TWI276231B - Organic light-emitting diode with drying film and method for manufacturing thereof - Google Patents

Abstract

An organic light-emitting diode with a drying film. The organic light-emitting diode comprises a substrate, a first electrode, an organic light-emitting layer, a second electrode, a drying film, and a passivation film. In this case, the first electrode is formed on the substrate, the organic light-emitting layer is formed on the first electrode, the second electrode is formed on the organic light-emitting layer, and the drying film is formed above the substrate by using deposition method. The passivation film is formed above the substrate, and an airtight space is provided between the passivation film and the substrate. The first electrode, organic light-emitting layer, second electrode, and drying film are set in the airtight space. This invention also discloses a method for manufacturing the organic light-emitting diode.

Description

I2?623l

The present invention relates to an organic light-emitting diode and a method of manufacturing the same, and an organic light-emitting body having a drying layer and a method of manufacturing the same. [Ordinary technology] r Organic Light-Emitting Diode Self-illumination, no viewing angle, power saving, easy process, low cost, high response: and full color, etc., make organic light-emitting diode The body has a great ability to be the next generation of flat panel display and flat light source illumination, including special light sources and general illumination. Please refer to $1 electrode 1 2 15. Wherein, W and the second electro-optical second electrode 14 enable the carrier to be released from the electron and electroluminescent layer 13 as shown in FIG. 1. The organic light-emitting diode 1 comprises a substrate U, an organic The light-emitting layer 13, the second electrode 14, and the cover substrate 11 and the first electrode 12 are made of a light-transmitting material, and the first electrode 12 is used as an anode and a cathode respectively; when a current is applied to the pole body 1 The hole system is injected by the first electrode 12, and the electrons are injected. At this time, due to the potential difference caused by the applied electric field, the organic light-emitting layer 13 moves and meets to recombine, and the excitons generated by the hole combination (excit〇rl) A luminescent molecule capable of exciting an organic luminescent molecule 'then excited state' in the form of light. As mentioned above, the decay mechanism that occurs more frequently in organic light-emitting diodes is the formation of a dark spot. Therefore, to improve the durability of the organic light-emitting diode, it is to reduce the Luminous area

B

1276231 Case No. 91125334 V. Generation of invention (2). The organofunctional material in the organic light-emitting diode structure and the second electrode as the cathode are easily reacted with moisture and oxygen in the air (especially moisture) to cause the formation of non-light-emitting regions. Therefore, it is quite important to have moisture completely ==. Therefore, in general, in the manufacture of an organic light-emitting diode, the coating is usually performed under vacuum, and the organic light-emitting diode is sealed by encapsulation. However, in this way, it is still impossible to completely ensure that the light-emitting diode is not affected by moisture and cause the generation of non-light-emitting areas. As described above, in order to completely prevent the generation of non-light-emitting areas, the organic light emission is further improved. The ultimate in the life and stability of the polar body is to completely remove the water inside the organic light-emitting diode. A common method is to add a water-trapping agent or a drying agent inside the organic light-emitting body. In order to solve the problem of the formation of non-light-emitting regions in the organic light-emitting diodes, there are several related patent applications: as disclosed in Kawami et al., European Patent Application No. EP 0776 147, the organic light-emitting diode is sealed in a In an airtight container of a solid material having chemical water absorption characteristics, such a compound having chemical water absorption characteristics includes a metal oxide such as oxidation and cerium oxide. In the British patent case GB 2368192, His am itsu et al. use an organometallic lie compound as a water absorbing material, which can effectively adsorb water inside the organic light-emitting diode while adsorbing other chemical water absorption. Chemical drying agents and physical drying agents further prevent the occurrence of non-light-emitting areas. In U.S. Patent No. 6,226,890, Boroson et al.

