HUE034927T2 - Szilícium gél kompozíció és ennek alkalmazása - Google Patents
Szilícium gél kompozíció és ennek alkalmazásaInfo
- Publication number
- HUE034927T2 HUE034927T2 HUE14780632A HUE14780632A HUE034927T2 HU E034927 T2 HUE034927 T2 HU E034927T2 HU E14780632 A HUE14780632 A HU E14780632A HU E14780632 A HUE14780632 A HU E14780632A HU E034927 T2 HUE034927 T2 HU E034927T2
- Authority
- HU
- Hungary
- Prior art keywords
- gel composition
- silicone gel
- silicone
- composition
- gel
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/398—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing boron or metal atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/58—Metal-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013182085 | 2013-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE034927T2 true HUE034927T2 (hu) | 2018-07-30 |
Family
ID=51659980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE14780632A HUE034927T2 (hu) | 2013-09-03 | 2014-08-29 | Szilícium gél kompozíció és ennek alkalmazása |
Country Status (7)
Country | Link |
---|---|
US (2) | US9951186B2 (hu) |
EP (1) | EP3041903B1 (hu) |
KR (1) | KR102242607B1 (hu) |
CN (1) | CN105612219B (hu) |
HU (1) | HUE034927T2 (hu) |
TW (1) | TWI638858B (hu) |
WO (1) | WO2015034029A1 (hu) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105612219B (zh) * | 2013-09-03 | 2018-12-14 | 道康宁东丽株式会社 | 有机硅凝胶组合物及其用途 |
JP6409704B2 (ja) * | 2015-07-24 | 2018-10-24 | 信越化学工業株式会社 | シリコーンゲル組成物及びシリコーンゲル硬化物 |
DE102015014581A1 (de) | 2015-11-12 | 2017-05-18 | Nele Schmidt | Prolamine enthaltende Gele, Verfahren zu ihrer Herstellung und ihre Verwendung |
WO2018013262A1 (en) * | 2016-07-13 | 2018-01-18 | Dow Corning Corporation | Formulation containing a metal aprotic organosilanoxide compound |
JP6806806B2 (ja) | 2016-07-13 | 2021-01-06 | ダウ シリコーンズ コーポレーション | 金属非プロトン性オルガノシラノキシド化合物 |
TWI763735B (zh) * | 2016-12-09 | 2022-05-11 | 美商道康寧公司 | 組成物、光漫散器和由其所形成之裝置、及相關方法 |
WO2018211981A1 (ja) | 2017-05-18 | 2018-11-22 | 東レ・ダウコーニング株式会社 | フルオロアルキル基含有硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えたトランスデューサー等 |
CN108024176A (zh) * | 2017-12-26 | 2018-05-11 | 海鹰企业集团有限责任公司 | 将有机硅凝胶用作深水换能器及其阵缆压力补偿材料的方法 |
JP6923475B2 (ja) * | 2018-03-23 | 2021-08-18 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物、シリコーン硬化物、及び光半導体装置 |
EP3831887A4 (en) * | 2018-08-03 | 2022-04-27 | Shin-Etsu Chemical Co., Ltd. | COMPOSITION OF SILICONE GEL, CURED PRODUCT BASED THEREOF AND POWER MODULE |
US12091589B2 (en) * | 2019-04-01 | 2024-09-17 | Shin-Etsu Chemical Co., Ltd. | Self-adhesive silicone gel composition and silicone gel comprising cured product thereof |
JP7120145B2 (ja) * | 2019-04-26 | 2022-08-17 | 信越化学工業株式会社 | 型取り用シリコーンゴム組成物およびシリコーンゴム型 |
CN111234771A (zh) * | 2019-05-24 | 2020-06-05 | 深圳市鑫东邦科技有限公司 | 一种单组份加成型硅凝胶及其制备方法 |
EP4181183A4 (en) * | 2020-07-13 | 2024-08-21 | Dow Toray Co Ltd | SILICONE GEL COMPOSITION, CURED ARTICLE THEREOF, AND APPLICATIONS THEREOF |
