HK48088A - Palladium and palladium alloys electroplating procedure - Google Patents

Palladium and palladium alloys electroplating procedure

Info

Publication number
HK48088A
HK48088A HK48088A HK48088A HK48088A HK 48088 A HK48088 A HK 48088A HK 48088 A HK48088 A HK 48088A HK 48088 A HK48088 A HK 48088A HK 48088 A HK48088 A HK 48088A
Authority
HK
Hong Kong
Prior art keywords
palladium
electroplating procedure
alloys electroplating
alloys
procedure
Prior art date
Application number
HK48088A
Other languages
English (en)
Inventor
Anthony Abys Joseph
Stewart Trop Harvey
Original Assignee
At & T Technologies, Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Technologies, Incorporated filed Critical At & T Technologies, Incorporated
Publication of HK48088A publication Critical patent/HK48088A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK48088A 1981-02-27 1988-06-30 Palladium and palladium alloys electroplating procedure HK48088A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23915181A 1981-02-27 1981-02-27
PCT/US1982/000200 WO1982002908A1 (en) 1981-02-27 1982-02-18 Palladium and palladium alloys electroplating procedure

Publications (1)

Publication Number Publication Date
HK48088A true HK48088A (en) 1988-07-08

Family

ID=22900832

Family Applications (1)

Application Number Title Priority Date Filing Date
HK48088A HK48088A (en) 1981-02-27 1988-06-30 Palladium and palladium alloys electroplating procedure

Country Status (7)

Country Link
EP (2) EP0073236B1 (enrdf_load_stackoverflow)
JP (1) JPS58500289A (enrdf_load_stackoverflow)
CA (1) CA1189016A (enrdf_load_stackoverflow)
DE (1) DE3266736D1 (enrdf_load_stackoverflow)
GB (1) GB2112018B (enrdf_load_stackoverflow)
HK (1) HK48088A (enrdf_load_stackoverflow)
WO (1) WO1982002908A1 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4741818A (en) * 1985-12-12 1988-05-03 Learonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
EP0693579B1 (de) * 1994-07-21 1997-08-27 W.C. Heraeus GmbH Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
DE4444232C1 (de) * 1994-07-21 1996-05-09 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
DE4431847C5 (de) * 1994-09-07 2011-01-27 Atotech Deutschland Gmbh Substrat mit bondfähiger Beschichtung
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
KR101502804B1 (ko) * 2008-05-07 2015-03-16 유미코아 갈바노테히닉 게엠베하 Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조
JP2012241260A (ja) * 2011-05-23 2012-12-10 Kanto Gakuin 電解パラジウム−リン合金めっき液、めっき被膜及びめっき製品
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2452308A (en) * 1946-02-28 1948-10-26 George C Lambros Process of plating palladium and plating bath therefor
CH534215A (fr) * 1971-09-06 1973-02-28 Oxy Metal Finishing Europ S A Bain électrolytique pour l'électrodéposition d'alliages d'or et une utilisation de celui-ci
DE2360834C3 (de) * 1973-12-06 1978-05-18 Inovan-Stroebe Kg, 7534 Birkenfeld Bad und Verfahren zum galvanischen Abscheiden von Palladiumschichten
DE2506467C2 (de) * 1975-02-07 1986-07-17 Schering AG, 1000 Berlin und 4709 Bergkamen Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
DE2939920C2 (de) * 1979-10-02 1982-09-23 W.C. Heraeus Gmbh, 6450 Hanau Verwendung eines Amins in einem Bad zum galvanischen Abscheiden von Palladium
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution

Also Published As

Publication number Publication date
WO1982002908A1 (en) 1982-09-02
CA1189016A (en) 1985-06-18
GB2112018A (en) 1983-07-13
JPH0219197B2 (enrdf_load_stackoverflow) 1990-04-27
JPS58500289A (ja) 1983-02-24
EP0059452A3 (en) 1982-11-10
EP0073236A4 (en) 1983-01-14
DE3266736D1 (en) 1985-11-14
EP0073236B1 (en) 1985-10-09
EP0059452B1 (en) 1985-10-09
EP0059452A2 (en) 1982-09-08
EP0073236A1 (en) 1983-03-09
GB2112018B (en) 1984-08-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)