1276231 Revision I No. 91125334 V. Inventive Note (3) The desiccant is blended into a binder with good water vapor transmission rate (wa ervapq P transmission rate), and then it is made into organic light-emitting A film is formed in the polar body to better or maintain the water absorption effect of the solid desiccant. & In more detail, there are generally two ways to fill the water-absorbing material in the organic light-emitting diode. Please refer to FIG. 2A, which first fills the water-absorbing material 26 with a groove. In the cover plate 25 of the 251, a water-permeable film 27 is further applied over the groove 251, and then the cover plate 25 containing the water absorbing material 26 is stacked on top of the prepared organic light-emitting diode (as shown in FIG. 2B). And sealing the cover plate 25 and the substrate 21 with the sealant 2 52 to form a sealed space, and the first electrode 22, the organic light-emitting layer 23, the second electrode 24, the water-permeable film 27 and the water absorbing material 26 are located in the sealed space. in. However, with this technique, it is necessary to fill the water absorbing material 26 in the groove 251, and at the same time, it is necessary to add a water permeable film 27, which increases the complexity of the process, and the production yield is lowered and the manufacturing cost is greatly increased. In addition, please refer to FIG. 3A, in which the water absorbing material 36 is blended into the water permeable polymer solution, and a water absorbing material 36 is formed on the cover plate 35 by coating. The film 37 is then removed from the solvent, and then the cover plate 35 is stacked on top of the prepared organic light-emitting diode (as shown in FIG. 3B), and the cover plate 35 is adhered to the substrate 31 with the sealant 351. A sealed space is formed, and the first electrode 32, the organic light-emitting layer 33, the second electrode 34, the film 37, and the water absorbing material 36 are located in the sealed space. Although the method is close to the packaging process and reduces the complexity of the process technology, after the coating process, the baking process must be performed to remove the solvent.

1276231 3 曰 茗 茗 9 〗 〗 〗 〗 〗 125 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五The cover plate 35 is peeled off and & damaged into components. + & In the above examples, the water absorbing material is applied by a coating method, and the water absorbing material is fixed inside the organic light emitting diode by a high score = liquid as an adhesive to remove the water layer, however, in the organic light emitting diode The organic light-emitting layer and the second electrode are formed by the deposition method, and cannot be integrated with the same operating pressure in the water removal process under normal pressure, and the need to break the two causes the process complexity, the yield reduction, and the manufacturing cost. Increase; in addition, Ϊ ΐ ^ form formation - there will be holes in the water layer (Pin hQle) and coating the dead moon. Yifa iUr uses an adhesive to fix the water absorbing material. 'The thickness of the water removal layer is reduced. The effect is also reduced, thus limiting the shrinkage of the thickness of the organic light-emitting diode, and the privacy, especially the organic light-emitting diode. The structure of the flat-panel display can be thinner than the liquid crystal display, but it is not limited by the == m', so that a large amount of squeegee needs to be added during the packaging, and the thickness of the diode is increased, sacrificing the inside of the organic light-emitting display diode. Water molecules, so, only fixed in; m:; first water can achieve the effect of adsorbing water molecules, the best way to absorb the absorption capacity of the suction material. • Effectively exerting water absorption How to provide an organic light-emitting diode and i to make it possible to integrate the deposition process and seal each method, and form a water-repellent environment to form water removal

