HK1200950A1 - 卡、卡的製造方法 - Google Patents

卡、卡的製造方法

Info

Publication number
HK1200950A1
HK1200950A1 HK15101336.4A HK15101336A HK1200950A1 HK 1200950 A1 HK1200950 A1 HK 1200950A1 HK 15101336 A HK15101336 A HK 15101336A HK 1200950 A1 HK1200950 A1 HK 1200950A1
Authority
HK
Hong Kong
Prior art keywords
card
production method
card production
production
Prior art date
Application number
HK15101336.4A
Other languages
English (en)
Inventor
Kazuya Tsuruta
Tatsunosuke Ogawa
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of HK1200950A1 publication Critical patent/HK1200950A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24752—Laterally noncoextensive components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Printing Methods (AREA)
HK15101336.4A 2012-03-22 2015-02-06 卡、卡的製造方法 HK1200950A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012065276 2012-03-22
PCT/JP2013/058421 WO2013141384A1 (ja) 2012-03-22 2013-03-22 カード、カードの製造方法

Publications (1)

Publication Number Publication Date
HK1200950A1 true HK1200950A1 (zh) 2015-08-14

Family

ID=49222832

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15101336.4A HK1200950A1 (zh) 2012-03-22 2015-02-06 卡、卡的製造方法

Country Status (9)

Country Link
US (1) US9990575B2 (zh)
EP (1) EP2830005B1 (zh)
JP (1) JP5884895B2 (zh)
KR (1) KR101640700B1 (zh)
CN (1) CN104145280B (zh)
HK (1) HK1200950A1 (zh)
MY (1) MY187730A (zh)
SG (1) SG11201405887RA (zh)
WO (1) WO2013141384A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6184337B2 (ja) * 2014-01-31 2017-08-23 共同印刷株式会社 Ｉｃカード及びその製造方法
EP3109799B1 (fr) * 2015-04-15 2018-10-17 Maintag Procede de fabrication d'une etiquette multicouche de type rfid, etiquette multicouche rfid et son utilisation
CN105184350B (zh) * 2015-07-29 2018-07-24 飞天诚信科技股份有限公司 一种智能卡及其制造方法
JP6917832B2 (ja) * 2017-08-25 2021-08-11 共同印刷株式会社 カード
CN114161802A (zh) * 2021-12-17 2022-03-11 苏州奥美材料科技有限公司 一种复合证卡膜及其制备方法和应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2684778B2 (ja) * 1989-03-16 1997-12-03 東レ株式会社 積層体
JPH08310172A (ja) * 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
JP4545901B2 (ja) * 2000-08-25 2010-09-15 共同印刷株式会社 非接触ｉｃカードの製造方法
US6851617B2 (en) * 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
JP4066929B2 (ja) 2003-10-08 2008-03-26 株式会社日立製作所 電子装置及びその製造方法
JP4804198B2 (ja) 2006-03-31 2011-11-02 共同印刷株式会社 非接触ｉｃカード
CN101405215B (zh) * 2006-05-18 2013-01-09 株式会社半导体能源研究所 微结构、微机械、以及微结构和微机械的制造方法
JP5136049B2 (ja) * 2007-12-27 2013-02-06 凸版印刷株式会社 非接触ｉｃカードの製造方法
JP2011095963A (ja) * 2009-10-29 2011-05-12 Toppan Printing Co Ltd Ｉｃタグ付き積層体

Also Published As

Publication number Publication date
JP5884895B2 (ja) 2016-03-15
SG11201405887RA (en) 2014-11-27
CN104145280A (zh) 2014-11-12
JPWO2013141384A1 (ja) 2015-08-03
WO2013141384A1 (ja) 2013-09-26
KR20140116222A (ko) 2014-10-01
EP2830005B1 (en) 2020-07-01
EP2830005A1 (en) 2015-01-28
EP2830005A4 (en) 2015-11-18
US9990575B2 (en) 2018-06-05
KR101640700B1 (ko) 2016-07-18
CN104145280B (zh) 2017-05-17
US20150109741A1 (en) 2015-04-23
MY187730A (en) 2021-10-15

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