HK32683A - Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silver - Google Patents
Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silverInfo
- Publication number
- HK32683A HK32683A HK326/83A HK32683A HK32683A HK 32683 A HK32683 A HK 32683A HK 326/83 A HK326/83 A HK 326/83A HK 32683 A HK32683 A HK 32683A HK 32683 A HK32683 A HK 32683A
- Authority
- HK
- Hong Kong
- Prior art keywords
- silvering
- concentrates
- silver
- compositions
- conditions
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 150000001875 compounds Chemical class 0.000 title 1
- 239000012141 concentrate Substances 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 239000002360 explosive Substances 0.000 title 1
- 230000002401 inhibitory effect Effects 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
- C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
- C09K15/06—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing oxygen
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/840,840 US4192686A (en) | 1977-10-11 | 1977-10-11 | Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK32683A true HK32683A (en) | 1983-09-02 |
Family
ID=25283364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK326/83A HK32683A (en) | 1977-10-11 | 1983-08-25 | Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silver |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US4192686A (de) |
| JP (1) | JPS5471044A (de) |
| AT (1) | AT363751B (de) |
| AU (1) | AU518234B2 (de) |
| BE (1) | BE870602A (de) |
| BR (1) | BR7806695A (de) |
| CA (1) | CA1097082A (de) |
| DE (2) | DE2858016C2 (de) |
| ES (2) | ES474068A1 (de) |
| FR (1) | FR2405986A1 (de) |
| GB (1) | GB2009721B (de) |
| HK (1) | HK32683A (de) |
| IE (1) | IE47366B1 (de) |
| IN (2) | IN151794B (de) |
| IT (1) | IT1193747B (de) |
| MX (1) | MX151048A (de) |
| SG (1) | SG6583G (de) |
| ZA (1) | ZA785398B (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4798626A (en) * | 1986-09-30 | 1989-01-17 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4925491A (en) * | 1986-09-30 | 1990-05-15 | Lamerie, N.V. | Solutions and creams for silver plating and polishing |
| US4737188A (en) * | 1987-05-18 | 1988-04-12 | London Laboratories Limited | Reducing agent and method for the electroless deposition of silver |
| DE4111189C1 (de) * | 1991-04-06 | 1992-09-17 | Hoechst Ceramtec Ag, 8672 Selb, De | |
| US5302415A (en) * | 1992-12-08 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces and a process for making such surfaces |
| US5419926A (en) * | 1993-11-22 | 1995-05-30 | Lilly London, Inc. | Ammonia-free deposition of copper by disproportionation |
| WO1999064081A1 (en) * | 1998-06-08 | 1999-12-16 | Ferris Corporation | Analgesic and antinociceptive methods |
| US8470066B2 (en) * | 2004-10-29 | 2013-06-25 | Clarkson University | Aqueous-based method for producing ultra-fine metal powders |
| US20060090598A1 (en) * | 2004-11-03 | 2006-05-04 | Goia Dan V | Aqueous-based method for producing ultra-fine silver powders |
| US20060090601A1 (en) * | 2004-11-03 | 2006-05-04 | Goia Dan V | Polyol-based method for producing ultra-fine nickel powders |
| US20060090597A1 (en) * | 2004-10-29 | 2006-05-04 | Goia Dan V | Polyol-based method for producing ultra-fine metal powders |
| IL200772A0 (en) * | 2009-09-07 | 2010-06-30 | J G Systems Inc | A method and composition to repair pinholes and microvoids in immersion silver plated pwb's |
| JP6404553B2 (ja) * | 2013-10-03 | 2018-10-10 | 住友金属鉱山株式会社 | 銀溶液の管理方法および銀粉の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2057756C3 (de) * | 1970-11-19 | 1979-08-16 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Wäßriges alkalisches Bad zur stromlosen Versilberung und dessen Verwendung |
| DE2162338C3 (de) * | 1970-12-16 | 1978-03-09 | London Laboratories Ltd. Co., Woodbridge, Conn. (V.St.A.) | Alkalisches Bad zur stromlosen Abscheidung von metallischem Silber auf einer Oberfläche und Verfahren zur Herstellung der Versilberungslösung |
| US3983266A (en) * | 1974-10-09 | 1976-09-28 | Peacock Laboratories, Inc. | Method for applying metallic silver to a substrate |
-
1977
- 1977-10-11 US US05/840,840 patent/US4192686A/en not_active Expired - Lifetime
-
1978
- 1978-08-22 MX MX174598A patent/MX151048A/es unknown