1276231 j No. 91125^4 V. Invention description (5) Layer, reduce the original sound of the water removal layer - 1 * - · 正 b木', thickness M and effectively play an important role in the preparation of the optoelectronic industry One. The adsorption capacity of the x layer, the 正 正 θ α ΙΓ / / hand and the effective 疋 疋 重要 光电 光电 光电 光电 光电 光电 光电 光电 光电 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 ' ' ' ' ' ' ' ' The polar body and its system, i, species can reduce the removal of the organic light-emitting diode and its preparation; the water-removing film is used to provide a 2 = de-off. The manufacturing environment of the process is used to form processes and seal manufacturing methods. The film-forming organic light-emitting diode and the film for forming the water-removal film are formed by deposition according to the method of the present invention. The diode and the manufacturing edge thereof are an organic light emitting diode electrode, an organic light emitting layer, a second substrate, and a protective layer according to the present invention. In the present invention, the first electrode is formed on: a plate: film=two, and the water-removing film is formed on the substrate in a deposition manner, and is secured over the substrate and forms a sealed space with the substrate to enable the second electro-optical light to be emitted. The layer, the second electrode and the water-removing film are accommodated in the sealed space. The invention also provides a method for manufacturing an organic light-emitting diode, comprising: providing a substrate, forming a first electrode on the substrate, An organic light-emitting layer is formed on one of the electrodes, and a second electrode is formed on the organic light-emitting layer. The first electricity is on the 11th page, 1272623, so 91125334 - 曰 曰 、, invention description (6) pole, forming a sealed space above the deposition side, and Water film. As described above, the method utilizes a film to integrate the cause of the film, reduces the chance of retention, and saves the water absorbing material, so that the adsorption of the water film is corrected to the substrate cover. It is placed in the system, and the deposition process is organically based on the growth rate, which saves the cost; it can reduce the capacity. The upper layer is formed by 仏, the invention is Ϊ, the water is thin... and the substrate protective layer and the substrate form an electrode, the organic light-emitting layer, the second electrode, the moon organic light-emitting diode and the manufacture thereof: the film is thin, Therefore, in the formation of the water thinning 1, the operating environment, in order to reduce the sealing of the parts in the sealing system before exposure to the atmosphere and the use of deposition processes can avoid solvent residues / because no adhesive is needed Fixing the thickness of the water removal thinner and effectively exerting the details of the preferred embodiment. Reference will be made to the related drawings, the ancient light-emitting diode and the preferred embodiment of the method. The same elements will be denoted by the same reference numerals, and the organic light-emitting diodes according to the preferred embodiment of the present invention will be described as an organic light-emitting diode according to a preferred embodiment of the present invention. The electrode 44, the water removal film 45, and a protective layer 46. As shown in the figure, the first electrode 42 is formed on the substrate 41; the light layer 43 is formed on the 筮_0, ^ organic light illuminating sound 43; and the second electrode 44 is formed on the ytterbium The tank 6' water removal film 45 is formed on the second electrode 44; and the first electrode 42, the organic light-emitting layer 43, and the second electrode

I Sun 12th page 1276231 _ Case No. 91125334_年月 a Positive __ 5, invention description (7) 44, and water removal film 45. In the present embodiment, the substrate 41 is usually a transparent substrate, such as a glass substrate, a plastic substrate or a fiexible substrate. The plastic substrate and the flexible substrate may be a polycarbonate (PC) substrate, a poly(p〇iyester, pet) substrate, a cyclic olefin copolymer (COC) substrate, a metal network. A metall〇cene-based cyclic olefin copolymer (mCOC) substrate or a thin glass substrate.

The first electrode 42 may be formed on the substrate 41 by sputtering or ion plating. The first electrode 42 is usually used as an anode and the material is usually a transparent conductive metal oxide. The substance is, for example, indium tin oxide (I TO ), aluminum zinc oxide (AZ0 ) or indium zinc oxide (IZ0). The organic light-emitting layer 43 generally includes a hole injection layer, a hole transfer layer, a light-emitting layer, an electron transport layer, and an electron injection layer (not shown). For example, the main material of the hole injection layer is *c〇pper phthalocyanine (CuPc); the material of the hole transport layer is mainly

4,4 -bis[N-(l-naphthyl)-N-phenylamino]biphenyl (NPB); the material of the electron injecting layer is mainly lithium fluoride (LiF); the material of the electron transport layer is mainly tris (8- quinolinato-N1,08)-aluminum (Alq). Further, the organic light-emitting layer 43 may be formed by evaporation, spin coating, ink jet printing, or printing.

