HK3596A - Acid nickel baths containing 1-(2-sulfoethyl)-pyridinium betaine - Google Patents

Acid nickel baths containing 1-(2-sulfoethyl)-pyridinium betaine

Info

Publication number
HK3596A
HK3596A HK3596A HK3596A HK3596A HK 3596 A HK3596 A HK 3596A HK 3596 A HK3596 A HK 3596A HK 3596 A HK3596 A HK 3596A HK 3596 A HK3596 A HK 3596A
Authority
HK
Hong Kong
Prior art keywords
sulfoethyl
acid nickel
baths containing
pct
nickel baths
Prior art date
Application number
HK3596A
Other languages
English (en)
Inventor
Wolfgang Dahms
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK3596A publication Critical patent/HK3596A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18Heterocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pyridine Compounds (AREA)
  • Character Discrimination (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Chemically Coating (AREA)
HK3596A 1990-04-23 1996-01-04 Acid nickel baths containing 1-(2-sulfoethyl)-pyridinium betaine HK3596A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4013349A DE4013349A1 (de) 1990-04-23 1990-04-23 1-(2-sulfoaethyl)pyridiniumbetain, verfahren zu dessen herstellung sowie saure nickelbaeder enthaltend diese verbindung
PCT/DE1991/000336 WO1991016474A1 (de) 1990-04-23 1991-04-22 Saure nickelbäder, enthaltend 1-(2-sulfoethyl)-pyridiniumbetain

Publications (1)

Publication Number Publication Date
HK3596A true HK3596A (en) 1996-01-12

Family

ID=6405158

Family Applications (1)

Application Number Title Priority Date Filing Date
HK3596A HK3596A (en) 1990-04-23 1996-01-04 Acid nickel baths containing 1-(2-sulfoethyl)-pyridinium betaine

Country Status (8)

Country Link
US (1) US5264112A (de)
EP (1) EP0526497B1 (de)
JP (1) JP3199729B2 (de)
AT (1) ATE118253T1 (de)
DE (2) DE4013349A1 (de)
ES (1) ES2068577T3 (de)
HK (1) HK3596A (de)
WO (1) WO1991016474A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE416165T1 (de) 1997-08-01 2008-12-15 Vertellus Specialties Inc Verfahren zur herstellung von 4-ä(di)alkylaminoü- pyridin-verbindungen
DE19805487A1 (de) 1998-02-11 1999-08-12 Basf Ag Synthese von 1-(2-Sulfoethyl)-pyridiniumbetain
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
US10458032B2 (en) * 2017-06-15 2019-10-29 Rohm And Haas Electronic Materials Llc Environmentally friendly nickel electroplating compositions and methods
US10718059B2 (en) * 2017-07-10 2020-07-21 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with cationic polymers and methods of electroplating nickel
EP3456870A1 (de) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH Bad und verfahren zum füllen eines senkrechten verbindungszugangs für ein werkstück mit nickel oder nickellegierung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE545564A (de) * 1955-03-16
US3131189A (en) * 1961-10-16 1964-04-28 Pure Oil Co Preparation of quaternary ammonium betaine salts
FR1529883A (fr) * 1967-05-11 1968-06-21 Conservatoire Nat Arts Procédé de sulfoéthylation d'amines tertiaires et nouveaux composés obtenus
DE1621157A1 (de) * 1967-08-16 1971-05-19 Riedel & Co Saures galvanisches Nickelbad
US3862019A (en) * 1974-04-26 1975-01-21 R O Hull & Company Inc Composition of electroplating bath for the electrodeposition of bright nickel
CA1242809A (en) * 1985-12-20 1988-10-04 Mitel Corporation Data storage system
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
DD266814A1 (de) * 1987-10-13 1989-04-12 Leipzig Galvanotechnik Verfahren zur elektrolytischen abscheidung glaenzender nickelschichten
FR2630753B1 (fr) * 1988-05-02 1992-01-03 Piolat Ind Cadres perfores en nickel et leur procede de fabrication
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
US5164069A (en) * 1990-11-05 1992-11-17 Shipley Company Inc. Nickel electroplating solution and acetylenic compounds therefor

Also Published As

Publication number Publication date
ATE118253T1 (de) 1995-02-15
DE59104555D1 (de) 1995-03-23
EP0526497B1 (de) 1995-02-08
JPH05506695A (ja) 1993-09-30
DE4013349A1 (de) 1991-10-24
JP3199729B2 (ja) 2001-08-20
ES2068577T3 (es) 1995-04-16
EP0526497A1 (de) 1993-02-10
US5264112A (en) 1993-11-23
WO1991016474A1 (de) 1991-10-31

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20060422