HK42179A - Electroless copper plating bath - Google Patents

Electroless copper plating bath

Info

Publication number
HK42179A
HK42179A HK421/79A HK42179A HK42179A HK 42179 A HK42179 A HK 42179A HK 421/79 A HK421/79 A HK 421/79A HK 42179 A HK42179 A HK 42179A HK 42179 A HK42179 A HK 42179A
Authority
HK
Hong Kong
Prior art keywords
plating bath
copper plating
electroless copper
electroless
bath
Prior art date
Application number
HK421/79A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of HK42179A publication Critical patent/HK42179A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
HK421/79A 1975-08-19 1979-06-28 Electroless copper plating bath HK42179A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7509824.A NL164906C (nl) 1975-08-19 1975-08-19 Werkwijze voor de bereiding van een waterig alkalische verkoperbad.

Publications (1)

Publication Number Publication Date
HK42179A true HK42179A (en) 1979-07-06

Family

ID=19824317

Family Applications (1)

Application Number Title Priority Date Filing Date
HK421/79A HK42179A (en) 1975-08-19 1979-06-28 Electroless copper plating bath

Country Status (16)

Country Link
US (1) US4118234A (xx)
JP (1) JPS5224939A (xx)
AR (1) AR221469A1 (xx)
AT (1) AT345057B (xx)
AU (1) AU501210B2 (xx)
BE (1) BE845254A (xx)
BR (1) BR7605351A (xx)
CA (1) CA1067652A (xx)
CH (1) CH624994A5 (xx)
DE (1) DE2635397C3 (xx)
FR (1) FR2321551A1 (xx)
GB (1) GB1521364A (xx)
HK (1) HK42179A (xx)
IT (1) IT1066104B (xx)
NL (1) NL164906C (xx)
SE (1) SE430615B (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
JP4482744B2 (ja) * 2001-02-23 2010-06-16 株式会社日立製作所 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
EP3825424A1 (en) 2014-01-31 2021-05-26 Goldcorp Inc. Process for stabilisation of an arsenic solution comprising thiosulfates
JP6347853B2 (ja) 2014-04-10 2018-06-27 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH パラジウムの無電解めっきのためのめっき浴組成物及び方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266099B (de) * 1965-02-20 1968-04-11 Schering Ag Bad fuer die reduktive Kupferabscheidung
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
BE794048A (fr) * 1972-01-17 1973-07-16 Dynachem Corp Procede et solution de revetement de cuivre sans traitement electrique

Also Published As

Publication number Publication date
CH624994A5 (xx) 1981-08-31
US4118234A (en) 1978-10-03
FR2321551A1 (fr) 1977-03-18
AT345057B (de) 1978-08-25
SE7609126L (sv) 1977-02-20
AU501210B2 (en) 1979-06-14
BR7605351A (pt) 1977-08-16
JPS5224939A (en) 1977-02-24
BE845254A (fr) 1977-02-17
ATA608876A (de) 1977-12-15
DE2635397C3 (de) 1978-11-16
AR221469A1 (es) 1981-02-13
JPS5344405B2 (xx) 1978-11-29
CA1067652A (en) 1979-12-11
DE2635397A1 (de) 1977-02-24
AU1686176A (en) 1978-02-23
IT1066104B (it) 1985-03-04
NL7509824A (nl) 1977-02-22
GB1521364A (en) 1978-08-16
NL164906B (nl) 1980-09-15
NL164906C (nl) 1981-02-16
SE430615B (sv) 1983-11-28
DE2635397B2 (de) 1978-03-23
FR2321551B1 (xx) 1980-05-23

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