Page 13 1276231 Revision Emperor 91125 coffee 5, invention description (8) $ above the electrode 42. The light emitted by the organic light-emitting layer 43 may be blue light, green light, red light, white light, other monochromatic light, or full color light. The first electrode 44 is generally used as a cathode, and may be formed by evaporating electron beam forging (E-gun) or sputtering, and may be made of aluminum, aluminum/lithium, or calcium. , magnesium-silver alloy or silver conductive materials. The water removal film 45 is formed by a deposition method such as vapor deposition, physicai vapor deposition, chemical vapor deposition (chemicai vap〇r deposition), or evaporation (evap〇). Rati〇n). In the present embodiment, the material of the water-removing film 45 is a material that can be used as a deposition source, that is, it can be applied to a deposition process, and it is a material having the ability to adsorb water molecules. The material of the water removal film 45 may be an organometalic complex compound, an alkali metal compound, an alkali metal oxide compound, an akaline earth metal compound, and a test. An alkaline earth metal oxide compound, a sulfur compound, a metal halide compound, a perchlorate compound, or an organic compound. The protective layer 46 is a non-permeabie film, which may be formed by deposition, and may be made of yttrium oxide (s i 〇 ).

Page 14 1276231

5. Description of the Invention (9) Cerium nitride (S"N4) and bismuth oxynitride (Si〇xNy), or it may be formed on the first electrode 42, the organic light-emitting layer 43, and the second electrode by means of injection molding. 44, and around the water removal film 45, in addition, it may be a prefabricated film and formed on the first electrode 42, the organic light-emitting layer 43, the fourth electrode 44, and the water-removing film 45 by adhesion; and the protective layer 46 The material may be an epoxy resin. As shown, the protective layer 46 and the substrate 41 form a closed space for the first electrode 42, the organic light-emitting layer 43, the second electrode 44, and the water-removing film 45. It is isolated from the outside to avoid the intrusion of moisture and oxygen. In addition, the water removal film 45 may be deposited on the first electrode 42, the organic light-emitting layer 43 and the second electrode 44; as shown in FIG. In the organic light-emitting diode 5 according to another preferred embodiment of the present invention, the water-removing film 45 covers the first electrode 42, the organic light-emitting layer 43, and the second electrode 44, and the protective layer 46 is formed. The outer side of the water film 45. In order to make the content of the present invention easier to understand, the following The flow chart of the method for fabricating an organic light emitting diode according to a preferred embodiment of the present invention is shown in FIG. 6. The method 6 for manufacturing an organic light emitting diode according to a preferred embodiment of the present invention includes In the following steps, the substrate is provided as a substrate of a transparent material, a plastic substrate or a flexible substrate. [Step 6 0 2 is followed by A first electrode is formed on the substrate. In the embodiment, the first electrode is formed by sputtering or ion plating.

Page 15 1276231 Case No. 91125 4 4. Description of the Invention (10) The material on the substrate is, for example, indium tin oxide. In step 603, an organic light-emitting layer is formed on the first electrode. In this embodiment, the organic light-emitting layer may be a single-layer structure, and an electron injecting layer may also be a plurality of layers. For example, it includes a hole injection layer, a hole transfer layer, a light-emitting layer, and an electron transport layer. Step 604 is to form a second electrode on the organic light-emitting layer. In the present embodiment, the second electrode may be formed by a vapor deposition method, an electron beam plating method, or a sputtering method. / Step 605 forms a water removal film on the substrate in a deposition manner. In this embodiment, the water removal film may be formed by vapor deposition, physical vapor deposition, chemical vapor deposition, or evaporation, and the position may be located on the second electrode or coated. An electrode, an organic light emitting layer and a first electrode. It should be noted that the material of the water removal film is a material having the ability to adsorb water molecules and can be used as a deposition source, for example, an evaporation source, and the material of the water removal film may be an organometallic compound or an alkali metal. a compound, an alkali metal oxide, an alkaline earth metal compound, a soil metal oxide, a sulfur-containing metal compound, a metal complex, a peroxy acid compound, or an organic compound. Finally, the step 605 forms a protective layer to coat the first electrode, the organic light-emitting layer, the second electrode, and the water-removing film. In this embodiment, the material of the protective layer may be yttrium oxide (SiO 2 ), tantalum nitride (Si 3 N 4 ), nitrous oxide sulphide (S i 0X Ny), and ε oxy oxy-resin to form a sealed space with the substrate system. And the first electrode, the organic light-emitting layer, the second electrode, and the water-removing film are located at the dense