CN112322048A (zh) * | 2020-11-03 | 2021-02-05 | 杭州之江新材料有限公司 | 一种有机硅凝胶组合物及其制备方法和应用 |
CN113652194B (zh) * | 2021-08-19 | 2023-05-05 | 广东万木新材料科技有限公司 | 一种苯基聚硅氧烷胶黏剂及其制备方法 |
CN114045122A (zh) * | 2021-11-04 | 2022-02-15 | 埃肯有机硅(上海)有限公司 | 医用双面胶带及其制造方法 |
CN117777729B (zh) * | 2023-12-29 | 2024-07-12 | 四川大学青岛研究院 | 透光耐候型有机硅凝胶及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL289728A (hu) * | 1962-03-15 | |||
JPS6056190B2 (ja) | 1980-04-11 | 1985-12-09 | 東芝シリコ−ン株式会社 | ポリオルガノシロキサン組成物 |
JPS6116295A (ja) | 1984-07-04 | 1986-01-24 | Hitachi Ltd | 立軸ポンプの可動翼翼角度制御装置 |
JPH0696698B2 (ja) * | 1988-04-25 | 1994-11-30 | 信越化学工業株式会社 | 耐熱性シリコーン系感圧接着剤組成物 |
JPH0660282B2 (ja) * | 1989-04-12 | 1994-08-10 | 信越化学工業株式会社 | 耐熱性シリコーンゲル組成物 |
JP3088011B2 (ja) * | 1990-01-30 | 2000-09-18 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性オルガノポリシロキサン組成物 |
EP0440168A3 (en) * | 1990-01-30 | 1993-01-07 | Dow Corning Toray Silicone Company, Limited | One-part curable organosiloxane composition |
JPH09183904A (ja) * | 1995-12-28 | 1997-07-15 | Toray Dow Corning Silicone Co Ltd | オルガノポリシロキサン組成物 |
JP3765444B2 (ja) * | 1997-07-10 | 2006-04-12 | 東レ・ダウコーニング株式会社 | 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル |
JP4875251B2 (ja) | 2001-04-26 | 2012-02-15 | 東レ・ダウコーニング株式会社 | シリコーンゲル組成物 |
EP2105467B1 (en) | 2006-12-28 | 2012-02-22 | Dow Corning Toray Co., Ltd. | Thermosetting silicone rubber composition |
JP2008291148A (ja) | 2007-05-25 | 2008-12-04 | Shin Etsu Chem Co Ltd | 耐熱性に優れたシリコーンゲル組成物 |
JP5667740B2 (ja) * | 2008-06-18 | 2015-02-12 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
JP2010106223A (ja) * | 2008-10-31 | 2010-05-13 | Dow Corning Toray Co Ltd | 電気・電子部品用封止・充填剤および電気・電子部品 |
CN105612219B (zh) * | 2013-09-03 | 2018-12-14 | 道康宁东丽株式会社 | 有机硅凝胶组合物及其用途 |
JP6609403B2 (ja) | 2014-07-08 | 2019-11-20 | 株式会社Nttファシリティーズ | 構造物検証システム、構造物検証装置、構造物検証プログラム |
-
2014
- 2014-08-29 CN CN201480054108.7A patent/CN105612219B/zh active Active
- 2014-08-29 US US14/916,241 patent/US9951186B2/en active Active
- 2014-08-29 WO PCT/JP2014/073424 patent/WO2015034029A1/en active Application Filing
- 2014-08-29 HU HUE14780632A patent/HUE034927T2/hu unknown
- 2014-08-29 EP EP14780632.7A patent/EP3041903B1/en active Active
- 2014-08-29 KR KR1020167008457A patent/KR102242607B1/ko active IP Right Grant
- 2014-09-03 TW TW103130454A patent/TWI638858B/zh active
-
2018
- 2018-03-19 US US15/924,665 patent/US20180208719A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN105612219B (zh) | 2018-12-14 |
US20160215099A1 (en) | 2016-07-28 |
TWI638858B (zh) | 2018-10-21 |
KR20160051830A (ko) | 2016-05-11 |
KR102242607B1 (ko) | 2021-04-22 |
EP3041903A1 (en) | 2016-07-13 |
EP3041903B1 (en) | 2017-08-16 |
CN105612219A (zh) | 2016-05-25 |
TW201518419A (zh) | 2015-05-16 |
US20180208719A1 (en) | 2018-07-26 |
WO2015034029A1 (en) | 2015-03-12 |
US9951186B2 (en) | 2018-04-24 |
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