IE51721B1 - Process for the manufacture of printed circuits - Google Patents
Process for the manufacture of printed circuitsInfo
- Publication number
- IE51721B1 IE51721B1 IE1248/81A IE124881A IE51721B1 IE 51721 B1 IE51721 B1 IE 51721B1 IE 1248/81 A IE1248/81 A IE 1248/81A IE 124881 A IE124881 A IE 124881A IE 51721 B1 IE51721 B1 IE 51721B1
- Authority
- IE
- Ireland
- Prior art keywords
- process according
- layer
- plate
- solvent
- photopolymer layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 title claims description 33
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000001117 sulphuric acid Substances 0.000 claims description 6
- 235000011149 sulphuric acid Nutrition 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 239000003518 caustics Substances 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- 230000000593 degrading effect Effects 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 239000012670 alkaline solution Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000003413 degradative effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001784 detoxification Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 229940074439 potassium sodium tartrate Drugs 0.000 description 1
- 230000008684 selective degradation Effects 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1415—Applying catalyst after applying plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3021896A DE3021896A1 (de) | 1980-06-06 | 1980-06-06 | Verfahren zur herstellung von gedruckten schaltungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE811248L IE811248L (en) | 1981-12-06 |
| IE51721B1 true IE51721B1 (en) | 1987-03-04 |
Family
ID=6104356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE1248/81A IE51721B1 (en) | 1980-06-06 | 1981-06-05 | Process for the manufacture of printed circuits |
Country Status (12)
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58106971U (ja) * | 1982-01-14 | 1983-07-21 | 棚沢 日佐司 | プリント配線基板 |
| FR2531302A1 (fr) * | 1982-07-30 | 1984-02-03 | Xerox Corp | Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit |
| DE3518975A1 (de) * | 1985-05-25 | 1986-11-27 | Bayer Ag, 5090 Leverkusen | Kunststoffteil |
| US4758459A (en) * | 1987-01-28 | 1988-07-19 | Northern Telecom Limited | Molded circuit board |
| EP2230890A1 (en) * | 2009-03-20 | 2010-09-22 | Laird Technologies AB | Method for providing a conductive material structure on a carrier |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1665314C2 (de) * | 1966-02-22 | 1978-05-24 | Kollmorgen Tech Corp | Basismaterial zur Herstellung gedruckter Schaltungen |
| GB1478341A (en) * | 1973-06-07 | 1977-06-29 | Hitachi Chemical Co Ltd | Printed circuit board and method of making the same |
| HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1973-11-15 | 1976-02-28 | ||
| JPS518564A (en) * | 1974-07-10 | 1976-01-23 | Matsushita Electric Ind Co Ltd | Insatsuhaisenbanno seizohoho |
| DE2713393C3 (de) * | 1977-03-23 | 1980-02-28 | Ruwel-Werke Spezialfabrik Fuer Hochfrequenzbauteile Gmbh, 4170 Geldern | Verfahren zum Herstellen von gedruckten Schaltungen |
| DE2803762A1 (de) * | 1978-01-28 | 1979-08-02 | Licentia Gmbh | Verfahren zur additiven nasschemischen herstellung von schaltungsnetzwerken |
| US4283243A (en) * | 1978-10-24 | 1981-08-11 | E. I. Du Pont De Nemours And Company | Use of photosensitive stratum to create through-hole connections in circuit boards |
| DE2920940A1 (de) * | 1979-05-21 | 1980-12-04 | Schering Ag | Verfahren zur herstellung von gedruckten schaltungen |
-
1980
- 1980-06-06 DE DE3021896A patent/DE3021896A1/de not_active Ceased
-
1981
- 1981-04-29 NL NL8102129A patent/NL8102129A/nl not_active Application Discontinuation
- 1981-05-13 IT IT21668/81A patent/IT1137014B/it active
- 1981-05-22 ES ES502446A patent/ES8207667A1/es not_active Expired
- 1981-06-01 SE SE8103427A patent/SE460394B/sv not_active IP Right Cessation
- 1981-06-01 CH CH3577/81A patent/CH657491A5/de not_active IP Right Cessation
- 1981-06-03 JP JP8452681A patent/JPS5723298A/ja active Granted
- 1981-06-03 GB GB8116984A patent/GB2080043B/en not_active Expired
- 1981-06-04 CA CA000379063A patent/CA1176759A/en not_active Expired
- 1981-06-05 FR FR8111151A patent/FR2484183A1/fr active Granted
- 1981-06-05 IE IE1248/81A patent/IE51721B1/en unknown
- 1981-06-08 US US06/271,181 patent/US4433009A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2484183B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-03-01 |
| US4433009A (en) | 1984-02-21 |
| JPS5723298A (en) | 1982-02-06 |
| ES502446A0 (es) | 1982-10-01 |
| FR2484183A1 (fr) | 1981-12-11 |
| SE460394B (sv) | 1989-10-02 |
| IT8121668A0 (it) | 1981-05-13 |
| IT1137014B (it) | 1986-09-03 |
| SE8103427L (sv) | 1981-12-07 |
| JPH0147910B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-10-17 |
| NL8102129A (nl) | 1982-01-04 |
| GB2080043A (en) | 1982-01-27 |
| IE811248L (en) | 1981-12-06 |
| CA1176759A (en) | 1984-10-23 |
| GB2080043B (en) | 1984-07-11 |
| DE3021896A1 (de) | 1982-03-25 |
| ES8207667A1 (es) | 1982-10-01 |
| CH657491A5 (de) | 1986-08-29 |
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