Page 16 1276231 Cable number 11125334 V. Description of invention (11) In the sealed space. In summary, since the method is capable of integrating the packaging system by using the deposition method, the cost of forming the second electrode is used to construct the coating machine, so that the problem of residue formation of the water-removing film can be reduced, and It can avoid the adsorption capacity of the adhesive. The above is only for the spirit and scope of the present invention and should be included in the attached application.

According to the present invention, the formation process and the pre-deposition process are effective in dissipating the organic film of the organic hair removal process, so the environment and purchase. In addition, the coating adheres to reduce the effective use of the water removal, so that the operation of the thin film of the thin film of the use of the thin film and the manufacture thereof form a water thin environment, for example, additional coating is required. The thickness of the process is determined by the deposition method of the process, and the water molecules of the film are exemplified rather than restrictive. Any modification or change that is not detached from it is within the scope of the patent.

1276231 _ Case No. 9Π25334_年月日日__ Schematic description [Simplified illustration] Fig. 1 is a schematic view showing a conventional organic light emitting diode, and Fig. 2A is a schematic view showing a conventional organic FIG. 2B is a schematic view showing a conventional organic light emitting diode having a cover plate and a water absorbing material as shown in FIG. 2A; FIG. 3A is a schematic view of the light emitting diode; FIG. FIG. 3B is a schematic view showing another conventional organic light-emitting diode, which has a schematic view as shown in FIG. 3A, showing another conventional organic light-emitting diode cover and a water absorbing material. FIG. FIG. 4 is a schematic view showing an organic light emitting diode according to a preferred embodiment of the present invention; FIG. 5 is a schematic view showing an organic light emitting light according to another preferred embodiment of the present invention; A schematic diagram of a diode; and FIG. 6 is a flow chart showing the flow of a method of fabricating an organic light emitting diode according to a preferred embodiment of the present invention. [Description of Symbols] 1 Organic Light Emitting Diode 11 Substrate 12 First Electrode 13 Organic Light Emitting Layer 14 First - Electrode

Page 18 1272231 _ Case No. 91125334_Yearly Date Correction Drawing Simple Description 15 Cover 21 Substrate 22 First Electrode 23 Organic Light Emitting Layer 24 Second Electrode 25 Cover Plate 251 Groove 252 Sealant 26 Water Absorbing Material 27 Water Permeable Film 31 Substrate 32 First electrode 33 Organic light-emitting layer 34 Second electrode 35 Cover plate 351 Sealing material 36 Water absorbing material 37 Film 4 Organic light-emitting diode 41 Substrate 42 First electrode 43 Organic light-emitting layer 44 Second electrode 45 Water-removing film

Page 19 1276231 Case No. 91125334 Year Month Correction Schematic Description 46 Protective Layer 5 Organic Light Emitting Dipole 6 Organic Light Emitting Dipole Manufacturing Method 60 Bu 606 Process of Organic Light Emitting Dipole Manufacturing Method

Page 20

Claims (1)

