HK40292A - Copper alloy and production of the same - Google Patents

Copper alloy and production of the same

Info

Publication number
HK40292A
HK40292A HK402/92A HK40292A HK40292A HK 40292 A HK40292 A HK 40292A HK 402/92 A HK402/92 A HK 402/92A HK 40292 A HK40292 A HK 40292A HK 40292 A HK40292 A HK 40292A
Authority
HK
Hong Kong
Prior art keywords
production
same
copper alloy
alloy
copper
Prior art date
Application number
HK402/92A
Other languages
English (en)
Inventor
Motohisa Miyafuji
Yasuhiro Nakashima
Satoru Katayama
Takashi Matsui
Hidekazu Harada
Youji Yuki
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59221015A external-priority patent/JPS6199647A/ja
Priority claimed from JP59248400A external-priority patent/JPS61127842A/ja
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of HK40292A publication Critical patent/HK40292A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
HK402/92A 1984-10-20 1992-06-04 Copper alloy and production of the same HK40292A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59221015A JPS6199647A (ja) 1984-10-20 1984-10-20 半導体用リ−ドフレ−ム材およびその製造法
JP59248400A JPS61127842A (ja) 1984-11-24 1984-11-24 端子・コネクタ−用銅合金およびその製造方法

Publications (1)

Publication Number Publication Date
HK40292A true HK40292A (en) 1992-06-12

Family

ID=26524035

Family Applications (1)

Application Number Title Priority Date Filing Date
HK402/92A HK40292A (en) 1984-10-20 1992-06-04 Copper alloy and production of the same

Country Status (7)

Country Link
US (1) US4656003A (xx)
EP (1) EP0189637B1 (xx)
KR (1) KR900004109B1 (xx)
DE (1) DE3566904D1 (xx)
HK (1) HK40292A (xx)
MY (1) MY100717A (xx)
SG (1) SG21789G (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221541A (ja) * 1984-04-07 1985-11-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
DE3725830C2 (de) * 1986-09-30 2000-03-30 Furukawa Electric Co Ltd Kupfer-Zinn-Legierung für elektronische Instrumente
JPH02221344A (ja) * 1989-02-21 1990-09-04 Mitsubishi Shindoh Co Ltd 熱間圧延性およびめっき加熱密着性のすぐれた高強度Ｃｕ合金
JP2977845B2 (ja) * 1990-01-30 1999-11-15 株式会社神戸製鋼所 ばね特性、強度及び導電性に優れた耐マイグレーション性端子・コネクタ用銅合金
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JP2503793B2 (ja) * 1991-03-01 1996-06-05 三菱伸銅株式会社 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材
US5118341A (en) * 1991-03-28 1992-06-02 Alcan Aluminum Corporation Machinable powder metallurgical parts and method
JPH0714962A (ja) * 1993-04-28 1995-01-17 Mitsubishi Shindoh Co Ltd リードフレーム材およびリードフレーム
DE4415067C2 (de) * 1994-04-29 1996-02-22 Diehl Gmbh & Co Verfahren zur Herstellung einer Kupfer-Nickel-Silizium-Legierung und deren Verwendung
KR0157257B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법
US6136104A (en) * 1998-07-08 2000-10-24 Kobe Steel, Ltd. Copper alloy for terminals and connectors and method for making same
US6251199B1 (en) 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
US6344171B1 (en) 1999-08-25 2002-02-05 Kobe Steel, Ltd. Copper alloy for electrical or electronic parts
DE10025107A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leifähiges Metallband und Steckverbinder
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP3520046B2 (ja) * 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
US7090732B2 (en) * 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
FR2840460B1 (fr) * 2002-05-29 2004-08-27 Gobin Daude Vis de borne
JP4501818B2 (ja) * 2005-09-02 2010-07-14 日立電線株式会社 銅合金材およびその製造方法
JP5170866B2 (ja) * 2006-10-10 2013-03-27 古河電気工業株式会社 電気・電子部品用銅合金材およびその製造方法
CN111621668B (zh) * 2020-05-21 2022-02-15 宁波金田铜业(集团)股份有限公司 一种镍硅系铜合金带材及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US31180A (en) * 1861-01-22 Polishing-tool
GB512142A (en) * 1937-11-19 1939-08-30 Mallory & Co Inc P R Improvements in copper base alloys
GB522008A (en) * 1938-11-28 1940-06-06 Mallory Metallurg Prod Ltd Improvements in and relating to the production of copper base alloys
CA1085654A (en) * 1976-01-19 1980-09-16 Ronald N. Caron Electrical contact
USRE31180E (en) 1976-05-11 1983-03-15 Bell Telephone Laboratories, Incorporated Quaternary spinodal copper alloys
JPS599144A (ja) * 1982-07-05 1984-01-18 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
JPS59117144A (ja) * 1982-12-23 1984-07-06 Toshiba Corp リ−ドフレ−ムおよびその製造方法
JPS59145749A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS60152646A (ja) * 1984-01-23 1985-08-10 Kobe Steel Ltd 半導体用リ−ドフレ−ム材

Also Published As

Publication number Publication date
KR900004109B1 (ko) 1990-06-15
SG21789G (en) 1989-07-14
EP0189637A1 (en) 1986-08-06
DE3566904D1 (en) 1989-01-26
US4656003A (en) 1987-04-07
EP0189637B1 (en) 1988-12-21
MY100717A (en) 1991-01-31
KR860003360A (ko) 1986-05-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)