BE845254A - Bains de cuivrage sans courant - Google Patents

Bains de cuivrage sans courant

Info

Publication number
BE845254A
BE845254A BE169864A BE169864A BE845254A BE 845254 A BE845254 A BE 845254A BE 169864 A BE169864 A BE 169864A BE 169864 A BE169864 A BE 169864A BE 845254 A BE845254 A BE 845254A
Authority
BE
Belgium
Prior art keywords
coping
baths
current
coping baths
Prior art date
Application number
BE169864A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE845254A publication Critical patent/BE845254A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
BE169864A 1975-08-19 1976-08-17 Bains de cuivrage sans courant BE845254A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7509824.A NL164906C (nl) 1975-08-19 1975-08-19 Werkwijze voor de bereiding van een waterig alkalische verkoperbad.

Publications (1)

Publication Number Publication Date
BE845254A true BE845254A (fr) 1977-02-17

Family

ID=19824317

Family Applications (1)

Application Number Title Priority Date Filing Date
BE169864A BE845254A (fr) 1975-08-19 1976-08-17 Bains de cuivrage sans courant

Country Status (16)

Country Link
US (1) US4118234A (fr)
JP (1) JPS5224939A (fr)
AR (1) AR221469A1 (fr)
AT (1) AT345057B (fr)
AU (1) AU501210B2 (fr)
BE (1) BE845254A (fr)
BR (1) BR7605351A (fr)
CA (1) CA1067652A (fr)
CH (1) CH624994A5 (fr)
DE (1) DE2635397C3 (fr)
FR (1) FR2321551A1 (fr)
GB (1) GB1521364A (fr)
HK (1) HK42179A (fr)
IT (1) IT1066104B (fr)
NL (1) NL164906C (fr)
SE (1) SE430615B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
JP4482744B2 (ja) * 2001-02-23 2010-06-16 株式会社日立製作所 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
PE20211336A1 (es) 2014-01-31 2021-07-26 Goldcorp Inc Proceso para la separacion y recuperacion de sulfuros de metales de una mena o concentrado de sulfuros mixtos
EP3129526B1 (fr) 2014-04-10 2019-08-07 ATOTECH Deutschland GmbH Composition de bain de placage et procédé pour dépôt autocatalytique de palladium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266099B (de) * 1965-02-20 1968-04-11 Schering Ag Bad fuer die reduktive Kupferabscheidung
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
BE794048A (fr) * 1972-01-17 1973-07-16 Dynachem Corp Procede et solution de revetement de cuivre sans traitement electrique

Also Published As

Publication number Publication date
AU1686176A (en) 1978-02-23
IT1066104B (it) 1985-03-04
CH624994A5 (fr) 1981-08-31
NL164906B (nl) 1980-09-15
DE2635397B2 (de) 1978-03-23
FR2321551A1 (fr) 1977-03-18
ATA608876A (de) 1977-12-15
NL7509824A (nl) 1977-02-22
AT345057B (de) 1978-08-25
BR7605351A (pt) 1977-08-16
HK42179A (en) 1979-07-06
AU501210B2 (en) 1979-06-14
NL164906C (nl) 1981-02-16
FR2321551B1 (fr) 1980-05-23
DE2635397A1 (de) 1977-02-24
CA1067652A (fr) 1979-12-11
SE7609126L (sv) 1977-02-20
US4118234A (en) 1978-10-03
SE430615B (sv) 1983-11-28
JPS5224939A (en) 1977-02-24
DE2635397C3 (de) 1978-11-16
GB1521364A (en) 1978-08-16
JPS5344405B2 (fr) 1978-11-29
AR221469A1 (es) 1981-02-13

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: N.V. PHILIPS GLOEILAMPENFABRIEKEN

Effective date: 19870831