小除水 有效地發揮 所以在 之操作 造商不 貝進行 ’利用 劑方式 薄膜之 除水薄 體及其製造 形成除水薄 環境,例如 須花費額外 塗佈製程的 沉積方式來 所造成的溶 厚度,此外 膜之水分子 例性,而非為限制性者。任何未脫離 ,而對其進行之等效修改或變更,均 專利範圍中。According to the present invention, the formation process and the pre-deposition process are effective in dissipating the organic film of the organic hair removal process, so the environment and purchase. In addition, the coating adheres to reduce the effective use of the water removal, so that the operation of the thin film of the thin film of the use of the thin film and the manufacture thereof form a water thin environment, for example, additional coating is required. The thickness of the process is determined by the deposition method of the process, and the water molecules of the film are exemplified rather than restrictive. Any modification or change that is not detached from it is within the scope of the patent.
1276231 _案號9Π25334_年月日__ 圖式簡單說明 【圖式簡單說明】 圖1為一示意圖,顯示習知的有機發光二極體的示意 圖, 圖2A為一示意圖,顯示習知的有機發光二極體之蓋板 及吸水材的示意圖; 圖2B為一示意圖,顯示習知的有機發光二極體的示意 圖,其具有如圖2A所示之蓋板及吸水材; 圖3A為一示意圖,顯示另一習知的有機發光二極體之 盖板及吸水材的不意圖, 圖3B為一示意圖,顯示另一習知的有機發光二極體的 示意圖,其具有如圖3A所示之蓋板及吸水材的示意圖; 圖4為一示意圖,顯示依本發明較佳實施例之有機發光 二極體的示意圖; 圖5為一示意圖,顯示依本發明另一較佳實施例之有機 發光二極體的示意圖;以及 圖6為一流程圖,顯示依本發明較佳實施例之有機發光 二極體製造方法的流程。 【圖式符號說明】 1 有 機 發 光二極體 11 基 板 12 第 一 電 極 13 有 機 發 光層 14 第 一- 電 極1276231 _ Case No. 9Π25334_年月日日__ Schematic description [Simplified illustration] Fig. 1 is a schematic view showing a conventional organic light emitting diode, and Fig. 2A is a schematic view showing a conventional organic FIG. 2B is a schematic view showing a conventional organic light emitting diode having a cover plate and a water absorbing material as shown in FIG. 2A; FIG. 3A is a schematic view of the light emitting diode; FIG. FIG. 3B is a schematic view showing another conventional organic light-emitting diode, which has a schematic view as shown in FIG. 3A, showing another conventional organic light-emitting diode cover and a water absorbing material. FIG. FIG. 4 is a schematic view showing an organic light emitting diode according to a preferred embodiment of the present invention; FIG. 5 is a schematic view showing an organic light emitting light according to another preferred embodiment of the present invention; A schematic diagram of a diode; and FIG. 6 is a flow chart showing the flow of a method of fabricating an organic light emitting diode according to a preferred embodiment of the present invention. [Description of Symbols] 1 Organic Light Emitting Diode 11 Substrate 12 First Electrode 13 Organic Light Emitting Layer 14 First - Electrode
第18頁 1276231 _案號91125334_年月日 修正 圖式簡單說明 15 蓋板 21 基板 22 第一電極 23 有機發光層 24 第二電極 25 蓋板 251 凹槽 252 封膠 26 吸水材 27 透水薄膜 31 基板 32 第一電極 33 有機發光層 34 第二電極 35 蓋板 351 封膠 36 吸水材 37 薄膜 4 有機發光二極體 41 基板 42 第一電極 43 有機發光層 44 第二電極 45 除水薄膜Page 18 1272231 _ Case No. 91125334_Yearly Date Correction Drawing Simple Description 15 Cover 21 Substrate 22 First Electrode 23 Organic Light Emitting Layer 24 Second Electrode 25 Cover Plate 251 Groove 252 Sealant 26 Water Absorbing Material 27 Water Permeable Film 31 Substrate 32 First electrode 33 Organic light-emitting layer 34 Second electrode 35 Cover plate 351 Sealing material 36 Water absorbing material 37 Film 4 Organic light-emitting diode 41 Substrate 42 First electrode 43 Organic light-emitting layer 44 Second electrode 45 Water-removing film
第19頁 1276231 案號 91125334 年 月 日 修正 圖式簡單說明 46 保 護 層 5 有 機 發 光 二極 體 6 有 機 發 光 二極 體 製 造 方法 60 卜 606 有 機 發 光 二極 體 製 造 方法之流程Page 19 1276231 Case No. 91125334 Year Month Correction Schematic Description 46 Protective Layer 5 Organic Light Emitting Dipole 6 Organic Light Emitting Dipole Manufacturing Method 60 Bu 606 Process of Organic Light Emitting Dipole Manufacturing Method
第20頁Page 20
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TW91125334A TWI276231B (en) | 2002-10-25 | 2002-10-25 | Organic light-emitting diode with drying film and method for manufacturing thereof |
US10/691,597 US20040091741A1 (en) | 2002-10-25 | 2003-10-24 | Organic electroluminescent device and method for manufacturing the same |
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TW91125334A TWI276231B (en) | 2002-10-25 | 2002-10-25 | Organic light-emitting diode with drying film and method for manufacturing thereof |
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Cited By (1)
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TWI498642B (en) * | 2011-07-14 | 2015-09-01 | Lg Innotek Co Ltd | Optical member, display device having the same and method for fabricating the same |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI498642B (en) * | 2011-07-14 | 2015-09-01 | Lg Innotek Co Ltd | Optical member, display device having the same and method for fabricating the same |
US9594203B2 (en) | 2011-07-14 | 2017-03-14 | Lg Innotek Co., Ltd. | Optical member, display device having the same and method for fabricating the same |
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