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Hewlett-Packard Development Company, L.P. |
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2003-04-30 |
2005-10-18 |
Hewlett-Packard Development Company, L.P. |
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2003-06-02 |
2005-05-24 |
Hewlett-Packard Development Company, Lp. |
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2003-09-17 |
2007-11-15 |
Hewlett Packard Development Co |
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2004-07-09 |
2008-07-22 |
Texas Instruments Incorporated |
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2004-09-28 |
2006-12-19 |
Hewlett-Packard Development Company, L.P. |
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2005-07-08 |
2007-04-01 |
Canon Kk |
Thermal ink jet ink and ink cartridge using the same
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2007-10-17 |
2011-10-04 |
Eastman Kodak Company |
Ambient plasma treatment of printer components
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2010-04-21 |
2013-02-19 |
Lexmark International, Inc. |
Capping layer for insulator in micro-fluid ejection heads
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2015-07-30 |
2019-06-05 |
京セラ株式会社 |
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2016-10-19 |
2023-10-17 |
Sicpa Holding Sa |
Method for forming thermal inkjet printhead, thermal inkjet printhead, and semiconductor wafer
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