HU168090B - - Google Patents

Info

Publication number
HU168090B
HU168090B HUOI000165A HU168090B HU 168090 B HU168090 B HU 168090B HU OI000165 A HUOI000165 A HU OI000165A HU 168090 B HU168090 B HU 168090B
Authority
HU
Hungary
Application number
Other languages
Hungarian (hu)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to HUOI000165 priority Critical patent/HU168090B/hu
Priority to DD18219774A priority patent/DD115159A5/xx
Priority to DE19742452888 priority patent/DE2452888B2/de
Priority to GB4924774A priority patent/GB1452563A/en
Priority to FR7437558A priority patent/FR2251983A1/fr
Priority to NL7414957A priority patent/NL7414957A/xx
Publication of HU168090B publication Critical patent/HU168090B/hu

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax or thiol
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
HUOI000165 1973-11-15 1973-11-15 HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (6)

Application Number Priority Date Filing Date Title
HUOI000165 HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-15 1973-11-15
DD18219774A DD115159A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-15 1974-11-06
DE19742452888 DE2452888B2 (de) 1973-11-15 1974-11-07 Vorbehandlungsverfahren von traegerplatten zur herstellung von gedruckten schaltungen
GB4924774A GB1452563A (en) 1973-11-15 1974-11-14 Additive process for the production of printed circuit boards
FR7437558A FR2251983A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-15 1974-11-14
NL7414957A NL7414957A (nl) 1973-11-15 1974-11-15 Werkwijze voor het maken van gedrukte schake- n volgens de additieve methode.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
HUOI000165 HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-15 1973-11-15

Publications (1)

Publication Number Publication Date
HU168090B true HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-02-28

Family

ID=11000251

Family Applications (1)

Application Number Title Priority Date Filing Date
HUOI000165 HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-15 1973-11-15

Country Status (6)

Country Link
DD (1) DD115159A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2452888B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2251983A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1452563A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
HU (1) HU168090B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7414957A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3021896A1 (de) * 1980-06-06 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur herstellung von gedruckten schaltungen
FR2498873A1 (fr) * 1981-01-23 1982-07-30 Sev Alternateurs Procede de fabrication de circuits imprimes
CN109327974A (zh) * 2018-11-06 2019-02-12 江苏博敏电子有限公司 超低铜牙铜箔提升剥离强度层压制作方法

Also Published As

Publication number Publication date
NL7414957A (nl) 1975-05-20
FR2251983A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-06-13
DE2452888B2 (de) 1976-11-04
GB1452563A (en) 1976-10-13
DD115159A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-09-12
DE2452888A1 (de) 1975-05-22

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