HK33297A - High mix printed circuit assembly technique - Google Patents

High mix printed circuit assembly technique

Info

Publication number
HK33297A
HK33297A HK33297A HK33297A HK33297A HK 33297 A HK33297 A HK 33297A HK 33297 A HK33297 A HK 33297A HK 33297 A HK33297 A HK 33297A HK 33297 A HK33297 A HK 33297A
Authority
HK
Hong Kong
Prior art keywords
components
board
cell
printed circuit
circuit assembly
Prior art date
Application number
HK33297A
Other languages
English (en)
Inventor
Thomas C Davis
Eva M Selep
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of HK33297A publication Critical patent/HK33297A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Combinations Of Printed Boards (AREA)
  • General Factory Administration (AREA)
HK33297A 1990-09-28 1997-03-20 High mix printed circuit assembly technique HK33297A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/589,748 US5170554A (en) 1990-09-28 1990-09-28 High mix printed circuit assembly technique

Publications (1)

Publication Number Publication Date
HK33297A true HK33297A (en) 1997-03-27

Family

ID=24359351

Family Applications (1)

Application Number Title Priority Date Filing Date
HK33297A HK33297A (en) 1990-09-28 1997-03-20 High mix printed circuit assembly technique

Country Status (6)

Country Link
US (1) US5170554A (fr)
EP (1) EP0478360B1 (fr)
JP (1) JPH04246897A (fr)
KR (1) KR930007321A (fr)
DE (1) DE69120887T2 (fr)
HK (1) HK33297A (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258915A (en) * 1990-09-28 1993-11-02 Hewlett-Packard Company System and method for optimum operation assignments in printed circuit board manufacturing
US5325305A (en) * 1992-07-24 1994-06-28 The Boeing Company Automated setup verification system
DE19502434A1 (de) * 1994-04-29 1995-11-02 Hewlett Packard Co System und Verfahren zur inkrementalen Herstellung von Schaltungsplatinen
JP3552806B2 (ja) * 1995-09-13 2004-08-11 松下電器産業株式会社 部品実装方法
MX9709038A (es) * 1996-11-25 1998-08-30 Samsung Electronics Co Ltd Sistema y metodo de produccion de montajes de tableros de circuitos impresos.
WO1998049646A2 (fr) * 1997-05-01 1998-11-05 Motorola Inc. Chaine d'assemblage reconfigurable dynamiquement d'articles electroniques
KR100369401B1 (ko) * 2000-04-03 2003-01-29 (주) 이우티이씨 자기장을 이용한 매설 배관 위치 측정 시스템
DE10023358A1 (de) * 2000-05-12 2001-11-29 Siemens Ag Fertigungslinie für die einseitige und doppelseitige Bestückung von Leiterplatten
JP2003030250A (ja) * 2001-07-12 2003-01-31 Oki Electric Ind Co Ltd プリント基板設計工数見積りシステムと見積りプログラム
US6829514B2 (en) * 2003-01-17 2004-12-07 Motorola, Inc. Balancing workloads in an electronics assembly factory
US7457128B2 (en) * 2005-07-22 2008-11-25 Hewlett-Packard Development Company, L.P. Flexible cell configuration for multi-processor systems
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
CN104412733B (zh) * 2012-07-06 2016-11-09 西门子公司 装配电路板以给电路板装配电子构件的方法和设备
DE102012211810A1 (de) * 2012-07-06 2014-02-20 Siemens Aktiengesellschaft Bildung von Rüstfamilien auf Bestückungslinien
US9888620B2 (en) 2012-07-06 2018-02-06 Siemens Aktiengesellschaft Allocation of printed circuit boards on fitting lines
WO2014005743A1 (fr) * 2012-07-06 2014-01-09 Siemens Aktiengesellschaft Affectation de cartes de circuits imprimes sur des lignes de montage
DE102012221258A1 (de) * 2012-11-21 2014-05-22 Siemens Aktiengesellschaft Optimieren von Rüstfamilien
EP3179839B1 (fr) * 2014-08-08 2020-09-23 FUJI Corporation Procédé de production de substrat et procédé de détermination d'état/d'états de production de substrat
DE102014222936A1 (de) * 2014-11-11 2016-05-12 Siemens Aktiengesellschaft Bestücken von Leiterplatten
DE102014222940A1 (de) * 2014-11-11 2016-05-12 Siemens Aktiengesellschaft Bestücken von Leiterplatten
DE102014225713A1 (de) * 2014-12-12 2016-06-16 Siemens Aktiengesellschaft Verfahren und System zur Bestückung von Leiterplatten sowie Computerprogrammprodukt zur Durchführung des Verfahrens
DE102015200414A1 (de) 2015-01-14 2016-07-14 Siemens Aktiengesellschaft Verfahren und System zur Bestückung von Leiterplatten
DE102015200420A1 (de) * 2015-01-14 2016-07-14 Siemens Aktiengesellschaft Verfahren und System zur Bestückung von Leiterplatten
CN107409491B (zh) * 2015-03-05 2020-04-24 株式会社富士 安装管理装置
DE102015206741A1 (de) * 2015-04-15 2016-10-20 Siemens Aktiengesellschaft Bildung von Rüstfamilien für ein Bearbeitungssystem mit einer Werkzeugmaschine
CN105072813A (zh) * 2015-08-13 2015-11-18 广州杰赛科技股份有限公司 一种印制板组合生产方法
JP6748718B2 (ja) * 2016-07-08 2020-09-02 株式会社Ｆｕｊｉ 生産計画作成システム及び生産計画作成方法
EP3474650B1 (fr) * 2017-10-19 2020-12-09 Sick Ag Procédé d'élaboration d'un ensemble d'adaptation pour une machine de montage de composants
KR102155013B1 (ko) * 2018-02-27 2020-09-14 한화정밀기계 주식회사 다중 pcb를 제작하는 복수 피더 베이스로 구성된 단일 마운터에 대한 피더 배치 방법
US10657297B2 (en) * 2018-06-01 2020-05-19 Mentor Graphics Corporation Part number consolidation in printed circuit board assembly design
EP3897087A4 (fr) * 2018-12-11 2021-12-15 Fuji Corporation Système de montage et procédé d'agencement d'unités d'alimentation de composants
EP4231800A1 (fr) * 2022-02-22 2023-08-23 Siemens Aktiengesellschaft Procédé mis en uvre par ordinateur destiné à la détermination d'une quantité partielle de types de module d'une quantité déterminée de types de module et d'une armure fixe modifiée associée

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4651863A (en) * 1983-08-31 1987-03-24 Westinghouse Electric Corp. System for assembling electronic component kits
JPH0668696B2 (ja) * 1985-02-22 1994-08-31 株式会社日立製作所 挿入機用ｎｃデータ作成方法
US4694570A (en) * 1985-11-21 1987-09-22 Amistar Corporation Surface mounted component transport mechanism
NL8900027A (nl) * 1989-01-06 1990-08-01 Philips Nv Werkwijze en inrichting voor het plaatsen van onderdelen op een drager.

Also Published As

Publication number Publication date
JPH04246897A (ja) 1992-09-02
DE69120887T2 (de) 1996-11-28
KR930007321A (ko) 1993-04-22
EP0478360B1 (fr) 1996-07-17
EP0478360A1 (fr) 1992-04-01
US5170554A (en) 1992-12-15
DE69120887D1 (de) 1996-08-22

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070927