HK195196A - Low stress encapsulant composition - Google Patents

Low stress encapsulant composition

Info

Publication number
HK195196A
HK195196A HK195196A HK195196A HK195196A HK 195196 A HK195196 A HK 195196A HK 195196 A HK195196 A HK 195196A HK 195196 A HK195196 A HK 195196A HK 195196 A HK195196 A HK 195196A
Authority
HK
Hong Kong
Prior art keywords
low stress
encapsulant composition
stress encapsulant
processable
polyester
Prior art date
Application number
HK195196A
Other languages
English (en)
Inventor
Tsuneyoshi Okada
Toshikatsu Nitoh
Toshio Kanoe
Masato Togami
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of HK195196A publication Critical patent/HK195196A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
HK195196A 1987-09-11 1996-10-24 Low stress encapsulant composition HK195196A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22777687 1987-09-11
JP63022614A JPH0689224B2 (ja) 1987-09-11 1988-02-02 低応力封止材

Publications (1)

Publication Number Publication Date
HK195196A true HK195196A (en) 1996-11-01

Family

ID=26359868

Family Applications (1)

Application Number Title Priority Date Filing Date
HK195196A HK195196A (en) 1987-09-11 1996-10-24 Low stress encapsulant composition

Country Status (7)

Country Link
US (1) US5091135A (ja)
EP (1) EP0307157B1 (ja)
JP (1) JPH0689224B2 (ja)
KR (1) KR910008742B1 (ja)
AT (1) ATE95216T1 (ja)
DE (1) DE3884540T2 (ja)
HK (1) HK195196A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742400B2 (ja) * 1988-09-12 1995-05-10 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
JPH06270175A (ja) * 1991-05-15 1994-09-27 E I Du Pont De Nemours & Co 多段階圧縮成型により熱可塑性シート材料で封入したインサート
EP0566043B1 (en) * 1992-04-14 1999-08-11 Hitachi Chemical Co., Ltd. Method of producing boards for printed wiring
GB2345801B (en) * 1997-08-19 2001-08-08 Taiyo Yuden Kk Wire wound electronic component
US6198373B1 (en) 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
US6803011B2 (en) * 2001-01-26 2004-10-12 Eastman Kodak Company Method for making an injection moldable feedstock which can provide articles with improved physical properties
US6572810B2 (en) * 2001-01-29 2003-06-03 Eastman Kodak Company Method of injection molding articles with improved physical properties
US7077990B2 (en) * 2002-06-26 2006-07-18 Cool Options, Inc. High-density, thermally-conductive plastic compositions for encapsulating motors
US7045586B2 (en) * 2003-08-14 2006-05-16 Dow Corning Corporation Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
US20050038188A1 (en) 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
JP3913728B2 (ja) * 2003-11-05 2007-05-09 ポリプラスチックス株式会社 熱可塑性樹脂組成物及びその射出成形体
EP1775735B1 (en) * 2005-10-14 2010-05-26 Abb Research Ltd. Electrical insulation system based on poly (butylene terephthalate)
JP7295111B2 (ja) * 2017-12-05 2023-06-20 ティコナ・エルエルシー 液晶ポリマー組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US941003A (en) * 1909-01-20 1909-11-23 George A Anderson Mechanical movement.
ZA807105B (en) * 1979-11-30 1981-07-29 Ici Ltd Compositions of melt-processable processability
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS5981328A (ja) * 1982-10-30 1984-05-11 Nitto Electric Ind Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6040163A (ja) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション 電子部品の改良封入成形法
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
US4818812A (en) * 1983-08-22 1989-04-04 International Business Machines Corporation Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
JPS6155148A (ja) * 1984-08-27 1986-03-19 Kureha Chem Ind Co Ltd 電子部品封止用組成物およびその利用
JPS6169866A (ja) * 1984-09-12 1986-04-10 Polyplastics Co 複合材料組成物
JPS6190343A (ja) * 1984-10-09 1986-05-08 Polyplastics Co 光ディスク
JPS61185527A (ja) * 1985-02-13 1986-08-19 Toray Silicone Co Ltd 硬化性エポキシ樹脂組成物
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JPS6245660A (ja) * 1985-08-26 1987-02-27 Polyplastics Co 複合材料組成物
JPS6250325A (ja) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd 電子部品封止用エポキシ成形材料
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
JPS62100577A (ja) * 1985-10-28 1987-05-11 Polyplastics Co 熱伝導性組成物
JPS62101649A (ja) * 1985-10-30 1987-05-12 Hitachi Chem Co Ltd 半導体封止用熱硬化性樹脂組成物
JPH075836B2 (ja) * 1986-02-24 1995-01-25 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物

Also Published As

Publication number Publication date
JPH01163257A (ja) 1989-06-27
ATE95216T1 (de) 1993-10-15
KR910008742B1 (ko) 1991-10-19
EP0307157A2 (en) 1989-03-15
EP0307157B1 (en) 1993-09-29
JPH0689224B2 (ja) 1994-11-09
DE3884540D1 (de) 1993-11-04
DE3884540T2 (de) 1994-01-27
EP0307157A3 (en) 1990-02-07
KR890005862A (ko) 1989-05-17
US5091135A (en) 1992-02-25

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Legal Events

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PF Patent in force
PE Patent expired

Effective date: 20080904