1276231 ---- Case No. 91125334_年月日修^__ VI. Patent application scope 1. An organic light emitting diode comprising: a substrate; a first electrode formed on the substrate; an organic light emitting a layer formed on the first electrode; a second electrode formed on the organic light-emitting layer; a water-removing film formed on the substrate in a deposition manner; and a a passivation film is disposed above the substrate and forms an airtight space with the substrate, the first electrode, the organic light emitting layer, the second electrode and the water removal film are located in the seal In space. 2. The organic light-emitting diode according to claim 1, wherein the water-removing film is formed on the second electrode. 3. The organic light emitting diode according to claim 1, wherein the water removal film coats the first electrode, the organic light emitting layer and the second electrode. 4. The organic light-emitting diode according to claim 1, wherein the water-removing film is formed by a vapor deposition method, and the organic light-emitting method according to item 4 of claim patent. One pole' 1276231 ----Serial number _- 革月_2__修正___ 〜6, the scope of patent application The water removal film is formed by physical vapor deposition (p h y s i c a 1 v a p 〇 r deposition). 6. The organic light-emitting diode according to claim 4, wherein the water-removing film is formed by chemical vapor deposition. 7. The organic light-emitting diode according to claim 1, wherein the water-removing film is formed by an evaporation method. 8. The organic light-emitting diode according to claim 1, wherein the material of the water-removing film is a deposi t source material. 9. The organic light-emitting diode according to claim 8, wherein the material of the water removal film is an organometallic compound (〇rgan〇 metalic complex compound) 〇10, as claimed in item 8 The organic light-emitting diode, wherein the material of the water-removing film is an alkali metal compound, the organic light-emitting diode according to the first aspect of the invention, wherein the alkali metal The compound is an alkali oxide (alkaHne metal oxide compound) 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The organic light-emitting diode according to claim 12, wherein the soil-measuring metal compound is an alkaline earth metal oxide (alkaHne earth metal oxide compound) 〇14, as described in claim 8 An organic light-emitting diode, wherein the material of the water-removing film is a sulfur-containing compound, and the organic light-emitting diode according to claim 8, wherein the material of the water-removing film An organic light-emitting diode according to the invention of claim 8, wherein the material of the water-removing film is a perchl 〇rate compound. The organic light-emitting diode according to claim 8, wherein the material of the water-removing film is an organic compound. 1276231 __Case No. 91125334_Man l B Correction _ VI. Patent Application No. 18. A method for manufacturing an organic light emitting diode, comprising: providing a substrate; forming a first electrode on the substrate; Forming an organic light-emitting layer thereon; forming a second electrode on the organic light-emitting layer; forming a water-removing film on the substrate in a deposition manner; and forming a protective layer over the substrate, the protective layer being formed on the substrate In a sealed space, the first electrode, the organic light-emitting layer, the second electrode and the water-removing film are located in the sealed space. The method of manufacturing an organic light-emitting diode according to claim 8, wherein the water-removing film is formed on the second electrode. The method for fabricating an organic light-emitting diode according to the above-mentioned item 8, wherein the water-removing film coats the first electrode, the organic light-emitting layer and the second electrode. 21. The organic light-emitting diode ship method of claim 18, wherein the water removal film is formed by vapor deposition. 2. The method for producing an organic light-emitting two-duro method according to the second aspect of the patent application, wherein the water-removing film is formed by vapor deposition of a carpet, 23, as claimed in the second section of the patent application. The organic luminescent enamel manufacturer 1276231 _ Case No. 91125334_年月日日__ VI. Patent application scope method, wherein the water removal film is formed by chemical vapor deposition. The method of producing an organic light-emitting diode according to claim 18, wherein the water-removing film is formed by evaporation. The method of manufacturing an organic light-emitting diode according to claim 18, wherein the material of the water-removing film is a deposition source material. The method for producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is an organometallic compound. The method of producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is an alkali metal compound. 28. The method of producing an organic light-emitting diode according to claim 27, wherein the metal detecting compound is an alkali metal oxide. The method for producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is an alkaline earth metal compound. The method of producing an organic light-emitting diode according to claim 29, wherein the soil-measuring metal compound is a soil-measuring metal oxide. 31. The manufacturer of an organic light-emitting diode according to claim 25 of the patent application scope Page 25 1276231 _ Case No. 91125334_年月日日__ VI. Patent application scope method, wherein the material of the water removal film is a sulfur-containing metal compound. The method of producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is a metal-based compound. The method for producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is a perchloric acid compound. The method of producing an organic light-emitting diode according to claim 25, wherein the material of the water-removing film is an organic compound. Page 26