ATE95216T1 - Einbettungszusammensetzung mit niedriger spannung. - Google Patents

Einbettungszusammensetzung mit niedriger spannung.

Info

Publication number
ATE95216T1
ATE95216T1 AT88308211T AT88308211T ATE95216T1 AT E95216 T1 ATE95216 T1 AT E95216T1 AT 88308211 T AT88308211 T AT 88308211T AT 88308211 T AT88308211 T AT 88308211T AT E95216 T1 ATE95216 T1 AT E95216T1
Authority
AT
Austria
Prior art keywords
bottling
composition
low voltage
processable
polyester
Prior art date
Application number
AT88308211T
Other languages
English (en)
Inventor
Tsuneyoshi Okada
Toshikatsu Nitoh
Toshio Kanoe
Masato Togami
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Application granted granted Critical
Publication of ATE95216T1 publication Critical patent/ATE95216T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Credit Cards Or The Like (AREA)
AT88308211T 1987-09-11 1988-09-05 Einbettungszusammensetzung mit niedriger spannung. ATE95216T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP22777687 1987-09-11
JP63022614A JPH0689224B2 (ja) 1987-09-11 1988-02-02 低応力封止材
EP88308211A EP0307157B1 (de) 1987-09-11 1988-09-05 Einbettungszusammensetzung mit niedriger Spannung

Publications (1)

Publication Number Publication Date
ATE95216T1 true ATE95216T1 (de) 1993-10-15

Family

ID=26359868

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88308211T ATE95216T1 (de) 1987-09-11 1988-09-05 Einbettungszusammensetzung mit niedriger spannung.

Country Status (7)

Country Link
US (1) US5091135A (de)
EP (1) EP0307157B1 (de)
JP (1) JPH0689224B2 (de)
KR (1) KR910008742B1 (de)
AT (1) ATE95216T1 (de)
DE (1) DE3884540T2 (de)
HK (1) HK195196A (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742400B2 (ja) * 1988-09-12 1995-05-10 ポリプラスチックス株式会社 液晶性ポリエステル樹脂組成物
JPH06270175A (ja) * 1991-05-15 1994-09-27 E I Du Pont De Nemours & Co 多段階圧縮成型により熱可塑性シート材料で封入したインサート
DE69325936T2 (de) * 1992-04-14 2000-03-30 Hitachi Chemical Co Ltd Verfahren zur Herstellung von Platten für gedruckte Schaltungen
US6198373B1 (en) 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
GB2345803B (en) * 1997-08-19 2001-06-20 Taiyo Yuden Kk Wire wound electronic component
US6803011B2 (en) * 2001-01-26 2004-10-12 Eastman Kodak Company Method for making an injection moldable feedstock which can provide articles with improved physical properties
US6572810B2 (en) * 2001-01-29 2003-06-03 Eastman Kodak Company Method of injection molding articles with improved physical properties
US7077990B2 (en) * 2002-06-26 2006-07-18 Cool Options, Inc. High-density, thermally-conductive plastic compositions for encapsulating motors
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
US7045586B2 (en) * 2003-08-14 2006-05-16 Dow Corning Corporation Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
US20050038188A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
JP3913728B2 (ja) * 2003-11-05 2007-05-09 ポリプラスチックス株式会社 熱可塑性樹脂組成物及びその射出成形体
DE602005021498D1 (de) * 2005-10-14 2010-07-08 Abb Research Ltd Elektrische Isolierungsanordnung auf Basis von Polybutylenterephtalat
JP7295111B2 (ja) * 2017-12-05 2023-06-20 ティコナ・エルエルシー 液晶ポリマー組成物

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US941003A (en) * 1909-01-20 1909-11-23 George A Anderson Mechanical movement.
ZA807105B (en) * 1979-11-30 1981-07-29 Ici Ltd Compositions of melt-processable processability
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS5981328A (ja) * 1982-10-30 1984-05-11 Nitto Electric Ind Co Ltd 半導体封止用エポキシ樹脂組成物
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
JPS6040163A (ja) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション 電子部品の改良封入成形法
US4818812A (en) * 1983-08-22 1989-04-04 International Business Machines Corporation Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
JPS6155148A (ja) * 1984-08-27 1986-03-19 Kureha Chem Ind Co Ltd 電子部品封止用組成物およびその利用
JPS6169866A (ja) * 1984-09-12 1986-04-10 Polyplastics Co 複合材料組成物
JPS6190343A (ja) * 1984-10-09 1986-05-08 Polyplastics Co 光ディスク
JPS61185527A (ja) * 1985-02-13 1986-08-19 Toray Silicone Co Ltd 硬化性エポキシ樹脂組成物
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JPS6245660A (ja) * 1985-08-26 1987-02-27 Polyplastics Co 複合材料組成物
JPS6250325A (ja) * 1985-08-29 1987-03-05 Hitachi Chem Co Ltd 電子部品封止用エポキシ成形材料
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
JPS62100577A (ja) * 1985-10-28 1987-05-11 Polyplastics Co 熱伝導性組成物
JPS62101649A (ja) * 1985-10-30 1987-05-12 Hitachi Chem Co Ltd 半導体封止用熱硬化性樹脂組成物
JPH075836B2 (ja) * 1986-02-24 1995-01-25 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物

Also Published As

Publication number Publication date
EP0307157B1 (de) 1993-09-29
EP0307157A2 (de) 1989-03-15
KR910008742B1 (ko) 1991-10-19
DE3884540T2 (de) 1994-01-27
US5091135A (en) 1992-02-25
EP0307157A3 (en) 1990-02-07
JPH0689224B2 (ja) 1994-11-09
HK195196A (en) 1996-11-01
JPH01163257A (ja) 1989-06-27
KR890005862A (ko) 1989-05-17
DE3884540D1 (de) 1993-11-04

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties