HK30986A - Plating bath for depositing coatings of gold and gold alloys - Google Patents

Plating bath for depositing coatings of gold and gold alloys

Info

Publication number
HK30986A
HK30986A HK309/86A HK30986A HK30986A HK 30986 A HK30986 A HK 30986A HK 309/86 A HK309/86 A HK 309/86A HK 30986 A HK30986 A HK 30986A HK 30986 A HK30986 A HK 30986A
Authority
HK
Hong Kong
Prior art keywords
gold
bath
acid
potassium
complex
Prior art date
Application number
HK309/86A
Other languages
German (de)
English (en)
French (fr)
Inventor
Wolfgang Dipl. Chem. Zilske
Werner Chem. Ing. Kuhn
Original Assignee
Degussa Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa Aktiengesellschaft filed Critical Degussa Aktiengesellschaft
Publication of HK30986A publication Critical patent/HK30986A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK309/86A 1980-04-03 1986-05-01 Plating bath for depositing coatings of gold and gold alloys HK30986A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3012999A DE3012999C2 (de) 1980-04-03 1980-04-03 Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen

Publications (1)

Publication Number Publication Date
HK30986A true HK30986A (en) 1986-05-09

Family

ID=6099206

Family Applications (1)

Application Number Title Priority Date Filing Date
HK309/86A HK30986A (en) 1980-04-03 1986-05-01 Plating bath for depositing coatings of gold and gold alloys

Country Status (6)

Country Link
US (1) US4391679A (cs)
EP (1) EP0037535B1 (cs)
JP (1) JPS56152989A (cs)
AT (1) ATE6527T1 (cs)
DE (1) DE3012999C2 (cs)
HK (1) HK30986A (cs)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470886A (en) * 1983-01-04 1984-09-11 Omi International Corporation Gold alloy electroplating bath and process
FR2538816A1 (fr) * 1983-01-04 1984-07-06 Omi Int Corp Bain pour former, par electrolyse, un revetement en alliage d'or et procede d'utilisation de ce bain
US4559121A (en) * 1983-09-12 1985-12-17 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization for permeable targets
US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning
US4559125A (en) * 1983-09-12 1985-12-17 Vac-Tec Systems, Inc. Apparatus for evaporation arc stabilization during the initial clean-up of an arc target
CH665656A5 (fr) * 1983-12-29 1988-05-31 Heinz Emmenegger Bain d'or acide et utilisation de ce bain en electroplastie.
DE3505473C1 (de) * 1985-02-16 1986-06-05 Degussa Ag, 6000 Frankfurt Bad zur galvanischen Abscheidung von Gold-Indium-Legierungsueberzuegen
DE3509367C1 (de) * 1985-03-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen
CH680370A5 (cs) * 1989-12-19 1992-08-14 H E Finishing Sa
CA2365749A1 (en) * 2001-12-20 2003-06-20 The Governors Of The University Of Alberta An electrodeposition process and a layered composite material produced thereby
KR20070043936A (ko) * 2004-05-11 2007-04-26 테크닉,인코포레이티드 금-주석 공융 합금용 전기도금액
JP4945193B2 (ja) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 硬質金合金めっき液
JP5317433B2 (ja) 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液
US20090114345A1 (en) * 2007-11-07 2009-05-07 Sumitomo Metal Mining Co., Ltd. Method for manufacturing a substrate for mounting a semiconductor element
DE102011114931B4 (de) 2011-10-06 2013-09-05 Umicore Galvanotechnik Gmbh Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2978390A (en) * 1957-07-22 1961-04-04 Bell Telephone Labor Inc Gold plating solutions
DE1262723B (de) * 1964-12-16 1968-03-07 Philippi & Co K G Galvanisches Gold- oder Goldlegierungsbad
US3598706A (en) * 1967-12-11 1971-08-10 Trifari Krussman And Fishel In Acid gold plating baths
ZA734253B (en) * 1972-07-10 1975-02-26 Degussa Electrolytic bath
US3989800A (en) * 1973-12-26 1976-11-02 Motorola, Inc. Alkali metal gold cyanide method
US4073700A (en) * 1975-03-10 1978-02-14 Weisberg Alfred M Process for producing by electrodeposition bright deposits of gold and its alloys
US4013523A (en) * 1975-12-24 1977-03-22 Oxy Metal Industries Corporation Tin-gold electroplating bath and process
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same

Also Published As

Publication number Publication date
US4391679A (en) 1983-07-05
ATE6527T1 (de) 1984-03-15
EP0037535A3 (en) 1981-11-04
JPH0146597B2 (cs) 1989-10-09
EP0037535A2 (de) 1981-10-14
DE3012999C2 (de) 1984-02-16
JPS56152989A (en) 1981-11-26
EP0037535B1 (de) 1984-03-07
DE3012999A1 (de) 1981-10-15

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Legal Events

Date Code Title Description
PE Patent expired