IE34642B1 - Improvements in or relating to the fabrication of electrical circuit devices - Google Patents

Improvements in or relating to the fabrication of electrical circuit devices

Info

Publication number
IE34642B1
IE34642B1 IE1205/70A IE120570A IE34642B1 IE 34642 B1 IE34642 B1 IE 34642B1 IE 1205/70 A IE1205/70 A IE 1205/70A IE 120570 A IE120570 A IE 120570A IE 34642 B1 IE34642 B1 IE 34642B1
Authority
IE
Ireland
Prior art keywords
conductive
substrate
conductive member
carrier
bonded
Prior art date
Application number
IE1205/70A
Other languages
English (en)
Other versions
IE34642L (en
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IE34642L publication Critical patent/IE34642L/xx
Publication of IE34642B1 publication Critical patent/IE34642B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
IE1205/70A 1969-10-08 1970-09-16 Improvements in or relating to the fabrication of electrical circuit devices IE34642B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (2)

Publication Number Publication Date
IE34642L IE34642L (en) 1971-04-08
IE34642B1 true IE34642B1 (en) 1975-07-09

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1205/70A IE34642B1 (en) 1969-10-08 1970-09-16 Improvements in or relating to the fabrication of electrical circuit devices

Country Status (10)

Country Link
JP (1) JPS509342B1 (es)
BE (1) BE757162A (es)
CH (1) CH528148A (es)
DE (1) DE2049163C3 (es)
ES (1) ES384535A1 (es)
FR (1) FR2065090A5 (es)
GB (1) GB1315510A (es)
IE (1) IE34642B1 (es)
NL (1) NL145718B (es)
SE (1) SE365068B (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (es) * 1976-11-26 1978-06-28
DE2823881C3 (de) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
EP0015100B1 (en) * 1979-02-26 1983-08-17 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (zh) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 一种电阻负载导流罩

Also Published As

Publication number Publication date
ES384535A1 (es) 1974-06-01
FR2065090A5 (es) 1971-07-23
IE34642L (en) 1971-04-08
JPS509342B1 (es) 1975-04-11
NL7014581A (es) 1971-04-14
SE365068B (es) 1974-03-11
NL145718B (nl) 1975-04-15
DE2049163A1 (de) 1971-04-22
DE2049163C3 (de) 1978-07-06
GB1315510A (en) 1973-05-02
BE757162A (fr) 1971-03-16
CH528148A (de) 1972-09-15
DE2049163B2 (de) 1977-11-10

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