HUT76992A - Eljárás rádiófrekvenciás azonosító toldalék előállítására - Google Patents
Eljárás rádiófrekvenciás azonosító toldalék előállítására Download PDFInfo
- Publication number
- HUT76992A HUT76992A HU9701699A HU9701699A HUT76992A HU T76992 A HUT76992 A HU T76992A HU 9701699 A HU9701699 A HU 9701699A HU 9701699 A HU9701699 A HU 9701699A HU T76992 A HUT76992 A HU T76992A
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- wire
- semiconductor chip
- substrate
- connection
- cut
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
- G06K7/082—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors
- G06K7/083—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive
- G06K7/086—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes using inductive or magnetic sensors inductive sensing passive circuit, e.g. resonant circuit transponders
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/013—Alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
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- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Details Of Aerials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33028894A | 1994-10-27 | 1994-10-27 |
Publications (1)
Publication Number | Publication Date |
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HUT76992A true HUT76992A (hu) | 1998-01-28 |
Family
ID=23289095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU9701699A HUT76992A (hu) | 1994-10-27 | 1995-09-20 | Eljárás rádiófrekvenciás azonosító toldalék előállítására |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2818392B2 (enrdf_load_stackoverflow) |
KR (1) | KR100192728B1 (enrdf_load_stackoverflow) |
HU (1) | HUT76992A (enrdf_load_stackoverflow) |
TW (1) | TW280897B (enrdf_load_stackoverflow) |
WO (1) | WO1996013793A1 (enrdf_load_stackoverflow) |
ZA (1) | ZA957085B (enrdf_load_stackoverflow) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
JP2000216188A (ja) | 1999-01-22 | 2000-08-04 | Seiko Epson Corp | ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置 |
US6472747B2 (en) * | 2001-03-02 | 2002-10-29 | Qualcomm Incorporated | Mixed analog and digital integrated circuits |
US6732923B2 (en) * | 2001-04-04 | 2004-05-11 | Ncr Corporation | Radio frequency identification system and method |
US7692545B2 (en) * | 2004-05-18 | 2010-04-06 | Hitachi, Ltd. | Wireless IC tag and process for manufacturing the same |
US7295161B2 (en) | 2004-08-06 | 2007-11-13 | International Business Machines Corporation | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
KR101038493B1 (ko) * | 2004-11-12 | 2011-06-01 | 삼성테크윈 주식회사 | 극초단파용 라디오 주파수 인식태그 제조방법 |
US8026851B2 (en) | 2005-03-25 | 2011-09-27 | Toray Industries, Inc. | Planar antenna and manufacturing method thereof |
US7586193B2 (en) | 2005-10-07 | 2009-09-08 | Nhew R&D Pty Ltd | Mm-wave antenna using conventional IC packaging |
JP4316607B2 (ja) | 2006-12-27 | 2009-08-19 | 株式会社東芝 | アンテナ装置及び無線通信装置 |
WO2011083502A1 (ja) | 2010-01-05 | 2011-07-14 | 株式会社 東芝 | アンテナ及び無線装置 |
JP5172925B2 (ja) | 2010-09-24 | 2013-03-27 | 株式会社東芝 | 無線装置 |
JP5417389B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
JP5414749B2 (ja) | 2011-07-13 | 2014-02-12 | 株式会社東芝 | 無線装置 |
TW201325842A (zh) * | 2011-12-16 | 2013-07-01 | hong-ren Li | 工具盒結構 |
JP6121705B2 (ja) | 2012-12-12 | 2017-04-26 | 株式会社東芝 | 無線装置 |
US10304810B2 (en) * | 2014-12-19 | 2019-05-28 | Glo Ab | Method of making a light emitting diode array on a backplane |
FR3047101B1 (fr) * | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
US11233017B2 (en) * | 2019-10-03 | 2022-01-25 | Texas Instruments Incorporated | Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2519054C3 (de) * | 1974-04-30 | 1978-08-03 | Central Glass Co., Ltd., Ube, Yamaguchi (Japan) | Vorrichtung zum Aufbringen eines Drahtes auf eine Trägerfolie aus thermoplastischem Kunststoff nach einem vorgegebenen Muster |
NL9200396A (nl) * | 1992-03-03 | 1993-10-01 | Nedap Nv | Radiofrequente identificatielabel met relatief grote detectie-afstand en een minimum aantal electronische componenten. |
DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
-
1995
- 1995-05-09 TW TW084104596A patent/TW280897B/zh active
- 1995-08-23 ZA ZA957085A patent/ZA957085B/xx unknown
- 1995-09-20 WO PCT/EP1995/003703 patent/WO1996013793A1/en not_active Application Discontinuation
- 1995-09-20 HU HU9701699A patent/HUT76992A/hu unknown
- 1995-10-18 JP JP7269856A patent/JP2818392B2/ja not_active Expired - Lifetime
- 1995-10-24 KR KR1019950036741A patent/KR100192728B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH08213419A (ja) | 1996-08-20 |
WO1996013793A1 (en) | 1996-05-09 |
KR100192728B1 (ko) | 1999-06-15 |
ZA957085B (en) | 1996-03-11 |
TW280897B (enrdf_load_stackoverflow) | 1996-07-11 |
KR960016656A (ko) | 1996-05-22 |
JP2818392B2 (ja) | 1998-10-30 |
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