BR7605351A - Banho de revestimento de cobre sem eletrolise - Google Patents

Banho de revestimento de cobre sem eletrolise

Info

Publication number
BR7605351A
BR7605351A BR7605351A BR7605351A BR7605351A BR 7605351 A BR7605351 A BR 7605351A BR 7605351 A BR7605351 A BR 7605351A BR 7605351 A BR7605351 A BR 7605351A BR 7605351 A BR7605351 A BR 7605351A
Authority
BR
Brazil
Prior art keywords
electrolysis
coating bath
copper coating
copper
bath
Prior art date
Application number
BR7605351A
Other languages
English (en)
Inventor
J Jans
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of BR7605351A publication Critical patent/BR7605351A/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
BR7605351A 1975-08-19 1976-08-16 Banho de revestimento de cobre sem eletrolise BR7605351A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7509824.A NL164906C (nl) 1975-08-19 1975-08-19 Werkwijze voor de bereiding van een waterig alkalische verkoperbad.

Publications (1)

Publication Number Publication Date
BR7605351A true BR7605351A (pt) 1977-08-16

Family

ID=19824317

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7605351A BR7605351A (pt) 1975-08-19 1976-08-16 Banho de revestimento de cobre sem eletrolise

Country Status (16)

Country Link
US (1) US4118234A (pt)
JP (1) JPS5224939A (pt)
AR (1) AR221469A1 (pt)
AT (1) AT345057B (pt)
AU (1) AU501210B2 (pt)
BE (1) BE845254A (pt)
BR (1) BR7605351A (pt)
CA (1) CA1067652A (pt)
CH (1) CH624994A5 (pt)
DE (1) DE2635397C3 (pt)
FR (1) FR2321551A1 (pt)
GB (1) GB1521364A (pt)
HK (1) HK42179A (pt)
IT (1) IT1066104B (pt)
NL (1) NL164906C (pt)
SE (1) SE430615B (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4857233A (en) * 1988-05-26 1989-08-15 Potters Industries, Inc. Nickel particle plating system
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
JP4482744B2 (ja) * 2001-02-23 2010-06-16 株式会社日立製作所 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
CA2952568C (en) 2014-01-31 2018-07-10 Goldcorp Inc. Process for separation of at least one metal sulfide from a mixed sulfide ore or concentrate
JP6347853B2 (ja) 2014-04-10 2018-06-27 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH パラジウムの無電解めっきのためのめっき浴組成物及び方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266099B (de) * 1965-02-20 1968-04-11 Schering Ag Bad fuer die reduktive Kupferabscheidung
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
BE794048A (fr) * 1972-01-17 1973-07-16 Dynachem Corp Procede et solution de revetement de cuivre sans traitement electrique

Also Published As

Publication number Publication date
DE2635397C3 (de) 1978-11-16
GB1521364A (en) 1978-08-16
NL7509824A (nl) 1977-02-22
NL164906C (nl) 1981-02-16
AR221469A1 (es) 1981-02-13
JPS5344405B2 (pt) 1978-11-29
SE430615B (sv) 1983-11-28
AU501210B2 (en) 1979-06-14
SE7609126L (sv) 1977-02-20
FR2321551A1 (fr) 1977-03-18
ATA608876A (de) 1977-12-15
NL164906B (nl) 1980-09-15
CH624994A5 (pt) 1981-08-31
FR2321551B1 (pt) 1980-05-23
HK42179A (en) 1979-07-06
AU1686176A (en) 1978-02-23
AT345057B (de) 1978-08-25
IT1066104B (it) 1985-03-04
DE2635397A1 (de) 1977-02-24
DE2635397B2 (de) 1978-03-23
JPS5224939A (en) 1977-02-24
BE845254A (fr) 1977-02-17
CA1067652A (en) 1979-12-11
US4118234A (en) 1978-10-03

Similar Documents

Publication Publication Date Title
BE833384A (fr) Electrodeposition du cuivre
JPS51149134A (en) Nonncyanideeseries silver plating bath
BR7607330A (pt) Gerador de banho de escoria
FR2297262A1 (fr) Bain de chromage galvanique
AU1243576A (en) Electroplating metal surfaces
JPS5211132A (en) Electroplating bath
IT1049081B (it) Soluzione per placcatura metallica
CS189015B2 (en) Water acid electroplating bath
FR2303870A1 (fr) Procede de zingage
AT332188B (de) Bad zum stromlosen verzinnen
BR7605351A (pt) Banho de revestimento de cobre sem eletrolise
JPS5220339A (en) Chemical copper plating solution
SE7610517L (sv) Elektrolytisk beleggning
GB1551164A (en) Electrolytic galvanizing
JPS5215426A (en) Electroplating bath
JPS5217335A (en) Chemical copper plating solution
JPS5376893A (en) Electrolytic bath
JPS5211133A (en) Electroplating bath
JPS5273154A (en) Solder bath
JPS51128647A (en) Method of zinc plating bath
FR2314271A1 (fr) Bain de depot electrolytique de palladium
JPS5214537A (en) Rhodium plating bath
FR2310424A1 (fr) Bain de nickelage electrolytique brillant
JPS51112732A (en) Copper sulfate electrocasting bath
JPS5214538A (en) Rhodium plating bath