- 1978-09-15 CA CA311,421A patent/CA1097082A/en not_active Expired
- 1978-09-18 IE IE1882/78A patent/IE47366B1/en not_active IP Right Cessation
- 1978-09-19 AU AU39977/78A patent/AU518234B2/en not_active Expired
- 1978-09-19 BE BE190586A patent/BE870602A/xx not_active IP Right Cessation
- 1978-09-22 ZA ZA00785398A patent/ZA785398B/xx unknown
- 1978-09-26 IN IN1072/CAL/78A patent/IN151794B/en unknown
- 1978-09-28 DE DE2858016A patent/DE2858016C2/de not_active Expired
- 1978-09-28 DE DE2842361A patent/DE2842361C2/de not_active Expired
- 1978-10-04 FR FR7828426A patent/FR2405986A1/fr active Granted
- 1978-10-09 AT AT0724378A patent/AT363751B/de not_active IP Right Cessation
- 1978-10-10 GB GB7839890A patent/GB2009721B/en not_active Expired
- 1978-10-10 BR BR7806695A patent/BR7806695A/pt unknown
- 1978-10-10 ES ES474068A patent/ES474068A1/es not_active Expired
- 1978-10-10 IT IT51435/78A patent/IT1193747B/it active
- 1978-10-11 JP JP12499478A patent/JPS5471044A/ja active Granted
-
1979
- 1979-06-01 ES ES481179A patent/ES481179A1/es not_active Expired
-
1983
- 1983-02-10 SG SG65/83A patent/SG6583G/en unknown
- 1983-03-23 IN IN351/CAL/83A patent/IN155858B/en unknown
- 1983-08-25 HK HK326/83A patent/HK32683A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU518234B2 (en) | 1981-09-17 |
| DE2842361C2 (de) | 1982-09-30 |
| MX151048A (es) | 1984-09-18 |
| DE2842361A1 (de) | 1979-04-19 |
| JPS5471044A (en) | 1979-06-07 |
| CA1097082A (en) | 1981-03-10 |
| SG6583G (en) | 1984-02-17 |
| GB2009721A (en) | 1979-06-20 |
| FR2405986A1 (fr) | 1979-05-11 |
| IT7851435A0 (it) | 1978-10-10 |
| BE870602A (fr) | 1979-01-15 |
| AU3997778A (en) | 1980-03-27 |
| IE781882L (en) | 1979-04-11 |
| ES474068A1 (es) | 1980-03-01 |
| IE47366B1 (en) | 1984-03-07 |
| ES481179A1 (es) | 1980-02-16 |
| JPS5733340B2 (de) | 1982-07-16 |
| IN155858B (de) | 1985-03-16 |
| FR2405986B1 (de) | 1984-01-27 |
| US4192686A (en) | 1980-03-11 |
| ATA724378A (de) | 1981-01-15 |
| AT363751B (de) | 1981-08-25 |
| DE2858016C2 (de) | 1983-11-03 |
| GB2009721B (en) | 1982-08-25 |
| IT1193747B (it) | 1988-08-24 |
| IN151794B (de) | 1983-07-30 |
| ZA785398B (en) | 1979-09-26 |
| BR7806695A (pt) | 1979-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3275105D1 (en) | Method of activating substrate surfaces for electroless metal plating | |
| GB2009721B (en) | Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silver | |
| GB2021648A (en) | Electroless deposition of copper | |
| JPS5490024A (en) | Method of molten immesion zinc plating and alloying | |
| EP0292087A3 (en) | Improved reducing agent and method for the electroless deposition of silver | |
| ZA783894B (en) | Hard facing of metal substrates | |
| IL58202A0 (en) | Method of electroless copper deposition and solutions used therein | |
| GB2081309B (en) | Electroless deposition of gold | |
| US4701350B2 (en) | Process for electroless metal deposition | |
| GB2034756B (en) | Electroless deposition of transition metals | |
| JPS55134191A (en) | Silver or silver alloy plating bath | |
| JPS5421926A (en) | Composite metal plating method of metall diamond | |
| JPS51120926A (en) | Method of depositing noble metals from solution | |
| ZA781667B (en) | Process and device for the production of metal-complex compounds suitable for electroless metal deposition | |
| JPS56150176A (en) | Metal electroless deposition | |
| DE3172330D1 (en) | Hard facing of metal substrates using vc-cr3c2 | |
| AU517472B2 (en) | Precious metal sensitizing compositions for electroless metal deposition | |
| JPS57110688A (en) | High speed silver plating composition and method | |
| JPS5235128A (en) | Method of silver plating | |
| JPS5260869A (en) | Method of electroless copper plating | |
| JPS548125A (en) | Apparatus for adjusting quantity of metal deposition in molten metal plating | |
| IL61270A (en) | Sensitizing solution for electroless metal deposition and their preparation | |
| JPS5245543A (en) | Diffusion method of deposited metal into substrate metal | |
| JPS5481130A (en) | Pretreatment of substrate made of cupperrzinc alloy | |
| JPS5471049A (en) | Precious metal plating method of nickellchromium alloy material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PE | Patent expired |