HK1203667A1 - Air conditioning system - Google Patents

Air conditioning system

Info

Publication number
HK1203667A1
HK1203667A1 HK15104184.1A HK15104184A HK1203667A1 HK 1203667 A1 HK1203667 A1 HK 1203667A1 HK 15104184 A HK15104184 A HK 15104184A HK 1203667 A1 HK1203667 A1 HK 1203667A1
Authority
HK
Hong Kong
Prior art keywords
air conditioning
conditioning system
air
conditioning
Prior art date
Application number
HK15104184.1A
Other languages
English (en)
Chinese (zh)
Inventor
大木淳
山口祥
Original Assignee
Gac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gac Corp filed Critical Gac Corp
Publication of HK1203667A1 publication Critical patent/HK1203667A1/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/2079Liquid cooling without phase change within rooms for removing heat from cabinets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/0001Control or safety arrangements for ventilation
    • F24F2011/0006Control or safety arrangements for ventilation using low temperature external supply air to assist cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air Conditioning Control Device (AREA)
  • Ventilation (AREA)
HK15104184.1A 2012-09-14 2015-04-30 Air conditioning system HK1203667A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012203230 2012-09-14
PCT/JP2013/005452 WO2014041819A1 (ja) 2012-09-14 2013-09-13 空調システム

Publications (1)

Publication Number Publication Date
HK1203667A1 true HK1203667A1 (en) 2015-10-30

Family

ID=50277959

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104184.1A HK1203667A1 (en) 2012-09-14 2015-04-30 Air conditioning system

Country Status (8)

Country Link
US (1) US20150181769A1 (ja)
EP (1) EP2811366A4 (ja)
JP (1) JPWO2014041819A1 (ja)
CN (1) CN104254814A (ja)
HK (1) HK1203667A1 (ja)
SG (1) SG11201405389VA (ja)
TW (1) TW201411064A (ja)
WO (1) WO2014041819A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2803813B1 (en) * 2013-05-16 2019-02-27 ABB Schweiz AG A subsea unit with conduction and convection cooling
JP2016001096A (ja) * 2014-06-12 2016-01-07 日比谷総合設備株式会社 サーバー室内の空調の効率化構造
US10191499B2 (en) 2014-07-02 2019-01-29 Microsoft Technology Licensing, Llc Gas distribution system within temperature differentiated environments
JP6737774B2 (ja) * 2015-04-01 2020-08-12 日本電気株式会社 相変化冷却装置およびその制御方法
CN104991624B (zh) * 2015-08-07 2016-09-07 国网山东省电力公司日照供电公司 一种使用气动控制的用于网络服务器的柜式计算机装置
CN105068624B (zh) * 2015-08-07 2016-08-17 青岛信带通网络科技有限公司 一种安装有电磁装置且用作网络服务器的柜式计算机装置
SG11202001381UA (en) * 2017-07-14 2020-03-30 Inertech Ip Llc Modular air cooling and distribution systems and methods
JP2020021386A (ja) * 2018-08-03 2020-02-06 清水建設株式会社 サーバ室用空調システムおよびデータセンター
JP2020087080A (ja) * 2018-11-28 2020-06-04 日比谷総合設備株式会社 データセンターの空調の効率化構造
JP7306250B2 (ja) * 2019-12-11 2023-07-11 富士通株式会社 基地局及び装置冷却方法
US11236754B2 (en) * 2020-03-02 2022-02-01 Baidu Usa Llc Universal fan system and configuration method
WO2022034673A1 (en) * 2020-08-13 2022-02-17 Nec Corporation System, method, and non-transitory computer readable storage medium
CN112952617B (zh) * 2021-03-15 2022-08-05 国网河北省电力有限公司电力科学研究院 双模配电线路自动化终端
DE102021126550A1 (de) * 2021-10-13 2023-04-13 Rittal Gmbh & Co. Kg Rechenzentrum mit einer in einem Container angeordneten Schaltschankreihe und einer Kaltgang-Warmgang-Schottung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6938433B2 (en) * 2002-08-02 2005-09-06 Hewlett-Packard Development Company, Lp. Cooling system with evaporators distributed in series
US6786056B2 (en) * 2002-08-02 2004-09-07 Hewlett-Packard Development Company, L.P. Cooling system with evaporators distributed in parallel
WO2005001349A1 (ja) * 2003-06-27 2005-01-06 Gac Corporation ダクトシステムおよび収納装置
JP5308750B2 (ja) * 2008-03-26 2013-10-09 株式会社Nttファシリティーズ ラック空調システム
WO2009123617A1 (en) * 2008-04-01 2009-10-08 Hewlett-Packard Development Company, L.P. Management system operable under multiple metric levels
WO2010039120A1 (en) * 2008-09-30 2010-04-08 Hewlett-Packard Development Company, L.P. Data center
EP2354378A1 (en) * 2010-02-01 2011-08-10 Dataxenter IP B.V. Modular datacenter element and modular datacenter cooling element
US20110259573A1 (en) * 2010-04-26 2011-10-27 Gac Corporation Cooling system
JP5194321B2 (ja) * 2010-05-10 2013-05-08 中央電子株式会社 電子機器収納ラック群の冷却装置、システム及び方法
JP5579518B2 (ja) * 2010-07-16 2014-08-27 大成建設株式会社 空調システム
JP5680914B2 (ja) * 2010-09-09 2015-03-04 新日鉄住金エンジニアリング株式会社 冷却システム
JP5535872B2 (ja) * 2010-10-29 2014-07-02 株式会社日立製作所 データセンタ又は計算機システム
JP5682025B2 (ja) * 2010-10-29 2015-03-11 清水建設株式会社 サーバ室ユニットおよびユニット型データセンター

Also Published As

Publication number Publication date
EP2811366A4 (en) 2016-09-28
SG11201405389VA (en) 2014-11-27
JPWO2014041819A1 (ja) 2016-08-18
US20150181769A1 (en) 2015-06-25
CN104254814A (zh) 2014-12-31
WO2014041819A1 (ja) 2014-03-20
TW201411064A (zh) 2014-03-16
EP2811366A1 (en) 2014-12-10

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