HK1213221A1 - 銀粉 - Google Patents

銀粉

Info

Publication number
HK1213221A1
HK1213221A1 HK16101139.2A HK16101139A HK1213221A1 HK 1213221 A1 HK1213221 A1 HK 1213221A1 HK 16101139 A HK16101139 A HK 16101139A HK 1213221 A1 HK1213221 A1 HK 1213221A1
Authority
HK
Hong Kong
Prior art keywords
silver powder
silver
powder
Prior art date
Application number
HK16101139.2A
Other languages
English (en)
Inventor
川上裕二
村上明弘
寺尾俊昭
金子勲
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of HK1213221A1 publication Critical patent/HK1213221A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/148—Agglomerating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
HK16101139.2A 2012-12-05 2016-02-01 銀粉 HK1213221A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012266627A JP5500237B1 (ja) 2012-12-05 2012-12-05 銀粉
PCT/JP2013/076817 WO2014087728A1 (ja) 2012-12-05 2013-10-02 銀粉

Publications (1)

Publication Number Publication Date
HK1213221A1 true HK1213221A1 (zh) 2016-06-30

Family

ID=50883158

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101139.2A HK1213221A1 (zh) 2012-12-05 2016-02-01 銀粉

Country Status (6)

Country Link
US (1) US9937555B2 (zh)
JP (1) JP5500237B1 (zh)
KR (1) KR20150093177A (zh)
CN (1) CN105008070B (zh)
HK (1) HK1213221A1 (zh)
WO (1) WO2014087728A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017057301A1 (ja) * 2015-09-30 2017-04-06 住友電気工業株式会社 導電層形成用塗布液及び導電層の製造方法
US11081253B2 (en) * 2016-11-08 2021-08-03 Dowa Electronics Materials Co., Ltd. Silver particle dispersing solution, method for producing same, and method for producing conductive film using silver particle dispersing solution
WO2020137330A1 (ja) * 2018-12-26 2020-07-02 昭栄化学工業株式会社 銀ペースト

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3751154B2 (ja) 1998-10-22 2006-03-01 同和鉱業株式会社 銀粉の製造方法
JP4109520B2 (ja) 2002-09-12 2008-07-02 三井金属鉱業株式会社 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト
JP3991218B2 (ja) 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP4078990B2 (ja) * 2003-01-23 2008-04-23 松下電器産業株式会社 導電性ペースト、その導電性ペーストを用いた回路形成基板、およびその製造方法
TWI325739B (en) * 2003-01-23 2010-06-01 Panasonic Corp Electroconductive paste, its manufacturing method, circuit board using the same electroconductive paste, and its manufacturing method
WO2005031760A1 (ja) * 2003-09-26 2005-04-07 Hitachi Chemical Co., Ltd. 混合導電粉およびその利用
JP4606012B2 (ja) 2003-11-14 2011-01-05 三井金属鉱業株式会社 銀ペースト
DE112007001519B4 (de) * 2006-06-22 2022-03-10 Mitsubishi Paper Mills Limited Verfahren zum Herstellen eines leitfähigen Materials
ES2355376T3 (es) * 2007-08-31 2011-03-25 Metalor Technologies International S.A. Procedimiento para preparar nanopartículas de plata.
JP2010053409A (ja) * 2008-08-28 2010-03-11 Sumitomo Electric Ind Ltd 金属粉末の製造方法および金属粉末、導電性ペースト、積層セラミックコンデンサ
JP5568255B2 (ja) * 2009-06-17 2014-08-06 住友金属鉱山株式会社 銀粉及びその製造方法
TWI574761B (zh) * 2011-06-08 2017-03-21 Sumitomo Metal Mining Co Silver powder and its manufacturing method
CN103079729B (zh) * 2011-06-21 2015-06-17 住友金属矿山株式会社 银粉及其制造方法
JP5842548B2 (ja) * 2011-11-07 2016-01-13 住友金属鉱山株式会社 銀粉の製造方法
WO2013073607A1 (ja) * 2011-11-18 2013-05-23 住友金属鉱山株式会社 銀粉、銀粉の製造方法及び導電性ペースト

Also Published As

Publication number Publication date
US20150314370A1 (en) 2015-11-05
JP5500237B1 (ja) 2014-05-21
CN105008070A (zh) 2015-10-28
WO2014087728A1 (ja) 2014-06-12
CN105008070B (zh) 2017-05-24
US9937555B2 (en) 2018-04-10
JP2014111812A (ja) 2014-06-19
KR20150093177A (ko) 2015-08-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20211007